An apparatus can include a first adaptive filter, a second adaptive filter, a filter, and a third adaptive filter. The first adaptive filter can be configured to determine an estimated magnitude of a control signal associated with a control measure based on a magnitude of a signal from a sensor, wherein the signal is indicative of operating temperature of a memory system. The second adaptive filter can be configured to determine an estimated operating temperature based on a magnitude of the control signal. The filter can be configured to determine a change magnitude of the control signal based on a difference between the magnitude of the signal from the sensor and a threshold operating temperature. The third adaptive filter can be configured to determine a throttle rate at which to apply the control signal based on a change magnitude of the control signal.

An apparatus can include a first adaptive filter, a second adaptive filter, a filter, and a third adaptive filter. The first adaptive filter can be configured to determine an estimated magnitude of a control signal associated with a control measure based on a magnitude of a signal from a sensor, wherein the signal is indicative of operating temperature of a memory system. The second adaptive filter can be configured to determine an estimated operating temperature based on a magnitude of the control signal. The filter can be configured to determine a change magnitude of the control signal based on a difference between the magnitude of the signal from the sensor and a threshold operating temperature. The third adaptive filter can be configured to determine a throttle rate at which to apply the control signal based on a change magnitude of the control signal.

A power module includes a housing having a carrier plate, housing walls and a housing cover. Semiconductor elements and a temperature sensor unit having a temperature sensor are disposed in the interior of the housing on the carrier plate. Partitions disposed in the interior of the housing separate the temperature sensor unit from the semiconductor elements and enclose the temperature sensor unit in a chamber.

A semiconductor device includes a temperature-independent current generator that generates a reference current substantially independent of temperature and a mirror current that is a substantial duplicate of the reference current, a pulse signal generator that samples the mirror current so as to generate a pulse signal, and a counter that obtains a number of pulse signals generated by the pulse signal generator, that permits the pulse signal generator to generate a pulse signal when it is determined thereby that the number of pulse signals obtained thereby is less than a predetermined threshold value, and that inhibits the pulse signal generator from generating a pulse signal when it is determined thereby that the number of pulse signals obtained thereby is equal to the predetermined threshold value. A method for monitoring a temperature of the semiconductor device is also disclosed.

A short circuit detection circuit includes a current terminal, a sense resistor, an amplifier, and a resistor-capacitor ladder. The sense resistor is coupled to the current terminal, and is configured to develop a sense voltage proportional to a current through the current terminal. The amplifier is coupled to the sense resistor, and is configured to generate a scaled current proportional to the sense voltage. The resistor-capacitor ladder is coupled to the amplifier, and is configured to generate a measurement voltage that represents a surface temperature rise due to the current through the current terminal.

An integrated circuit includes a memory and peripheral circuits with a temperature sensor used to automatically adjust operating voltages. The temperature sensor includes a reference circuit that generates a first reference with a first non-zero temperature coefficient and a second reference with a second temperature coefficient having a different magnitude than the first non-zero temperature coefficient. A detector circuit on the integrated circuit, having temperature and process variation compensation, converts a difference between the first and second references into a digital signal indicating temperature on the integrated circuit.

Wearable heat transfer devices and associated systems and methods are disclosed herein. In some embodiments, a representative heat transfer device can comprise (i) a thermoelectric component (TEC) including a first side configured to be operated at a desired temperature and a second side opposite the first side, (ii) a thermally conductive contact member thermally coupled to the TEC, and (iii) a heat transfer system configured to distribute heat from the TEC. The heat transfer system includes a heat transfer structure thermally coupled to the TEC, and a heat exchanger thermally coupled to the heat transfer structure.

An artificial produce includes a housing with at least one shell. At least one data logger for temperature measurement is placed in an area of a core of the housing and a pulp simulant is integrated at least partly in the housing of the artificial produce to show optimized simulation of thermal behavior of real produce. The form and outer surface of the at least one shell replicate the form and surface texture of the real produce simulated. The at least one shell forms at least one fluidtight chamber accessible from the outside by at least one opening which are closable with plugs. The at least one chamber is filled with the pulp simulant in the form of a gel-like filling composition comprising a water-carbohydrate mixture and a gelling agent showing similar thermal conductivity, density, heat capacity and freezing point as the pulp of the produce to be simulated.

A monitoring system includes an analytical engine system coupled to a plurality of sensors of an engine system. The analytical engine system is configured to determine a model probability distribution based on model data, determine a distance threshold value of the model probability distribution based at least in part on a threshold percentage, determine a window probability distribution based on window data sampled from the engine system, determine a fraction of the window probability distribution that is greater than the distance threshold value, and generate a lubricant alert signal when the fraction is greater than a temperature anomaly threshold. The model data includes model temperature data and model load data. The window data includes window temperature data and window load data that is based at least in part on feedback from the plurality of sensors during operation of the engine system.

The present disclosure relates to a solid-state imaging device, a package, and an imaging system capable of curbing degradation of image quality.

A solid-state imaging device according to an aspect of the present technology includes: a photoelectric conversion unit that is configured by using a material with lower band gap energy than silicon; and a circuit substrate that is joined to the photoelectric conversion unit, in which the circuit substrate includes a pixel signal generation circuit that generates a pixel signal of a voltage value in accordance with a charge generated by the photoelectric conversion unit, a thermometer circuit that detects a temperature of the circuit substrate, and a temperature control signal generation circuit that acquires temperature information indicating the temperature detected by the thermometer circuit and generates a temperature control signal on the basis of the acquired temperature information.