A temperature sensing assembly includes a sheath defining an interior space, a first temperature sensor and a second temperature sensor. The first temperature sensor has first and second conductors extending within the interior space of the sheath and joined at a first junction point. The first conductor is constructed of a first material and the second conductor is constructed of a second material that is different than the second material. The second temperature sensor has third and fourth conductors extending within the interior space of the sheath and joined at a second junction point. The third conductor is constructed of a third material and the fourth conductor is constructed of a fourth material that is different than the fourth material. The first material is different than each of the third and fourth materials. The first junction point is adjacent to the second junction point.

Devices and methods are provided for the low-cost manufacturing of thermoelectric power-generation devices (thermopiles) using stable, common materials that can function at very high temperatures. An improved geometry for thermocouple elements in the assembly provides for incorporating a large number of thermocouples. The geometry includes holes and cross-channels in an electrically-insulative device body comprising a material such as a ceramic or glass whereby thermocouple material may be deposited and the device heated to sinter or melt the deposited thermocouple material to form a thermopile. Also provided is a thermopile assembly wherein substrates formed by 3D printing or otherwise are stacked to create the thermopile. These device geometries and manufacturing procedures enable the low-cost production of thermopiles comprised of a massive number of thermocouple elements, from hundreds to hundreds of thousands or more, for electrical power generation using common, standard metallic thermocouple materials and common, widely used electrical insulation materials.

Disclosed is an aircraft sensor fault detection system. The system includes a sensor system having a sensing apparatus to measure a parameter of an environment and a measurement circuit coupled to the sensing apparatus. The system includes a source of alternating current connected to the sensor system. The system further includes an alternating current measurement system that measures alternating current passing through the sensor system and indicates an error when a threshold based on a change in impedance of the sensing apparatus is exceeded.

The invention relates to a temperature measurement device comprising at least three probes, a computer, the computer being configured to estimate a temperature on the basis of voltage measurements at the output of the probes, characterised in that the probes are connected together in a plurality of meshes mounted in series, with at least one mesh comprising at least two probes mounted in parallel and at least one other mesh comprising a probe or a plurality of probes mounted in parallel.

A high energy arc-compatible thermal capacitance sensor includes a thermally capacitive slug comprising; a refractory insulation member on which the thermally capacitive slug is disposed; and a temperature reader disposed on a hidden thermal energy transfer surface of the thermally capacitive slug and in thermal communication with the hidden thermal energy transfer surface and that measures a temperature of the hidden thermal energy transfer surface, such that the temperature reader: is a refractory insulation member blocks the temperature reader from a plasma jet and heat flux and incident energy; and receives thermal energy from the hidden thermal energy transfer surface; and produces thermal energy data from the thermal energy, such that the heat flux and incident energy of the high energy arc event is determinable from the thermal energy data.

A high energy arc-compatible thermal capacitance sensor includes a thermally capacitive slug comprising; a refractory insulation member on which the thermally capacitive slug is disposed; and a temperature reader disposed on a hidden thermal energy transfer surface of the thermally capacitive slug and in thermal communication with the hidden thermal energy transfer surface and that measures a temperature of the hidden thermal energy transfer surface, such that the temperature reader: is a refractory insulation member blocks the temperature reader from a plasma jet and heat flux and incident energy; and receives thermal energy from the hidden thermal energy transfer surface; and produces thermal energy data from the thermal energy, such that the heat flux and incident energy of the high energy arc event is determinable from the thermal energy data.

A diagnostic device of a first thermocouple, the diagnostic device includes: a controller that acquires a first measurement value of the first thermocouple each time current passes through the first thermocouple and determines, in a first predetermined cycle and based on the acquired first measurement value, a presence of a disconnection risk that the first thermocouple will disconnect from the diagnostic device; and an output unit that outputs a first alarm indicating the disconnection risk based on a result of the determination by the controller.

A diagnostic device of a first thermocouple, the diagnostic device includes: a controller that acquires a first measurement value of the first thermocouple each time current passes through the first thermocouple and determines, in a first predetermined cycle and based on the acquired first measurement value, a presence of a disconnection risk that the first thermocouple will disconnect from the diagnostic device; and an output unit that outputs a first alarm indicating the disconnection risk based on a result of the determination by the controller.

A temperature transmitter assembly includes a thermocouple and a temperature transmitter. The thermocouple has a first conductor and a second conductor connected to each other at a junction. The temperature transmitter has diagnostics that determines a resistance of the thermocouple and based on the determined resistance, provides an indication of whether the first conductor and the second conductor are shorted together before the junction.

There is described a method of detecting failure in an array of thermocouples connected in parallel. The method comprising: during an operation mode of the array of thermocouples, measuring a voltage V across the array of thermocouples, the voltage V associated with a temperature T; during a failure detection mode of the array of thermocouples, shunting the array of thermocouples, and measuring a shunt voltage Vs occurring across a resistive element connected in series with the array of thermocouples; comparing the shunt voltage Vs to an expected shunt voltage Vs_exp for the array of thermocouples at the temperature T; and generating a failure signal indicative of a detected failure in the array of thermocouples when the shunt voltage Vs deviates from the expected shunt voltage Vs_exp by more than a deviation threshold.