A stress distribution measurement method is a method of measuring stress distribution generated on a structural object including two support parts and a beam part provided between the support parts. The method includes: generating first image data by performing, through a first image capturing unit, image capturing of a moving object or an identification display object attached to the structural object from the moving object; calculating, based on the first image data, a movement duration in which the moving object moves between the support parts; generating, as second image data, thermal image data by performing image capturing of the surface of the beam part through a second image capturing unit; calculating a temperature change amount based on a second image data group corresponding to the movement duration; and calculating a stress change amount based on the temperature change amount to calculate stress distribution based on the stress change amount.

Passive radio frequency identification (RFID) real-time temperature sensors based on programmable liquid crystal elastomers (LCEs) are provided. The sensors can be used for monitoring the temperature for various items, including perishable goods, foods, and medicines in the cold supply chain. The sensors can convey changes in temperature through a controlled shift of the operating frequency in the RFID ultra high frequency (UHF) band.

Passive radio frequency identification (RFID) real-time temperature sensors based on programmable liquid crystal elastomers (LCEs) are provided. The sensors can be used for monitoring the temperature for various items, including perishable goods, foods, and medicines in the cold supply chain. The sensors can convey changes in temperature through a controlled shift of the operating frequency in the RFID ultra high frequency (UHF) band.

An apparatus for measuring a temperature of a power device using a piezoelectric device according to an exemplary embodiment of the present disclosure includes: a substrate; at least one power device formed on one surface of the substrate; and at least one piezoelectric device disposed on the substrate as spaced from the power device and configured to measure a thermal stress generated on the substrate to sense a temperature caused by heat generation of the power device.

An apparatus for measuring a temperature of a power device using a piezoelectric device according to an exemplary embodiment of the present disclosure includes: a substrate; at least one power device formed on one surface of the substrate; and at least one piezoelectric device disposed on the substrate as spaced from the power device and configured to measure a thermal stress generated on the substrate to sense a temperature caused by heat generation of the power device.

A method is disclosed for measuring stress distribution generated on a structural object including two support parts and a beam part provided between the support parts. The method includes: generating first data by sensing, through a first sensing unit, of a moving object or an identification display object attached to the structural object; calculating, based on the first data, a movement duration in which the moving object moves between the support parts; generating, as second data, thermal data by sensing of a surface of the beam part through a second sensing unit; calculating a temperature change amount based on a second data group corresponding to the movement duration; and calculating a stress change amount based on the temperature change amount to calculate stress distribution based on the stress change amount.

A method is disclosed for measuring stress distribution generated on a structural object including two support parts and a beam part provided between the support parts. The method includes: generating first data by sensing, through a first sensing unit, of a moving object or an identification display object attached to the structural object; calculating, based on the first data, a movement duration in which the moving object moves between the support parts; generating, as second data, thermal data by sensing of a surface of the beam part through a second sensing unit; calculating a temperature change amount based on a second data group corresponding to the movement duration; and calculating a stress change amount based on the temperature change amount to calculate stress distribution based on the stress change amount.

Sensors, systems, and methods for monitoring environmental conditions, such as physical, electromagnetic, thermal, and/or chemical parameters within an environment, over extended periods of time with the use of one or more electromechanical sensing devices and electronic circuitry for processing an output of the sensing devices. The sensing devices each include a cantilevered structure and at least one contact configured for contact-mode operation with the cantilevered structure in response to the cantilevered structure deflecting toward or away from the contact when exposed to the parameter of interest. The cantilevered structure has at least first and second beams of dissimilar materials, at least one of which has at least one property that changes as a result of exposure to the parameter.

Sensors, systems, and methods for monitoring environmental conditions, such as physical, electromagnetic, thermal, and/or chemical parameters within an environment, over extended periods of time with the use of one or more electromechanical sensing devices and electronic circuitry for processing an output of the sensing devices. The sensing devices each include a cantilevered structure and at least one contact configured for contact-mode operation with the cantilevered structure in response to the cantilevered structure deflecting toward or away from the contact when exposed to the parameter of interest. The cantilevered structure has at least first and second beams of dissimilar materials, at least one of which has at least one property that changes as a result of exposure to the parameter.

A stress distribution measurement method is a method of measuring stress distribution generated on a structural object including two support parts and a beam part provided between the support parts. The method includes: generating first image data by performing, through a first image capturing unit, image capturing of a moving object or an identification display object attached to the structural object from the moving object; calculating, based on the first image data, a movement duration in which the moving object moves between the support parts; generating, as second image data, thermal image data by performing image capturing of the surface of the beam part through a second image capturing unit; calculating a temperature change amount based on a second image data group corresponding to the movement duration; and calculating a stress change amount based on the temperature change amount to calculate stress distribution based on the stress change amount.