A sensor system included in an integrated circuit includes multiple sensor circuits and a control circuit. Using characterization data, a model may be generated that defines a relationship between measurable parameters of the integrated circuit and an operating characteristic of the integrated circuit. The control circuit can combine, using a function included in the model, data from the multiple sensor circuits to determine a value of the operating characteristic that is more accurate than a sensor circuit configured to measure a single parameter of the integrated circuit that varies with the operating characteristic.

Various techniques for implementing resistive temperature sensors that rely on the resistors' temperature sensitivity to provide temperature sensing are disclosed. Temperature sensitive resistors may be implemented in a resistor stack in combination with a resistor stack of resistors that are relatively temperature indifferent. Various temperature sensor circuits implementing these temperature sensitive resistors are also disclosed. A temperature sensor circuit may implement the temperature sensitive resistors along with the resistors that are relatively stable with temperature to output a voltage signal that is indicative of the temperature sensed by the circuit. In some instances, the signal from the temperature sensitive resistors is increased through the use of a feedback resistor loop.

A digital sensor network is overlaid on an integrated circuit for identifying and mapping hotspots in the integrated circuit. The digital sensor network may include a plurality of digital sensors distributed within an area of an integrated circuit component of an integrated circuit. Each of the plurality of digital sensors may include a ring oscillator and may be configured to output a counter value of a ring oscillator counted over a designated period. A sensor network control unit may be provided that is communicatively connected to the plurality of digital sensors via a communication circuit. The sensor network control unit may be configured to receive a plurality of counter values including the counter value from each of the plurality of digital sensors and identify a hotspot within the area of the integrated circuit.

A memory thermal throttling method and a memory thermal throttling system are provided. The method includes: performing, by a testing equipment, test modes on a memory storage device, and obtaining an internal temperature of a memory control circuit unit, a work loading of each memory package and a surface temperature of each memory package to establish a linear relationship between the work loading, the internal temperature, and the surface temperature; storing, by the testing equipment, the linear relationship in the memory storage device; using, by the memory storage device, the linear relationship based on a current internal temperature of the memory control circuit unit and a current work loading of a first memory package of the memory packages to calculate a predicted surface temperature of the first memory package; adjusting, by the memory storage device, an operating frequency for accessing the first memory package based on the predicted surface temperature.

An embodiment of the invention may include a semiconductor structure, method of use and method of manufacture. The structure may include a heating element located underneath a temperature-controlled portion of the device. A method of operating the semiconductor device may include providing current to a thin film heater located beneath a temperature-controlled region of the semiconductor device. The method may include performing temperature dependent operations in the temperature-controlled region.

An electrical device with thermally controlled performance is disclosed. The electrical device includes at least one die with a plurality of device components disposed upon or at least partially embedded within the die. The electrical device further includes a plurality of signal paths interconnecting the plurality of device components. The electrical device further includes a plurality of temperature sensors disposed upon or at least partially embedded within the die. The temperature sensors are configured to detect thermal loads at respective portions of the die. The electrical device further includes at least one controller disposed upon or at least partially embedded within the die. The controller is configured to adjust one or more operating parameters for one or more of the device components based on the thermal loads detected by the temperature sensors.

A temperature control system, adapted to a central processing unit powered by a power supply module of an electronic device, is provided. The temperature control system includes a setting module, a first temperature detecting module, a second temperature detecting module, and a power adjusting module. The setting module is configured to set a target temperature of the CPU and a target temperature of the power supply module. The first temperature detecting module is configured to obtain a detected temperature of the CPU. The second temperature detecting module is electrically connected to the power supply module, to obtain a detected temperature of the power supply module. The power adjusting module is configured to adjust a control parameter of the CPU or the power supply module based on a first temperature difference between the target temperature of the CPU and the detected temperature of the CPU or a second temperature difference between the target temperature of the power supply module and the detected temperature of the power supply module.

Methods, apparatus, systems, and articles of manufacture are disclosed to monitor thermal degradation of a compute device. One such method includes calculating, by executing instructions with processor circuitry, a thermal degradation value based on an equation, the equation generated based on testing of thermal interface materials having varying degrees of degradation. The method also includes comparing, by executing instructions with the processor circuitry, the thermal degradation value to a thermal degradation threshold to determine whether the thermal degradation threshold is satisfied, and, when the thermal degradation threshold is satisfied, triggering generation of a thermal degradation alert.

A power module includes a housing having a carrier plate, housing walls and a housing cover. Semiconductor elements and a temperature sensor unit having a temperature sensor are disposed in the interior of the housing on the carrier plate. Partitions disposed in the interior of the housing separate the temperature sensor unit from the semiconductor elements and enclose the temperature sensor unit in a chamber.

A method for measuring temperature is used to obtain a room temperature of a room. The method for measuring temperature includes: obtaining a first temperature inside an operating area in a portable electronic device in the room; obtaining a second temperature outside the operating area in the portable electronic device by a first temperature sensor; calculating a temperature difference between the first temperature and the second temperature; obtaining a compensation temperature according to the temperature difference and a compensation temperature table; and calculating the room temperature according to the second temperature and the compensation temperature.