Robust estimation of temperatures inside and outside a device can be achieved using one or more absolute temperature sensors optionally in conjunction with thermopile heat flux sensors. Thermopile temperature sensing systems can measure a temperature gradient across two locations within the device, to estimate absolute temperature at locations that are impractical to measure using absolute temperature sensors. Using heat flux models associated with the device, the thermopile temperature sensing system can be used to estimate temperature associated with objects that contact an outer surface of the device, such as a user's skin temperature. Additionally, the thermopile temperature sensing system can be used to estimate ambient air temperature. Within a device, temperature measurements from the thermopile temperature sensors can be used to compensate sensor measurements, such as when the accuracy or reliability of a sensor varies with temperature.

Robust estimation of temperatures inside and outside a device can be achieved using one or more absolute temperature sensors optionally in conjunction with thermopile heat flux sensors. Thermopile temperature sensing systems can measure a temperature gradient across two locations within the device, to estimate absolute temperature at locations that are impractical to measure using absolute temperature sensors. Using heat flux models associated with the device, the thermopile temperature sensing system can be used to estimate temperature associated with objects that contact an outer surface of the device, such as a user's skin temperature. Additionally, the thermopile temperature sensing system can be used to estimate ambient air temperature. Within a device, temperature measurements from the thermopile temperature sensors can be used to compensate sensor measurements, such as when the accuracy or reliability of a sensor varies with temperature.

A fluidization measurement system for a gas phase reactor containing a fluidized bed includes a measurement probe coupled to a sidewall of the gas phase reactor. The measurement probe includes a support bar penetrating the sidewall and extending into the fluidized bed to a distance of at least 12% of a diameter of the gas phase reactor, and a plurality of sensors arranged along a length of the support bar to obtain measurements of at least one of temperature, pressure, and electrostatic charge at multiple points within the fluidized bed. A base plant control system is in communication with measurement probe to receive and process the measurements to determine real-time physical conditions and flow patterns of the fluidized bed.

This application discloses a thermoelectric power generation structure and a temperature measuring sensor. The thermoelectric power generation structure includes: a semiconductor power generation element, a first thermal-conductive element arranged in a first environment and connected to an inner side face of the semiconductor power generation element, and a second thermal-conductive element connected to an outer side face of the semiconductor power generation element. When there is a temperature difference between the first environment and the second environment, the semiconductor power generation element generates electric power. This application solves the technical problem that the thermoelectric power generation structure cannot match a sensor probe and fails to create a thermoelectric power generation environment, and accordingly cannot effectively generate electric power to the sensor probe in an enclosed high-temperature food heating scene.

This application discloses a thermoelectric power generation structure and a temperature measuring sensor. The thermoelectric power generation structure includes: a semiconductor power generation element, a first thermal-conductive element arranged in a first environment and connected to an inner side face of the semiconductor power generation element, and a second thermal-conductive element connected to an outer side face of the semiconductor power generation element. When there is a temperature difference between the first environment and the second environment, the semiconductor power generation element generates electric power. This application solves the technical problem that the thermoelectric power generation structure cannot match a sensor probe and fails to create a thermoelectric power generation environment, and accordingly cannot effectively generate electric power to the sensor probe in an enclosed high-temperature food heating scene.

An optimized thermocouple system and a method of optimizing a thermocouple system having a plurality of thermocouple probes and a junction box is provided and includes examining the thermocouple system to identify a first thermocouple probe of the plurality of thermocouple probes, wherein the first thermocouple probe includes a first positive leg and a first negative leg and is located electrically farthest from the junction box. The method includes calculating a first loop resistance between the first thermocouple probe and the junction box and configuring a second thermocouple probe of the plurality of thermocouple probes having a second positive leg, a second negative leg and a second loop resistance such that the second loop resistance is substantially equal to the first loop resistance.

An optimized thermocouple system and a method of optimizing a thermocouple system having a plurality of thermocouple probes and a junction box is provided and includes examining the thermocouple system to identify a first thermocouple probe of the plurality of thermocouple probes, wherein the first thermocouple probe includes a first positive leg and a first negative leg and is located electrically farthest from the junction box. The method includes calculating a first loop resistance between the first thermocouple probe and the junction box and configuring a second thermocouple probe of the plurality of thermocouple probes having a second positive leg, a second negative leg and a second loop resistance such that the second loop resistance is substantially equal to the first loop resistance.

A system for determining a temperature of an object includes a three-dimensional (3D) printer configured to successively deposit a first layer of material, a second layer of material, and a third layer of material to form the object. The 3D printer is configured to form a recess in the second layer of material. The material is a metal. The system also includes a temperature sensor configured to be positioned at least partially with the recess and to have the third layer deposited thereon. The temperature sensor is configured to measure a temperature of the first layer of material, the second layer of material, the third layer of material, or a combination thereof.

The present invention includes an apparatus for determining and/or monitoring a process variable, especially the temperature, or the flow, of a medium in a containment, including a temperature sensor for registering temperature and a flexible, a heat insulating support element, which is arrangeable on an outer surface of a wall of the containment, wherein the temperature sensor is secured to the support element.

The present invention includes an apparatus for determining and/or monitoring a process variable, especially the temperature, or the flow, of a medium in a containment, including a temperature sensor for registering temperature and a flexible, a heat insulating support element, which is arrangeable on an outer surface of a wall of the containment, wherein the temperature sensor is secured to the support element.