Temperature measurements are critical in gas turbine engine design but difficult to obtain due to the extreme environment. Temperature indicating paints (thermal paints) have been used for decades to map maximum temperature fields on superalloy components but have numerous weaknesses. Disclosed herein are novel glass ceramic thermal paints that undergo viscous flow sintering to indicate temperatures up to 1000° C., with high resolution (±5° C.), by an optical transition. Disclosed paint formulations are designed to adhere to Nickel-based superalloys or SiC—SiC ceramic matrix composites (CMC) by closely matching coefficients of thermal expansion and may function for times above 60 hours. By utilizing automation and a UV:VIS spectrometer, quantitative temperature maps can be generated for easy comparison to theoretical models. A transient sintering energy model is disclosed to recover full thermal history information.

In a thermo-physical property measurement instrument, a light shield that shields from light except for an aperture is provided facing the front surface of a sample thin film of a sample. Heating light of repeated pulse that is output from a heating laser irradiates the sample thin film through the light shield. Temperature measurement light of continuous light that is output from a temperature measurement laser is applied to a measurement position a predetermined distance away from a heating light irradiation position on the sample thin film. A photodetector detects reflected light of the temperature measurement light off the sample thin film, and a computer acquires a thermo-reflectance signal that was digitally converted by an AD converter. The computer calculates a thermo-physical property value in the in-plane direction of the sample thin film of the sample on the basis of the acquired thermo-reflectance signal.

A semiconductor includes a multilayer substrate including an insulating plate and a plurality of circuit boards disposed on a top face of the insulating plate, a semiconductor element disposed on a top face of one of the plurality of circuit boards, and having a main electrode disposed on a top face thereof, and a temperature measurement device for measuring a temperature of the semiconductor element. The temperature measurement device includes a cable unit composed of an insulated optical fiber, and a temperature measurement unit provided on one end of the cable unit, the temperature measurement unit being bonded to the main electrode of the semiconductor element using a bonding material.

A semiconductor includes a multilayer substrate including an insulating plate and a plurality of circuit boards disposed on a top face of the insulating plate, a semiconductor element disposed on a top face of one of the plurality of circuit boards, and having a main electrode disposed on a top face thereof, and a temperature measurement device for measuring a temperature of the semiconductor element. The temperature measurement device includes a cable unit composed of an insulated optical fiber, and a temperature measurement unit provided on one end of the cable unit, the temperature measurement unit being bonded to the main electrode of the semiconductor element using a bonding material.

A temperature exposure indicator includes a reservoir of meltable material having a melting point at an activation threshold of the temperature exposure indicator. The temperature exposure indicator also includes a light scattering material having voids and an indicia overlayed by the light scattering material such that the indicia is initially obscured by the light scattering material prior to the meltable material being exposed to a temperature above the activation threshold. The reservoir is in fluid communication with the light scattering material, such that the meltable material, when exposed to a temperature at or above the activation threshold, is configured to melt and flow into the voids of the light scattering material thereby causing the light scattering material to transition from an obscuring form to a non-obscuring form so that the indicia is viewable through the light scattering material.

A temperature exposure indicator includes a reservoir of meltable material having a melting point at an activation threshold of the temperature exposure indicator. The temperature exposure indicator also includes a light scattering material having voids and an indicia overlayed by the light scattering material such that the indicia is initially obscured by the light scattering material prior to the meltable material being exposed to a temperature above the activation threshold. The reservoir is in fluid communication with the light scattering material, such that the meltable material, when exposed to a temperature at or above the activation threshold, is configured to melt and flow into the voids of the light scattering material thereby causing the light scattering material to transition from an obscuring form to a non-obscuring form so that the indicia is viewable through the light scattering material.

A stage apparatus including: an object table configured to hold an object; a positioning device configured to position the object table and the object held by the object table; and a remote temperature sensor configured to measure a temperature of the object table and/or the object, wherein the remote temperature sensor comprises a passive temperature sensing element.

A stage apparatus including: an object table configured to hold an object; a positioning device configured to position the object table and the object held by the object table; and a remote temperature sensor configured to measure a temperature of the object table and/or the object, wherein the remote temperature sensor comprises a passive temperature sensing element.

A method is provided for additively manufacturing an object. This method includes: depositing a layer of material on a build surface; consolidating at least a portion of the layer of material together to form a portion of the object, the consolidating comprising directing an energy beam onto the material to form a melt pool; directing a beam of light onto the melt pool; detecting a response from the beam of light interacting with the melt pool; and determining a parameter of the melt pool based on the detected response.

A condition monitoring device for monitoring machinery includes a combination of on-board sensors and a condition monitoring module. The on-board sensors include modules for non-contact temperature, magnetic flux and 3-axis vibration sensing of the machinery. The condition monitoring module provides a condition monitoring signal containing information about an operating condition of the machinery, based upon a data synthesis condition monitoring technique that synthesizes non-contact temperature, magnetic flux and 3-axis vibration sensed data received from the combination of on-board sensors, determines a current operating condition of the machinery, and compares the current operating condition and the baseline operating condition of the machinery.