Patent classifications
G01K3/14
Surface mount temperature measurement
A temperature sensor assembly for measuring a gas temperature in a gas flow stream includes a first substrate having a first surface configured to be connected to a thermally conductive structure in a gas path, a first temperature sensor mounted to the first substrate a first distance from the first surface, and a second temperature sensor mounted to the first substrate a second distance from the first surface. The second distance is less than the first distance. The first and second temperature sensors are arranged along a temperature gradient.
Track system comprising a sensor and vehicle comprising the same
A track system for a rubber tracked work vehicle comprises temperature sensor and an antenna attached to a track wheel. The antenna is connected to the temperature sensor to transmit to a receiver a temperature signal generated by the temperature sensor. A work vehicle comprising the track system and a temperature measuring method are also disclosed.
Track system comprising a sensor and vehicle comprising the same
A track system for a rubber tracked work vehicle comprises temperature sensor and an antenna attached to a track wheel. The antenna is connected to the temperature sensor to transmit to a receiver a temperature signal generated by the temperature sensor. A work vehicle comprising the track system and a temperature measuring method are also disclosed.
Dynamic temperature compensation of a thermostat for an evaporative cooler system
The disclosure is directed to techniques for a thermostat to determine the air temperature of a room based on measurements of temperatures sensors located inside a housing of the thermostat. Because the thermostat for an evaporative cooler operates at line voltage and controls current flowing to the evaporative cooler, the magnitude of current flowing through the thermostat may vary from nearly zero, when the thermostat is in the powered-off state, to a current on the order of several amps. The variation in current causes a variation in temperature inside the housing of the thermostat. The techniques of this disclosure compensate for changes the internal housing temperature caused by changes in operating mode. The compensation allows the temperature sensors inside the thermostat housing to determine the air temperature of the room in which the thermostat is located, without regard for the operating mode of the evaporative cooler system.
Dynamic temperature compensation of a thermostat for an evaporative cooler system
The disclosure is directed to techniques for a thermostat to determine the air temperature of a room based on measurements of temperatures sensors located inside a housing of the thermostat. Because the thermostat for an evaporative cooler operates at line voltage and controls current flowing to the evaporative cooler, the magnitude of current flowing through the thermostat may vary from nearly zero, when the thermostat is in the powered-off state, to a current on the order of several amps. The variation in current causes a variation in temperature inside the housing of the thermostat. The techniques of this disclosure compensate for changes the internal housing temperature caused by changes in operating mode. The compensation allows the temperature sensors inside the thermostat housing to determine the air temperature of the room in which the thermostat is located, without regard for the operating mode of the evaporative cooler system.
FIBER STRUCTURES WITH EMBEDDED SENSORS
Methods of fabricating fiber structures with embedded sensors are provided. The method includes obtaining a scaffold fiber and forming, by 1½-D printing using laser induced chemical vapor deposition, circuitry on the scaffold fiber to provide a fiber structure with embedded sensor. The forming includes printing a solid state oscillator about the scaffold fiber, and printing a sensing device about the scaffold fiber electrically coupled to the solid state oscillator to effect, at least in part, oscillations of the solid state oscillator. The forming further includes printing an antenna about the scaffold fiber electrically connected to the solid state oscillator to facilitate in operation wireless transmitting of a signal from the fiber structure with embedded sensor.
FIBER STRUCTURES WITH EMBEDDED SENSORS
Methods of fabricating fiber structures with embedded sensors are provided. The method includes obtaining a scaffold fiber and forming, by 1½-D printing using laser induced chemical vapor deposition, circuitry on the scaffold fiber to provide a fiber structure with embedded sensor. The forming includes printing a solid state oscillator about the scaffold fiber, and printing a sensing device about the scaffold fiber electrically coupled to the solid state oscillator to effect, at least in part, oscillations of the solid state oscillator. The forming further includes printing an antenna about the scaffold fiber electrically connected to the solid state oscillator to facilitate in operation wireless transmitting of a signal from the fiber structure with embedded sensor.
Clock instantaneous temperature-rate-of-change measurement
Techniques described herein address these and other issues by utilizing two or more sensors to take temperature measurements from which a temperature-differential or instantaneous temperature rate-of-change, can be determined. In turn, this can be used to make a highly accurate model of the relationship between the temperature, temperature-differential, and clock circuitry frequency, to accurately estimate the frequency rate-of-change for frequency correction/compensation.
WIRELESS MULTI-POINT FOOD THERMOMETER
One or more implementations of the present disclosure relate to a wireless, multi-sensor food thermometer that includes a temperature probe having a linear array of temperature sensors that are operative to measure: temperature profiles within a food product during a cooking process, a temperature at a core of the food product, a temperature at the surface of the food product, and a temperature of the ambient cooking environment in which the food is being cooked. The temperature probe includes a wireless interface that transmits temperature information to one or more external devices for use thereby. Rather than transmitting raw temperature data, the temperature probe may transmit coefficients that correspond to a function that describes the temperature profile within the food or parameters necessary to solve a governing heat equation, which reduces data transmission requirements and reduces power consumption. The food thermometer may include a charger case that houses the temperature probe and charges a power source of the temperature probe using a replaceable battery.
WIRELESS MULTI-POINT FOOD THERMOMETER
One or more implementations of the present disclosure relate to a wireless, multi-sensor food thermometer that includes a temperature probe having a linear array of temperature sensors that are operative to measure: temperature profiles within a food product during a cooking process, a temperature at a core of the food product, a temperature at the surface of the food product, and a temperature of the ambient cooking environment in which the food is being cooked. The temperature probe includes a wireless interface that transmits temperature information to one or more external devices for use thereby. Rather than transmitting raw temperature data, the temperature probe may transmit coefficients that correspond to a function that describes the temperature profile within the food or parameters necessary to solve a governing heat equation, which reduces data transmission requirements and reduces power consumption. The food thermometer may include a charger case that houses the temperature probe and charges a power source of the temperature probe using a replaceable battery.