In-package temperature is controlled with higher accuracy. To this end, a temperature control circuit includes a temperature sensor arranged in a package and detecting temperature in the package, a heater current detection circuit detecting a driving amount of a heater, a target temperature generation circuit generating a target temperature from an intended temperature of a resonator and a detection value of the driving amount detected by the heater current detection circuit, a heater current driver controlling the heater so that the detection temperature detected by the temperature sensor coincides with the target temperature, and an Nth-order correction circuit receiving the detection value of the driving amount detected by the heater current detection circuit or a signal based on the target temperature and cancelling influence of a second or higher order fluctuation component generated in the heater current detection circuit on temperature of the resonator.

Embodiments described herein are directed to an integrated circuit (IC) for obtaining elevated credentials and performing actions with respect to a network-based resource in accordance with the elevated credentials. For instance, a user may request his privileges with respect to the resource to be elevated. Responsive to submitting the request, the client device's main CPU may send a request to a specialized IC included in the client device. The specialized IC performs various forms of validation responsive to the request. If validation is successful, the specialized IC sends a request for elevated privileges to a network-based service, which determines whether the user is authorized to do so. Upon a successful determination, the service provides a response granting the elevated credentials. The specialized integrated circuit is then given access to a private key that the IC utilizes to digitally sign an action request to perform the desired action.

A circuit includes a first input terminal, a second input terminal, a third input terminal and an output terminal. A first summation node adds signals at the first and third input terminals. A second summation node subtracts signals at the second and third input terminals. A selector selects between the added signals and subtracted signals in response to a selection signal. The output of the selector is integrated to generate an integrated signal. The integrated signal is compared by a comparator to a threshold, the comparator generating an output signal at the output terminal having a first level and a second level. Feedback of the output signal produces the selection signal causing the selector to select the added signals in response to the first level of the output signal and causing the selector to select the subtracted signals in response to the second level of the output signal.

An example device includes a first temperature sensor configured to provide a first current signal indicative of a temperature of a first circuit based on a voltage of a first temperature sensing element. The first circuit includes a power switch device and the first temperature sensing element. A second temperature sensor is configured to provide a second current signal indicative of temperature of a second circuit based on a voltage of a second temperature sensing element. The second circuit includes the second temperature sensing element. A trim circuit is configured to trim current in at least one of the first temperature sensor or the second temperature sensor to compensate for mismatch between temperature coefficients of the first and second temperature sensing elements.

A process fluid temperature estimation system includes a mounting assembly, a sensor capsule, measurement circuitry, and a controller. The mounting assembly is configured to mount the process fluid temperature estimation system to an external surface of a process fluid conduit. The sensor capsule has an end that is configured to contact the external surface of the process fluid conduit to form an interface having a contact region and an air gap. The sensor capsule also has at least one temperature sensitive element disposed therein. The measurement circuitry is coupled to the sensor capsule and configured to detect an electrical characteristic of the at least one temperature sensitive element that varies with temperature and provide at least process fluid conduit skin temperature information. The controller is coupled to the measurement circuitry and is configured to obtain the process fluid conduit skin temperature information from the measurement circuitry and to obtain reference temperature information. The controller is configured to obtain a heat flow parameter related to the air gap of the interface and to employ a heat transfer calculation with the process fluid conduit skin temperature information, reference temperature information, and heat flow parameter to generate an estimated process fluid temperature output.

A thermally representative phantom mammalian manikin assembly is provided. The assembly can include a cover portion representative of mammalian tissue partially enclosing a thermal cavity having a thermally representative material therein. The cover portion can have an opening with a cap extending across the opening and configured to further enclose the thermal cavity. The cap can have an aperture extending therethrough to receive a device extending through the aperture and into the thermally representative material within the thermal cavity. The device can be a thermocouple configured to measure a temperature of the thermally representative material. In assemblies representing mammalian limbs, the assembly can further include a second thermal cavity representing an additional portion of the limb, e.g., thermally representative upper and lower leg cavities.

A sensor placement optimization device is provided, which may include a preprocessing circuit and an operational circuit. The preprocessing circuit may perform a pre-process for the sensing signals of a plurality of temperature sensors, installed on a machine tool, to generate a pre-processed data. The operational circuit may execute a normalization for the pre-processed data to generate a normalized data, perform a principal component analysis for the normalized data to generate a dimensionality-reduced data and implement a principal component regression for the dimensionality-reduced data to obtain the contributions of the temperature sensors. Then, the operational circuit may rank the temperature sensors according to the contributions thereof to generate a ranking result and execute a screening process according to the ranking result to select at least one redundant sensor from the temperature sensors; afterward, the operational circuit may remove the redundant sensor from the temperature sensors.

A thermocouple arrangement comprising: a first thermocouple including a first thermoelement and a second thermoelement coupled at a first junction, the first junction subject to a first temperature, the second material different from the first material; a second thermocouple including a third thermoelement and a fourth thermoelement coupled to the third thermoelement at a second junction connected to the first thermoelement, the second junction arranged at a second portion subject to a second temperature, the fourth material different from the third material; and a third thermocouple including a fifth thermoelement and a sixth thermoelement coupled to the fifth thermoelement at a third junction connected to the second thermoelement, the third junction arranged at the second portion exposed to the second temperature, the fifth material different from the third material and the fourth material, the sixth material different from the third material, the fourth material, and the fifth material.

The temperature sensor can have a core having a length extending between two ends, the core having a cavity extending along the length, a wire extending in the cavity, along the length, the wire fixed at both ends, the core having a transversal aperture at an intermediary location between the ends, the transversal aperture leading into the cavity, and a potting filling a portion of the cavity and supporting the wire at the intermediary location of the transversal aperture.

An example device includes a first temperature sensor configured to provide a first current signal indicative of a temperature of a first circuit based on a voltage of a first temperature sensing element. The first circuit includes a power switch device and the first temperature sensing element. A second temperature sensor is configured to provide a second current signal indicative of temperature of a second circuit based on a voltage of a second temperature sensing element. The second circuit includes the second temperature sensing element. A trim circuit is configured to trim current in at least one of the first temperature sensor or the second temperature sensor to compensate for mismatch between temperature coefficients of the first and second temperature sensing elements.