A circuit device including: a detection circuit (10) that performs A/D conversion of a first detection voltage (VD1) that is detected by using a thermopile (2), and outputs a first detection value (DT1) that is a digital value, and performs A/D conversion of a second detection voltage (VD2) that is detected by using a thermistor (4), and outputs a second detection value (DT2) that is a digital value; and a control unit (50) that obtains a self-temperature by using the second detection value (DT2), obtains a second electromotive voltage that corresponds to the self-temperature by using the self-temperature, obtains a first electromotive voltage that corresponds to an object's temperature by using the first detection value (DT1) and the second electromotive voltage, and obtains the object's temperature by using the first electromotive voltage.

A circuit device including: a detection circuit (10) that performs A/D conversion of a first detection voltage (VD1) that is detected by using a thermopile (2), and outputs a first detection value (DT1) that is a digital value, and performs A/D conversion of a second detection voltage (VD2) that is detected by using a thermistor (4), and outputs a second detection value (DT2) that is a digital value; and a control unit (50) that obtains a self-temperature by using the second detection value (DT2), obtains a second electromotive voltage that corresponds to the self-temperature by using the self-temperature, obtains a first electromotive voltage that corresponds to an object's temperature by using the first detection value (DT1) and the second electromotive voltage, and obtains the object's temperature by using the first electromotive voltage.

A Cooking appliance, in particular an oven, including an electrical adapter, the electrical adapter including an electrical signal input for receiving at least one analog voltage input signal from a temperature sensor, particularly a meat thermometer, an electrical signal output for providing an analog voltage output signal to an appliance, particularly a kitchen stove, and an electrical signal converter for converting the input signal to the output signal, the signal converter electrically connected to both the signal input and the signal output and configured such that the output signal is inversely proportional to the input signal.

A Cooking appliance, in particular an oven, including an electrical adapter, the electrical adapter including an electrical signal input for receiving at least one analog voltage input signal from a temperature sensor, particularly a meat thermometer, an electrical signal output for providing an analog voltage output signal to an appliance, particularly a kitchen stove, and an electrical signal converter for converting the input signal to the output signal, the signal converter electrically connected to both the signal input and the signal output and configured such that the output signal is inversely proportional to the input signal.

A package comprises a photonic integrated circuit (PIC) with a modulator having a first modulator input, and a PIC interconnect region within two millimeters or fifty microns from the modulator. Additionally, an electric integrated circuit (EIC) is included with a driver circuit and an EIC interconnect region within two millimeters or fifty microns from the driver circuit. The driver circuit is electrically connected to the first modulator input via the EIC interconnect region, a first metal interconnect, and the PIC interconnect region. The modulator receives a temperature-dependent bias voltage, where the temperature dependence of the bias voltage inversely matches the temperature dependence of the modulator across an extended temperature range.

A package comprises a photonic integrated circuit (PIC) with a modulator having a first modulator input, and a PIC interconnect region within two millimeters or fifty microns from the modulator. Additionally, an electric integrated circuit (EIC) is included with a driver circuit and an EIC interconnect region within two millimeters or fifty microns from the driver circuit. The driver circuit is electrically connected to the first modulator input via the EIC interconnect region, a first metal interconnect, and the PIC interconnect region. The modulator receives a temperature-dependent bias voltage, where the temperature dependence of the bias voltage inversely matches the temperature dependence of the modulator across an extended temperature range.

A method for reducing thermal induced error in real-time for a sensor in a region of interest. The method includes receiving at least one data point from a temperature sensor, the temperature sensor configured to determine temperature for the sensor of interest. The method includes receiving at least one data point from the sensor, the sensor having thermal sensitivity and offset shift for a given temperature range. The method includes determining at least three percentage change coefficients for thermal sensitivity. The method includes determining at least three percentage change coefficients for thermal zero offset. The method includes calculating real-time thermal error reduction.

A method for reducing thermal induced error in real-time for a sensor in a region of interest. The method includes receiving at least one data point from a temperature sensor, the temperature sensor configured to determine temperature for the sensor of interest. The method includes receiving at least one data point from the sensor, the sensor having thermal sensitivity and offset shift for a given temperature range. The method includes determining at least three percentage change coefficients for thermal sensitivity. The method includes determining at least three percentage change coefficients for thermal zero offset. The method includes calculating real-time thermal error reduction.

A thermal interface circuit and a method for operating the same includes a controller, a thermocouple and a thermocouple signal conditioner coupled to the controller using two wires comprising a voltage input and a ground. The controller provides a first voltage to the signal conditioner. The signal conditioner receives a voltage from the thermocouple and generates a conditioned voltage corresponding to the voltage from the thermocouple. The signal conditioner reduces the first voltage by the conditioned voltage to form a sensing voltage. The controller determines a temperature output signal at the controller based on the sensing voltage.

A thermal interface circuit and a method for operating the same includes a controller, a thermocouple and a thermocouple signal conditioner coupled to the controller using two wires comprising a voltage input and a ground. The controller provides a first voltage to the signal conditioner. The signal conditioner receives a voltage from the thermocouple and generates a conditioned voltage corresponding to the voltage from the thermocouple. The signal conditioner reduces the first voltage by the conditioned voltage to form a sensing voltage. The controller determines a temperature output signal at the controller based on the sensing voltage.