A stress measurement device includes a first obtaining unit obtaining thermal data including information indicating a temperature of a measuring region, a second obtaining unit obtaining data related to stress occurring in one part of the measuring region, and a controller finding stress occurring in the measuring region from the thermal data and the data related to the stress. The controller finds, first waveform data respectively on the one part and a part other than the one part based on a change with time of the thermal data, and second waveform data based on a change with time of the data related to the stress. The controller finds, disturbance data through a deduction of the second waveform data from the first waveform data on the one part, and stress data indicating stress occurring in the part through a deduction the disturbance data from the first waveform data on the part.

An apparatus includes a light source configured to emit light to a translucent material and an embedded feature disposed in the translucent material, a first linear polarizer configured to linearly polarize the emitted light, based on a first orientation of an optical axis of the first linear polarizer, and a second linear polarizer configured to filter the light that is reflected from the translucent material, from the light that is reflected from the embedded feature and the translucent material, based on a second orientation of an optical axis of the second linear polarizer. The apparatus further includes a sensor configured to receive the light reflected from the embedded feature, from which the light reflected from the translucent material is filtered, and capture an image of the embedded feature and the translucent material, based on the received light.

A discontinuous deformation measurement method based on infrared and visible light cameras may include: preparing a conductive film and a random speckle pattern on a surface of the conductive film; obtaining a visible image and an infrared image under a loading stage; applying a crack boundary detection to the visible image to obtain an initial coordinate of a micro-crack, determining an range of the micro-crack based on a temperature-rising region from the infrared image and the initial coordinate; setting a position corresponding to the range of the micro-crack in the visible image as a new region of interest; obtaining full-field principal tensile strains by a DIC method, and locating an accurate boundary of the micro-crack based on gradient distribution of the full-field principal tensile strains; analyzing displacement and strain fields around the micro-crack using the DIC method.

A stress distribution image processing device including: a processing unit configured to: designate a normalization region which includes a portion of stress equal to or larger than a predetermined threshold value in a screen of a stress distribution image of a target object; and normalize pixels in the normalization region based on stress values in the normalization region to obtain a normalized image.

The present disclosure relates to a method for measuring full-field strain of an ultra-high temperature (UHT) object based on a digital image correlation method. The temperature range is from normal temperature to 3500 degrees Celsius. The method includes the steps of selecting a proper high-temperature-resistant speckle material, tantalum carbide powder, according to the characteristics of the object to be measured. First, polishing a to-be-measured surface of a tungsten test piece to remove an oxide layer, then mixing the tantalum carbide (TaC) powder and absolute ethanol to form a paste according to a mass ratio of 1:2. Making randomly distributed speckles from the mixture on the to-be-measured surface of the test piece which has been processed. In order to improve firmness and stability of the newly made speckles, performing curing treatment to the speckles.

Provided is an evaluation method capable of evaluating stress on a bond which is difficult to detect by Raman spectroscopy. The present disclosure relates to an evaluation method including using infrared absorption spectra measured on a rubber specimen under application of no tensile force and under application of a tensile force to calculate an amount of peak shift caused by application of the tensile force, and evaluating stress in the rubber specimen from the amount of peak shift.

A stress analysis device for moving body, includes: an infrared camera that captures an infrared image of a moving body while making a relative movement with respect to the moving body; and an image processing unit that performs image processing on a plurality of the infrared images captured by the infrared camera. The image processing unit includes: an alignment unit that aligns portions of an object included in the moving body in the plurality of the infrared images including the object, and a stress distribution calculation unit that calculates temperature changes of each of the portions of the object to obtain stress distributions of the portions of the object based on the temperature changes.

An apparatus (12) for placement on the abdomen of a subject for monitoring uterine contractions. The apparatus includes a light source (16) and a light detector (18) which communicate light via a reflection surface (22) arranged facing the light source and light detector. One of the light source and light detector is fixed in position relative to the reflection surface, while the other is arranged to be displaceable relative to the reflection surface responsive to movement of the subjects abdomen caused by contractions. The movement of the moveable component is such as to cause a variation in the light intensity received at the light detector, the variation in light intensity being representative of the uterine contractions.

A stretchable strain sensor includes a light-emitting element, an optical structure, and a photo-detective element. The stretchable strain sensor is located in a path of light emitted from the light-emitting element. The optical structure is configured to have optical properties that change in response to stretching of at least a portion of the stretchable strain sensor. The photo-detective element is configured to detect light transmitted through the optical structure or reflected through the optical structure.

A stress distribution measurement method is a method of measuring stress distribution generated on a structural object including two support parts and a beam part provided between the support parts. The method includes: generating first image data by performing, through a first image capturing unit, image capturing of a moving object or an identification display object attached to the structural object from the moving object; calculating, based on the first image data, a movement duration in which the moving object moves between the support parts; generating, as second image data, thermal image data by performing image capturing of the surface of the beam part through a second image capturing unit; calculating a temperature change amount based on a second image data group corresponding to the movement duration; and calculating a stress change amount based on the temperature change amount to calculate stress distribution based on the stress change amount.