This invention discloses a chip wiring layer temperature sensing circuit, a temperature sensing method, a chip stereo temperature sensor, and a chip thereof. The chip wiring layer temperature sensing circuit includes a metal wiring layer temperature detection module, a pulse delay detection module, and a temperature transition module; wherein the metal wiring layer temperature detection module is disposed at a metal interconnection structure of a metal wiring layer of a chip; and the metal interconnection structure is electrically connected to the pulse delay detection module; wherein the pulse delay detection module includes a system high-speed clock, a delay data generated after a pulse passing through the metal wiring layer temperature detection module detected by the system high-speed clock, and the delay data was sent to the temperature transition module; wherein the temperature transition module calculates a temperature of the metal wiring layer according to the delay data.

A temperature probe for determining the temperature according to the three-point probe method includes a three-wire line several meters long consisting of a first connecting line, a second connecting line, and a third connecting line connected to sensor element. The connecting lines are made of a first material and serve to transmit energy and the measured temperature values. A conductive element made of a second material is inserted in the second connecting line and in the third connecting line. The resistivity of said second material is higher than the resistivity of the first material. The two inserted conductive elements are designed in such that the second connecting line and the third connecting have the same resistance as the first connecting line. Additionally, the present disclosure refers to a method describing the manufacture of a temperature probe.

A temperature probe for determining the temperature according to the three-point probe method includes a three-wire line several meters long consisting of a first connecting line, a second connecting line, and a third connecting line connected to sensor element. The connecting lines are made of a first material and serve to transmit energy and the measured temperature values. A conductive element made of a second material is inserted in the second connecting line and in the third connecting line. The resistivity of said second material is higher than the resistivity of the first material. The two inserted conductive elements are designed in such that the second connecting line and the third connecting have the same resistance as the first connecting line. Additionally, the present disclosure refers to a method describing the manufacture of a temperature probe.

Generators, systems, and methods can comprise a resistance temperature detector (RTD) module; a controller area network (CAN) module; and an optical interface between the RTD module and the CAN module. The optical interface can be directly connected to each of the RTD module and the CAN module. The RTD module can be configured to convert first optical signals from the optical interface to first RTD signals and to convert second RTD signals to second optical signals for transmission through the optical interface to the CAN module. The CAN module can be configured to convert the second optical signals from the optical interface to first CAN signals and to convert second CAN signals to the first optical signals for transmission through the optical interface to the resistance temperature detector (RTD) module.

Generators, systems, and methods can comprise a resistance temperature detector (RTD) module; a controller area network (CAN) module; and an optical interface between the RTD module and the CAN module. The optical interface can be directly connected to each of the RTD module and the CAN module. The RTD module can be configured to convert first optical signals from the optical interface to first RTD signals and to convert second RTD signals to second optical signals for transmission through the optical interface to the CAN module. The CAN module can be configured to convert the second optical signals from the optical interface to first CAN signals and to convert second CAN signals to the first optical signals for transmission through the optical interface to the resistance temperature detector (RTD) module.

The invention relates to temperature sensors, in particular high-temperature sensors, having an optionally coated substrate, at least one resistor structure, and at least two connection contacts. The connection contacts electrically contact the resistor structure, and the substrate is made of zirconium oxide or a zirconium oxide ceramic stabilized with oxides of a trivalent metal and a pentavalent metal. The substrate is coated with an insulation layer and the resistor structure and the free regions of the insulation layer, on which no resistor structure is disposed, are at least partially coated with a ceramic intermediate layer. A protective layer and/or a cover is disposed on the ceramic intermediate layer. At least one electrode may be disposed, at least at one connection contact, alongside the resistor structure on the substrate. The invention also relates an exhaust-gas system for controlling and/or regulating an engine, particularly a motor vehicle engine, containing these temperature sensors.

The invention relates to temperature sensors, in particular high-temperature sensors, having an optionally coated substrate, at least one resistor structure, and at least two connection contacts. The connection contacts electrically contact the resistor structure, and the substrate is made of zirconium oxide or a zirconium oxide ceramic stabilized with oxides of a trivalent metal and a pentavalent metal. The substrate is coated with an insulation layer and the resistor structure and the free regions of the insulation layer, on which no resistor structure is disposed, are at least partially coated with a ceramic intermediate layer. A protective layer and/or a cover is disposed on the ceramic intermediate layer. At least one electrode may be disposed, at least at one connection contact, alongside the resistor structure on the substrate. The invention also relates an exhaust-gas system for controlling and/or regulating an engine, particularly a motor vehicle engine, containing these temperature sensors.

A temperature sensor element consists of a temperature sensing unit including: a temperature-sensing ceramic unit; first and second electrodes respectively positioned on first and second surface of the temperature-sensing ceramic unit, the second surface opposing the first surface; first and second intermediate electrodes respectively connecting to the first and second electrodes; and first and second lead lines connected to the first and second electrodes via the first and intermediate electrodes, respectively; and a protective unit surrounding the temperature sensing unit, wherein each of the first lead line and the second lead line includes a lead line core coated with a second layer, the lead line core and the second layer being different materials. The lead lines consist of the lead line cores of a metallic material cheaper than the platinum-based metal, which reduces the production cost of the lead lines.

A temperature sensor element consists of a temperature sensing unit including: a temperature-sensing ceramic unit; first and second electrodes respectively positioned on first and second surface of the temperature-sensing ceramic unit, the second surface opposing the first surface; first and second intermediate electrodes respectively connecting to the first and second electrodes; and first and second lead lines connected to the first and second electrodes via the first and intermediate electrodes, respectively; and a protective unit surrounding the temperature sensing unit, wherein each of the first lead line and the second lead line includes a lead line core coated with a second layer, the lead line core and the second layer being different materials. The lead lines consist of the lead line cores of a metallic material cheaper than the platinum-based metal, which reduces the production cost of the lead lines.

Implementations described herein generally relate to semiconductor manufacturing, and more specifically to a temperature measurement device. In one implementation, the temperature measurement device includes a substrate and a stack of metal layers coupled to the substrate. Each metal layer of the stack of metal layers extends continuously uninterrupted from edge to edge of the substrate. The first metal layer has a lower electrical resistivity than the second metal layers. The electrical resistivity of the stack is based on the electrical resistivity of the first metal layer, which is temperature dependent. Utilizing a known relationship between temperature measurements and resistivity measurements, the temperature measurement device can measure and store temperature information in various substrate processing processes.