A temperature detector and method of measuring temperature to obtain temperature readings in environments, such as fluids and gasses, by measuring electrical characteristics of the temperature detector that are influenced by the temperature. The temperature detector can be arranged such that a plurality of measurements can be obtained to provide sufficient diversity and redundancy of the measurements for enhanced diagnostics to be performed, such as optimization for fast dynamic response, calibration stability, in-situ response time testability, and in-situ calibration testability.

A temperature detector and method of measuring temperature to obtain temperature readings in environments, such as fluids and gasses, by measuring electrical characteristics of the temperature detector that are influenced by the temperature. The temperature detector can be arranged such that a plurality of measurements can be obtained to provide sufficient diversity and redundancy of the measurements for enhanced diagnostics to be performed, such as optimization for fast dynamic response, calibration stability, in-situ response time testability, and in-situ calibration testability.

A temperature sensor includes a substrate, a platinum resistor arranged on at least one surface of the substrate, a protective layer covering at least a portion of the platinum resistor and a cover layer covering at least a portion of the protective layer, the cover layer including Al2O3, SiO2 and Y2O3. The cover layer may also include B2O3. A conductive wire may be electrically connected to the platinum resistor. A glass ceramic may be covering at least a portion of the conductive wire, platinum resistor, protective layer and cover layer.

A temperature sensor includes a substrate, a platinum resistor arranged on at least one surface of the substrate, a protective layer covering at least a portion of the platinum resistor and a cover layer covering at least a portion of the protective layer, the cover layer including Al2O3, SiO2 and Y2O3. The cover layer may also include B2O3. A conductive wire may be electrically connected to the platinum resistor. A glass ceramic may be covering at least a portion of the conductive wire, platinum resistor, protective layer and cover layer.

A voltage-glitch detection and protection circuit and method are provided. Generally, circuit includes a voltage-glitch-detection-block (GDB) and a system-reset-block coupled to the GDB to generate a reset-signal to cause devices in a chip including the circuit to be reset when a voltage-glitch in a supply voltage (VDD) is detected. The GDB includes a voltage-glitch-detector coupled to a latch. The voltage-glitch-detector detects the voltage-glitch and generates a PULSE to the system-reset-block and latch. The latch receives the PULSE and generates a PULSE_LATCHED signal to the system-reset-block to ensure the reset-signal is generated no matter a width of the PULSE. In one embodiment, the latch includes a filter and a sample and hold circuit to power the latch, and ensure the PULSE_LATCHED signal is coupled to the system-reset-block when a voltage to the GDB or to the latch drops below a minimum voltage due to the voltage-glitch.

There is provided a susceptor assembly configured to inductively heat an aerosol-forming substrate under influence of an alternating magnetic field, the susceptor assembly including a first susceptor including a first susceptor material and a second susceptor including a second susceptor material, the first and the second susceptor materials being chosen such that during pre-heating of the susceptor assembly starting at room temperature a resistance-over-temperature profile of the susceptor assembly has a minimum value of resistance in a temperature range of ±5 degree Celsius around a Curie temperature of the second susceptor material. There is also provided an inductive heating assembly, an aerosol-generating device, and an aerosol-generating system including the susceptor assembly.

A temperature sensor (1) including: a temperature sensing element (3) including a temperature sensing portion (4) having an electrical characteristic which varies depending on temperature, and an electrode wire (5) for outputting an electrical signal from the temperature sensing portion (4); and a sheath core wire (signal wire) (15) electrically connected to the electrode wire (5). The electrode wire (5) is formed from a platinum-palladium-rhodium alloy containing Pt, Pd and Rh. The alloy contains a total of 0.1 to 1.2 mol % of at least one alkaline-earth metal selected from the group consisting of Ca, Sr and Ba; 0.1 to 43.0 mol % of Pd; and 1.0 to 43.0 mol % of Rh, and the balance is Pt and incidental impurities. In the platinum-palladium-rhodium alloy, second-phase precipitated grains mainly containing Pt, Pd and the alkaline-earth metal are dispersed in a matrix phase.

The sensor assembly of the present disclosure comprises a temperature detector and a support element having a middle segment, a first end segment and a second end segment. A coupling body couples the temperature detector thermally conductively with the support element. The temperature detector and coupling body are connected by material bonding and arranged on a first surface of the support element. The coupling body is connected with the support element by material bonding to form a coupling body to support element connection zone. Additionally, a smallest bending stiffness, which the middle segment has in the region of the coupling body to support element connection zone, is greater than a smallest bending stiffness, which the support element has, as a whole, and/or greater than a smallest bending stiffness, which the first end segment has, and/or greater than a smallest bending stiffness, which the second end segment has.

The sensor assembly of the present disclosure comprises a temperature detector and a support element having a middle segment, a first end segment and a second end segment. A coupling body couples the temperature detector thermally conductively with the support element. The temperature detector and coupling body are connected by material bonding and arranged on a first surface of the support element. The coupling body is connected with the support element by material bonding to form a coupling body to support element connection zone. Additionally, a smallest bending stiffness, which the middle segment has in the region of the coupling body to support element connection zone, is greater than a smallest bending stiffness, which the support element has, as a whole, and/or greater than a smallest bending stiffness, which the first end segment has, and/or greater than a smallest bending stiffness, which the second end segment has.

A temperature sensor assembly for measuring a gas temperature in a gas flow stream includes a first substrate having a first surface configured to be connected to a thermally conductive structure in a gas path, a first temperature sensor mounted to the first substrate a first distance from the first surface, and a second temperature sensor mounted to the first substrate a second distance from the first surface. The second distance is less than the first distance. The first and second temperature sensors are arranged along a temperature gradient.