A heated probe is provided that cooks food from the inside-out in order to help reduce cooking times. The probe may be used within an oven, or it may be used as a standalone cooking source. The probe may include heat control, such that foods may be cooked at a low temperature for extended periods of time without drying out the food. Such heat control may help keep proteins tender to produce a result similar to proteins cooked in a sous vide style.

A probe assembly for a cooking appliance includes an outer case that includes a cap, a body, and retention features that are coupled to each of the cap and the body. A first temperature sensor is operably coupled to the cap of the outer case. A probe is operably coupled to the body of the outer case and is selectively concealed by the cap. A second temperature sensor is operably coupled to the probe. A controller is communicatively coupled to each of the first temperature sensor and the second temperature sensor. The controller is configured to receive a first signal from the first temperature sensor when the cap is directly coupled to the body of the outer case.

The present disclosure relates to a system for the preparation of a food. The system comprises a monitoring device for monitoring the food during its preparation, a control device for the preparation of the food by means of a kitchen appliance and by means of an electronically stored recipe, and a mobile and/or non-mobile device. The monitoring device is able to communicate with the control device and the mobile and/or non-mobile device. The mobile and/or non-mobile device is configured such that it can transmit information of the monitoring device to a user. In particular, the control device is configured such that it recognizes possible absence times for a user during the controlled preparation of a food and informs the user thereof. The invention further relates to a food thermometer and a method.

Temperature probe systems and methods include a probe body having a sharp end adapted to penetrate an edible substance, a plurality of temperature sensing elements distributed along a length of the probe body, electrical components operable to receive data signals from the plurality of temperature sensing elements, the electrical components disposed in the probe body between the sharp end and at least one of the temperature sensing elements, and an insertion aid. The electrical components may include wireless components to facilitate communications with a host cooking appliance, and the temperature sensing elements may be used to measure temperature and communicate the temperature measurements via the wireless components to the host cooking appliance. The insertion aid, the probe body, and the temperature sensing elements may include one or more heat resistant materials.

Disclosed is a combined bluetooth thermometer. The combined bluetooth thermometer includes a body box, a first probe and a second probe, the first probe is detachably provided on the body box; the first probe along a length direction of the first probe successively includes a first temperature measurement section, a transition section and a charging section; the first temperature measurement section is configured for temperature measurement; and the charging section is configured for providing an electrical connection between the first probe and the body box for charging the first probe; the second probe includes a second temperature measurement section and a connecting section; the second temperature measurement section is configured for temperature measurement; and the connecting section is connected with the body box to rotationally connect the second probe with the body box.

A temperature-regulating unit includes a base, a resonant tank, and a controller. The base is configured to support a pan. The resonant tank includes a coil and a capacitor. The resonant tank has a resonant frequency that is affected by a material of the pan and a temperature of the pan. The controller is configured to receive a temperature setting, monitor the resonant frequency, determine the material of the pan based on the resonant frequency, determine the temperature of the pan based on the resonant frequency, and adaptively control a thermal element based on the temperature of the pan, the material of the pan, and the temperature setting.

The present disclosure relates to a food thermometer with a temperature sensor, with a rechargeable battery, with a coil through which the battery can be inductively charged. The food thermometer may comprise an elongated, liquid-tight container having an opening at an end face, wherein the opening is closed in a liquid-tight manner by a cap. The disclosure further relates to a charger for the food thermometer. The charger may be a food processor.

An oven having multiple oven cavity temperature sensors that provide improved monitoring of oven temperature and that permit improved oven temperature control is provided. Multiple temperature values from the different sensors may be combined or analyzed to provide a more consistent and accurate measurement of the temperature of the food being cooked. Patterns of temperature as a function of location in the oven cavity may be analyzed to detect abnormal but correctable temperature inhomogeneities (for example, cold spots or stratification) and used to adjust parameters of the oven control, (for example, by fan speed/direction adjustment, cycle control of the fan and heater elements) to provide more even temperature distributions.

Embodiments include systems and methods for heating materials, including heating materials for cooking and soldering. A representative system and method for cooking food includes passing electric current through the food, sensing a characteristic of the food, and modulating the electric current in response to the characteristic of the food to achieve a selected internal temperature of the food. The system and method can include searing the food with hot oil or photons directed at the surface of the food. A representative system and method for heating a material includes modulating a plurality of semiconductor light sources to emit photons toward the material, measuring a temperature of the material, and modulating the plurality of semiconductor light sources in response to the temperature of the material. The material can include solder and the method can include heating solder in a reflow soldering process.

In variants, an automatically-identifiable temperature probe can include: a probe body, one or more sensors, a connector, and/or any other suitable components. In variants, the method for temperature determination can include: determining a set of electrical signals, determining a temperature probe type based on the set of electrical signals, determining a sensor resolution model based on the temperature probe type, and determining a set of final temperature estimates based on the set of electrical signals and the sensor resolution model.