The present invention provides a thermocouple probe (10). The probe includes a first pair of thermocouple wires (50) joined to form a first thermocouple junction (56) at a sensing tip (14) of the thermocouple probe and a cooling arrangement (20) defining a cooling pathway (34) adjacent to a cooled portion of the probe. The sensing tip projects beyond the cooling arrangement and is cooled during use by conduction to the cooled portion of the probe. The probe further includes a second pair of thermocouple wires (54) joined to form a second thermocouple junction (52) in the cooled portion of the probe and adjacent to the sensing tip. The present invention also provides a method and a system for determining the gas temperature (Tg) in a high temperature environment, such as a jet engine.

A circuit system includes a circuit board including a plurality of integrated circuit (IC) chips. The circuit board is configured to be immersed in a two-phase cooling fluid. The circuit system includes a controller. The controller is configured to, in a control process: obtain temperature data indicative of respective internal temperatures of the plurality of IC chips, predict respective future internal temperatures of the plurality of IC chips based on the respective internal temperatures, and adjust clock frequencies and power supply voltages of the plurality of the IC chips such that the predicted respective future internal temperatures are within a target temperature range. A clock frequency of a first IC chip of the plurality of IC chips is adjusted to be different from a clock frequency of a second IC chip of the plurality of IC chips.

A circuit system includes a circuit board including a plurality of integrated circuit (IC) chips. The circuit board is configured to be immersed in a two-phase cooling fluid. The circuit system includes a controller. The controller is configured to, in a control process: obtain temperature data indicative of respective internal temperatures of the plurality of IC chips, predict respective future internal temperatures of the plurality of IC chips based on the respective internal temperatures, and adjust clock frequencies and power supply voltages of the plurality of the IC chips such that the predicted respective future internal temperatures are within a target temperature range. A clock frequency of a first IC chip of the plurality of IC chips is adjusted to be different from a clock frequency of a second IC chip of the plurality of IC chips.

An example force-sensitive measuring device includes: a main body having a proximal end and a distal end; a frame coupled to the main body at the proximal end; a spring coupled between the main body and the frame; a sensor coupled to the main body; and a position sensor coupled to the proximal end of the main body, where, when the sensor touches a surface, the spring is compressed and the position sensor detects that the distal end of the main body is touching the surface.

An example force-sensitive measuring device includes: a main body having a proximal end and a distal end; a frame coupled to the main body at the proximal end; a spring coupled between the main body and the frame; a sensor coupled to the main body; and a position sensor coupled to the proximal end of the main body, where, when the sensor touches a surface, the spring is compressed and the position sensor detects that the distal end of the main body is touching the surface.

Described is a zone box for a differential scanning calorimeter. The zone box includes sheets of thermocouple alloy disposed between thermally conductive electrical insulator layers. A thermocouple alloy wire is electrically coupled to each one of the thermocouple alloy sheets. In addition, a pure metal wire is electrically coupled to each one of the thermocouple alloy sheets to enable remote measurement of voltage differences between the different thermocouple alloy sheets. The high thermal conductivity of the electrical insulator layers substantially reduces any thermal gradients across the sheets and maintains the connections of the thermocouple alloy wires and pure metal wires to the sheets to be at substantially the same temperature. The zone box reduces temperature difference measurement errors that result from inhomogeneity in the thermocouple alloy wires and variable temperature distributions along the length of the wires.