An excess heat exposure indicator and methods for making the same are disclosed. The excess heat exposure indicator includes a print media substrate comprising an indicator region, a data region, at least one first thermochromic composition is provided on the substrate within the indicator region of the substrate, a second thermochromic composition is provided on the substrate within the data region, the second thermochromic composition configured to change color state from a third color state to a fourth color state when heated above a second temperature threshold, the indicator region is configured to be selectively treated with heat above the first temperature threshold to place a first portion of the indicator region in the second color state, different than the first color state, forming a visible indicia, the visible indicia configured to change appearance when the indicator region is subsequently exposed to a temperature above the first temperature threshold.

An object of the present invention is to provide a temperature sensing material that changes a color density continuously with the lapse of time at a temperature not lower or higher than a predetermined temperature and a temperature deviation time estimating system using it. In order to achieve the above object, the temperature sensing material according to the present invention is a temperature sensing material having a structure of dispersing a temperature indicating material that changes color by crystallization in a dispersion medium and is characterized in that an average particle size of the temperature indicating material is not larger than a resolution when observed and a volume fraction of the temperature indicating material to the temperature sensing material is not less than 5% to less than 90%.

A semiconductor device comprises a control unit, a semiconductor memory, a reference capacitance unit, a determination capacitance unit, a calibration circuit configured to supply a selection signal to the reference capacitance unit to selectively connect capacitors to differing potentials, and a determination circuit configured to charge a capacitance of the reference capacitance unit, to charge a capacitance of the determination capacitance unit, and to attain a comparison result by comparing the differing potentials. The control unit is configured to control rewriting of the semiconductor memory on the basis of a determination result of the determination circuit.

A method for management of perishable goods handling, including using a hardware processor for reading and/or recognition and/or monitoring at least one of color change, appearance/disappearance of at least a segment, variation in at least one of pattern, shape and/or size of at least a portion of an indication window of at least one TTI affixed to at least one item of perishable goods, thereby to obtain a TTI reading, and for processing that reading including generating and outputting at least one perishable goods handling command, responsive to at least the TTI reading.

A method for management of perishable goods handling, including using a hardware processor for reading and/or recognition and/or monitoring at least one of color change, appearance/disappearance of at least a segment, variation in at least one of pattern, shape and/or size of at least a portion of an indication window of at least one TTI affixed to at least one item of perishable goods, thereby to obtain a TTI reading, and for processing that reading including generating and outputting at least one perishable goods handling command, responsive to at least the TTI reading.

An electronic device is provided, including a display panel and a processor. The processor is coupled to the display panel, and is configured to calculate an average temperature of the display panel, where when the average temperature is greater than a first temperature threshold, the processor adjusts an upper brightness limit of the display panel to a first adjusted maximum brightness value, so that brightness of the display panel is not greater than the first adjusted maximum brightness value. The disclosure further provides a display panel control method for an electronic device.

The present invention relates to the time-temperature indicating module which allows the user to trigger the bursting of the starting member with a simple motion and generate a crack so that the spread material interposed inside spreads via the crack. The present invention also relates to the manufacturing method of the time-temperature indicating module that strengthens a sealed section of the time-temperature indicating module using laminating by heat sealing to prevent the spread material from leaking or flowing out.

The present invention relates to the time-temperature indicating module which allows the user to trigger the bursting of the starting member with a simple motion and generate a crack so that the spread material interposed inside spreads via the crack. The present invention also relates to the manufacturing method of the time-temperature indicating module that strengthens a sealed section of the time-temperature indicating module using laminating by heat sealing to prevent the spread material from leaking or flowing out.

A customizable temperature exposure indicator and methods for making the same are disclosed. The temperature exposure indicator includes a substrate, a printing region of the substrate forming a heat sensitive media that is configured to darken when it is heated by a thermal printhead, the darkening being permanent with respect to subsequent cooling of the media; at least one memory thermochromic composition provided on an indicator region of the substrate, the thermochromic composition is configured to have high temperature color state when it is heated above a high temperature threshold, and to remain in the high temperature color state until it is cooled below a low temperature threshold, the thermochromic composition is configured to have a low temperature color state when it is cooled below the low temperature threshold and to maintain the low temperature threshold until it is heated above the high temperature threshold.

An electronic component includes a substrate comprising a die attach region and a perimeter region on a front side of the substrate; and at least one thermal indicator disposed within the perimeter region for monitoring the cumulative heat exposure of the substrate. The thermal indicator signals when the predetermined thermal budget limit that correlates with the decline in the condition of the OSP layer or the degradation of the adhesion of the die attach films is reached.