Provided is a thermocouple transition body apparatus comprising: a transition body, having at least one recess; a positive electrical terminal; a negative electrical terminal; and, at least one cap; wherein the transition body, positive terminal, and negative terminal are configured to attach to conductors without the use of epoxy or crimping. The thermocouple transition body apparatus is able to withstand temperatures exceeding 500 degrees Fahrenheit.

The present disclosure relates to a thermocouple wafer calibration system including: a main body portion composed of a chamber forming a sealed space, and a support installed a lower edge of the chamber and supporting the chamber to be spaced apart from the ground; a thermocouple wafer composed of a plate installed to be horizontal inside the sealed space of the chamber, and a first thermocouple unit attached to a upper surface of the plate so as to form a plurality of first measurement contact points; a calibration portion provided with a second thermocouple unit penetrating the chamber in a space where the chamber spaced from the ground, then partially accommodated inside the sealed space, and calibrated to form a plurality of second measurement contact points in contact with a lower surface of the plate at a position corresponding to each of the first measurement contact points; a temperature measurement portion partially accommodated inside the sealed space of the chamber and measuring a temperature of the sealed space; a heating portion accommodated inside the sealed space of the chamber, allowing thermogenesis and being in thermal contact with the second thermocouple unit directly; a measurement portion connected to the first and second thermocouple units respectively, and measuring each thermal electromotive force for the first and second measurement contact points occurring when the first and second thermocouple units are in contact indirectly at both sides on the basis of the plate; and a temperature control portion calculating each temperature value for the first and second measurement contact points depending on values measured from the measurement portion, and, after comparing and analyzing the calculated temperature values and temperature values measured from the temperature measurement portion, allowing adjusting the temperature of the sealed space by controlling the heating portion based on the analysis result.

This disclosure relates to remote monitoring systems and methods, such as for monitoring the condition of bulk solids, such as agricultural grain, pelletized materials and/or equipment. The systems and methods described herein integrate analog and digital monitoring technologies and enable such technologies to be managed and controlled by one or more users.

A thermocouple assembly for use in a high-temperature gas path that includes a thermocouple. The thermocouple includes a first conductor and a second conductor, the first and second conductors formed of different materials and coupled to one another by junction, a metal sheath surrounding the first and second conductors wherein the metal sheath is substantially coaxial with the both the first conductor and the second conductor. The assembly also includes: a first termination electrically coupled to the first conductor; a second termination electrically coupled to the second conductor; a first connector configured to couple to the first termination; a second connector configured to couple to the second termination; and a housing configured to cover the first and second terminations and the first and second connectors.

An electronic power connector including a contact and a contact core. The contact is configured to electrically connect a power supply to a load. The contact core is configured to receive the contact. The contact core includes a transformer winding configured to sense a current and a sensor slot configured to receive a sensor. In some embodiments, the sensor is configured to sense a temperature. In some embodiments, the sensor is configured to sense a voltage.

An apparatus for determining and/or monitoring at least one process variable. The apparatus includes: at least one sensor element, which is connected to at least one connection line; and at least one conductor element, which is connected to the connection line. At least one formed part is provided; that at least one opening is provided in the formed part for introduction of the connection line; that at least one opening is provided in the formed part for introduction of the conductor element; and that there is provided in the formed part at least one chamber section, into which open the opening for introduction of the connection line and the opening for introduction of the conductor element.

A contact preventing a plurality of current paths joining together and having a contact main body having a wire fixing portion and a contacting member which is a member formed separately from the contact main body is provided. The contact has a contact main body having a wire fixing portion to which a wire is fixed and a contacting member formed separately from the contact main body and configured to be connected to the wire and contact with a mating contact. A portion of the contact main body, contacting with the contacting member has an insulation layer.

A package comprises a photonic integrated circuit (PIC) with a modulator having a first modulator input, and a PIC interconnect region within two millimeters or fifty microns from the modulator. Additionally, an electric integrated circuit (EIC) is included with a driver circuit and an EIC interconnect region within two millimeters or fifty microns from the driver circuit. The driver circuit is electrically connected to the first modulator input via the EIC interconnect region, a first metal interconnect, and the PIC interconnect region. The modulator receives a temperature-dependent bias voltage, where the temperature dependence of the bias voltage inversely matches the temperature dependence of the modulator across an extended temperature range.

A thermocouple support assembly is provided. The thermocouple support assembly is configured to mount on a gas turbine casing. The thermocouple support assembly includes a thermocouple and a support plate. The thermocouple includes a protective sheath. The protective sheath extends from a connection end to a junction end. The support plate includes an outer surface and an inner surface and defines an aperture that extends between the outer surface and the inner surface. The protective sheath extends through the aperture such that the junction end is flush with the inner surface of the support plate.

A COT surface thermocouple including a contact type temperature measuring component, a sleeve, a connecting sealing assembly, a clamping sleeve assembly, a temperature measuring component and a junction box is provided. The COT surface thermocouple is arranged on the surface of a furnace tube of an ethylene cracking furnace. The contact type temperature measuring component is completely in contact welding with the surface of the furnace tube. The whole body is in an inclined angle. The contact type temperature measuring component is connected with the sleeve in a way of concentrically welding a counter bore or connecting an internal thread. The sleeve and the contact type temperature measuring component are concentrically connected without bending. The sleeve is formed by splicing two sections and is connected through the connecting sealing assembly to form a sealing cavity.