A stress measurement device includes a first obtaining unit obtaining thermal data including information indicating a temperature of a measuring region, a second obtaining unit obtaining data related to stress occurring in one part of the measuring region, and a controller finding stress occurring in the measuring region from the thermal data and the data related to the stress. The controller finds, first waveform data respectively on the one part and a part other than the one part based on a change with time of the thermal data, and second waveform data based on a change with time of the data related to the stress. The controller finds, disturbance data through a deduction of the second waveform data from the first waveform data on the one part, and stress data indicating stress occurring in the part through a deduction the disturbance data from the first waveform data on the part.

A structure which detects the application point, intensity and area of the force and the pressure applied, along with the touch, and the forces applied in vertical direction to the sensor as well as the combined forces, which has reduced power consumption. The sensing system has an intermediate layer; a light source located under the intermediate layer; an image sensor located under the intermediate layer; a first fiber optic bundle; a second fiber optic bundle; a control unit which analyzes the image captured by the image sensor using image processing techniques; and a data link for data communication between the image sensor and the control unit.

A stress properties measurement method for measuring properties of stresses generated in a structure includes acquiring, from a first imaging device, a plurality of thermal images corresponding to temperatures of a surface of the structure, the plurality of thermal images being different in imaging time from each other, generating a stress distribution image corresponding to each of the plurality of thermal images, acquiring a stress value of a first section that is smaller in stress gradient than a predetermined value and respective stress values of a plurality of second sections where stresses are concentrated for the stress distribution images, and deriving correlation properties of stresses at a section of the structure based on the stress value of the first section acquired and the respective stress values of the plurality of second sections acquired.

A stress distribution measurement method is a method of measuring stress distribution generated on a structural object including two support parts and a beam part provided between the support parts. The method includes: generating first image data by performing, through a first image capturing unit, image capturing of a moving object or an identification display object attached to the structural object from the moving object; calculating, based on the first image data, a movement duration in which the moving object moves between the support parts; generating, as second image data, thermal image data by performing image capturing of the surface of the beam part through a second image capturing unit; calculating a temperature change amount based on a second image data group corresponding to the movement duration; and calculating a stress change amount based on the temperature change amount to calculate stress distribution based on the stress change amount.

A light-intensity-based forced sensor comprises a Sarrus linkage, a biasing mechanism, a light emitter, and a light detector includes a first plate, a second plate, and at least one collapsible linkage pivotably coupled to both the first and the second plates. The biasing mechanism biases the collapsible linkage toward an extended configuration. The light emitter is coupled with and displaceable with the first plate; and the light detector is coupled with and displaceable with the second plate and configured to receive light emitted from the light emitter and generate an electrical signal in response to light received from the light emitter, wherein the generated electrical signal provides an indication of the distance between the first plate and the second plate. The sensor can be distally mounted on, e.g., an endoscope to provide haptic feedback at the distal end of the endoscope.

A stress analysis device for moving body, includes: an infrared camera that captures an infrared image of a moving body while making a relative movement with respect to the moving body; and an image processing unit that performs image processing on a plurality of the infrared images captured by the infrared camera. The image processing unit includes: an alignment unit that aligns portions of an object included in the moving body in the plurality of the infrared images including the object, and a stress distribution calculation unit that calculates temperature changes of each of the portions of the object to obtain stress distributions of the portions of the object based on the temperature changes.

Inspection of microelectronic devices is described using near infrared light. In one example, a dielectric material layer on a substrate is illuminated with a near infrared light beam. The substrate has at least one contact land, the dielectric material layer overlies at least a portion of the contact land, and the substrate has at least one via defined in the dielectric material layer, the via exposing at least a portion of the contact land. Reflected near infrared light is reflected from the substrate at a camera. The position of the via is determined relative to the contact land from the reflected light beam using an image processing device.

An objective of the present invention is to quantitatively estimate the residual stress of an object. The present invention provides a method for estimating the residual stress of an object, the method comprising: irradiating an object with terahertz waves; measuring polarization intensity of the terahertz waves transmitted through or reflected by the object; and calculating tensile stress of the object based on the measured polarization intensity. In one embodiment, calculating the tensile stress includes calculating the tensile stress based on a relationship between polarization intensity and tensile stress derived from: a relationship between polarization intensity and tensile distance; and a relationship between tensile distance and tensile stress.

A witness material for monitoring an environmental history of an object may include a material containing a dye of a type that fluoresces in response to actinic radiation in one or both of a shift in color and a change in intensity when subjected to a predetermined stress above a predetermined level; and the material forming a coating on one or more of an outer container for the object, an inner container for the object, a tape that is applied to an outer container for the object, a tape that is applied to an inner container for the object, a shrink wrap enclosing the object, an outer surface of the object, and an inner surface of the object.

A testing apparatus may include a stand having an aperture and a platform adjacent to the aperture, a clamp adjacent to the platform and configured to hold a coupon, and an actuator within the aperture. The actuator is configured to impart a first force on the platform and the coupon at a specified frequency. The testing apparatus may also include a displacement sensor adjacent to the stand and configured to measure a displacement of the coupon and circuitry connected to the actuator and the displacement sensor with the circuitry configured to collect data from the actuator and the displacement sensor.