G01K7/343

Method for monitoring a line for unchanged ambient conditions and measuring arrangement for monitoring a line for changed ambient conditions
10690550 · 2020-06-23 · ·

A method monitors a line for changed ambient conditions. The line has a measuring line with a predetermined length and a measuring conductor surrounded by insulation having a known dielectric constant. In the method, an analog signal having a predetermined frequency is generated, the signal is divided into a reference signal and an operating signal, the operating signal is fed into the measuring conductor, a return signal obtained from the operating signal is combined with the reference signal and by a phase shift between the reference signal and the return signal, a measure is determined for the changed condition, particularly for a temperature change.

TEMPERATURE SENSOR
20200149978 · 2020-05-14 ·

A temperature sensor includes a polymer layer, a relative permittivity of the polymer layer varying in accordance with temperature, the polymer layer being formed of a flexible material; at least one first electrode disposed on one surface of the polymer layer; at least one second electrode disposed on another surface of the polymer layer; and a measuring unit configured to measure a temperature of an object based on capacitance of at least one region between the first electrode and the second electrode that are separated by the polymer layer, the first electrode being closer than the second electrode to a surface of the object that contacts the temperature sensor.

Vibration sensor with integrated temperature detection
10608160 · 2020-03-31 · ·

A vibration sensor with a diaphragm that can be set into vibration, a piezo-electric drive for setting the diaphragm into vibration and for detecting vibrations in the diaphragm, with the drive having at least two serial mechanical piezo elements, a temperature sensor, with at least a first piezo element made from a first piezo-electric material and at least a second piezo element made from a second piezo-electric material.

Integrated circuit package with enhanced cooling structure

An integrated circuit package may include an integrated circuit die having first and second circuit regions and a surface. The first circuit region of the integrated circuit package has an operating temperature that is different than that of the second circuit region. A cooling structure is formed on the surface of the integrated circuit die. The cooling structure includes a group of micropipe interconnects arranged to form a cooling channel that allows for the flow of coolant. The cooling channel includes first and second sub-channels. The first sub-channel has a first size that allows a higher flow rate of the coolant to cool the first circuit region. The second sub-channel has a second size that allows a lower flow rate of the coolant to cool the second circuit region.

Method and apparatus for calibrating a thermometer in situ

The invention relates to an apparatus for the calibration of a thermometer in situ, wherein the apparatus has a temperature sensor (S) for determining a temperature (T); wherein a reference element (K) is provided for calibrating the temperature sensor (S); wherein the reference element (K) at least partially comprises a ferroelectric material (D), which experiences a phase transformation at at least one predetermined temperature (T.sub.Ph) in a temperature range relevant for calibrating the temperature sensor (S).

Measuring arrangement and temperature-measuring method, and sensor cable for such a measuring arrangement

A temperature measurement is performed using a sensor cable. The measuring arrangement has a first signal conductor, a feed unit for feeding a measurement signal into the signal conductor, and an analyzing unit which ascertains and analyzes a change in the signal transit time of the measurement signal as a result of a temperature-induced change in a first temperature-dependent dielectric constant and is configured to derive a temperature signal from the ascertained signal transit time. The first signal conductor together with a second signal conductor forms the sensor cable, and each of the two signal conductors is surrounded by an insulation which is made of a first material that has a first dielectric constant in the first signal conductor and which is made of a second material that is different from the first material and has a second dielectric constant in the case of the second signal conductor.

TEMPERATURE LIMIT VALUE SENSOR
20190353529 · 2019-11-21 ·

The present disclosure relates to a system for monitoring a predeterminable temperature comprising a monitoring unit comprising a reference element composed at least partially of a material in which a phase transformation occurs at a phase transformation temperature, which lies in the region of the predetermined temperature, in which phase transformation the material remains in the solid phase, and a detection unit embodied to detect the occurrence of the phase transformation based on an abrupt change at least one physical or chemical parameter characteristic for the reference element and to generate a report concerning ex- or subceeding of the predeterminable temperature. Furthermore, the present disclosure relates to a monitoring unit and to a detection unit for application in a system of the disclosure as well as to a method for monitoring the predeterminable temperature by means of a system of the disclosure.

Capacitive temperature sensing for electrical conductor

Provided is a system for directly sensing, measuring, or monitoring the temperature of an electrical conductor (31) of a power cable (10). A temperature sensitive capacitor (21C) is disposed in direct thermal contact with the electrical conductor (31). The temperature sensitive capacitor (21C) includes a dielectric material that has a dielectric constant variable with the temperature of the electrical conductor (31). The temperature of the electrical conductor (31) can be sensed, measured, or monitored by measuring the capacitance of the temperature sensitive capacitor (21C).

THIN FILM DIODE BASED BACK-END TEMPERATURE SENSORS

Electronic devices, integrated circuit device structures, and computing devices including thin film, diode-based temperature sensors are disclosed. An electronic device includes a diode including diode materials between a first contact and a second contact, a device layer of an integrated circuit device structure, and at least a portion of an interlayer dielectric between the diode and the device layer.

Sensor line, measuring arrangement and method for detecting an ambient variable
10416528 · 2019-09-17 · ·

A sensor line, a measuring arrangement and a method detect a change in an ambient variable. The sensor line serves for detecting a change in an ambient variable, in particular the temperature. The sensor line has a first optical waveguide, a second optical waveguide and also a material that changes its transparency depending on the value of the ambient variable. The material is positioned between the first optical waveguide and the second optical waveguide in such a way that light from the first optical waveguide is able to be coupled into the second optical waveguide in an event of a change in the transparency.