An oscillator includes a container, an oscillation element housed in the container, a heating circuit housed in the container, and adapted to control a temperature of the oscillation element, a temperature detection circuit housed in the container, a temperature control circuit housed in the container, and adapted to control the heating circuit based on an output of the temperature detection circuit, at least one connecting wire housed in the container, and electrically connects a ground of the temperature detection circuit and a ground of the temperature control circuit to each other, and a ground external terminal disposed on an outer surface of the container, and electrically connected to the ground of the temperature detection circuit and the ground of the temperature control circuit.

A measuring arrangement comprising a first pair of thermowires wherein the two thermowires of the first pair are insulated completely from one another by an insulation, such as, for example, a material, which serves for electrical insulation between the two thermowires of the first pair.

An internal temperature measuring apparatus includes a base and a MEMS device disposed on the base. The MEMS device includes a top face and a support. The top face includes a first thermopile configured to measure a first temperature difference used to calculate an internal temperature and a second thermopile configured to measure a second temperature difference used to calculate the internal temperature together with the first temperature difference. An orientation in which a cold junction of each thermocouple constituting the first thermopile is viewed from a hot junction coincides with an orientation in which a cold junction of each thermocouple constituting the second thermopile is viewed from a hot junction.

The disclosure is and includes at least an apparatus, system and method for a flexible heater sensor suitable for association with a fluid bag. The apparatus, system and method may include a conformable substrate on a ply of the fluid bag opposite a printed flexible heater; and a matched function ink set, printed onto at least one substantially planar face of the substrate. The matched function ink set forms: at least one conductive layer capable of receiving current flow from at least one power source; and at least one dielectric layer capable of at least partially insulating and at least partially limiting conductivity of the at least one conductive layer; wherein the matched ink set is matched to preclude detrimental interactions between the printed inks of each of the at least one conductive and dielectric layers, and to preclude detrimental interactions with the conformable substrate; and wherein the at least one conductive layer and the at least one dielectric layer comprise a sensing circuit that senses at least the temperature of fluid within the fluid bag.

A temperature detection device includes: a thermocouple configured to output a first signal value corresponding to a thermoelectromotive force generated between a hot junction and a cold junction thereof, a detection portion configured to output a second signal value corresponding to a temperature of the cold junction; a conversion processing portion; and a calculation processing portion, and detects a temperature of a fixing member by using a high-degree expression for temperature calculation that includes variables for which the first signal value and the second signal value are to be substituted.

A sensor assembly with a sensing element sends a sensor signal from the sensing element to attached process transmitter over sensor connection wires. The sensor assembly has memory circuitry for storing information related to the sensor assembly and interface circuitry that provides for digital communication of the stored information with the attached process transmitter. This digital communication is sent over the sensor connection wires.

An optimized thermocouple system and a method of optimizing a thermocouple system having a plurality of thermocouple probes and a junction box is provided and includes examining the thermocouple system to identify a first thermocouple probe of the plurality of thermocouple probes, wherein the first thermocouple probe includes a first positive leg and a first negative leg and is located electrically farthest from the junction box. The method includes calculating a first loop resistance between the first thermocouple probe and the junction box and configuring a second thermocouple probe of the plurality of thermocouple probes having a second positive leg, a second negative leg and a second loop resistance such that the second loop resistance is substantially equal to the first loop resistance.

A temperature sensor is disclosed that determines whether the temperature of an integrated circuit (IC) is within a normal temperature range. A low threshold monitor circuit senses whether the temperature of the IC is above or below a minimum temperature threshold. A high threshold monitor circuit configured senses whether the temperature of an integrated circuit (IC) is above or below a maximum temperature threshold. The minimum temperature threshold is determined by an intersection of a first temperature coefficient of resistance (TCR) and a second TCR that are associated with a first pair of conductive lines. The maximum temperature threshold is determined by an intersection of a third TCR and a fourth TCR associated that are with the second pair of conductive lines.

A temperature measuring board for use in measuring an oven temperature of a reflow oven includes a modular substrate and a thermal compensation unit. The modular substrate includes a plurality of substrates assembled to each other. Each substrate has at least one first fixing portion, and at least one second fixing portion removably fixed to the first fixing portion of another substrate. A selected number of the substrates can be assembled to each other to form a desired shape of the modular substrate through engagement of the first and second fixing portions. The thermal compensation unit includes at least one surface-measured compensation member fixed to the modular substrate at a selected location.

The present invention, in one embodiment, provides a method of measuring pressure or temperature using a sensor including a sensor element composed of a plurality of carbon nanotubes. In one example, the resistance of the plurality of carbon nanotubes is measured in response to the application of temperature or pressure. The changes in resistance are then recorded and correlated to temperature or pressure. In one embodiment, the present invention provides for independent measurement of pressure or temperature using the sensors disclosed herein.