In a microelectromechanical system (MEMS) pressure sensor, thin and fragile bond wires that are used in the prior art to connect a MEMS pressure sensing element to an application specific integrated circuit (ASIC) for the input and output signals between these two chips are replaced by stacking the ASIC on the MEMS pressure sensing element and connecting each other using conductive vias formed in the ASIC. Gel used to protect the bond wires, ASIC and MEMS pressure sensing element can be eliminated if bond wires are no longer used. Stacking the ASIC on the MEMS pressure sensing element and connecting them using conductive vias enables a reduction in the size and cost of a housing in which the devices are placed and protected.

Electrical and mechanical noise in a microelectromechanical system (MEMS) pressure sensor are reduced by the symmetrical distribution of bond pads, conductive vias and interconnects and by the elimination of bond wires used in the prior art to connect a MEMS pressure sensing element to an application specific integrated circuit (ASIC). The bond wires are eliminated by using conductive vias to connect an ASIC to a MEMS pressure sensing element. Extraneous electrical noise is suppressed by conductive rings that surround output signal bond pads and a conductive loop that surrounds the conductive rings and bond pads. The conductive rings and loop are connected to a fixed voltage or ground potential.

A process fluid pressure measurement probe includes a pressure sensor formed of a single-crystal material and mounted to a first metallic process fluid barrier and disposed for direct contact with a process fluid. The pressure sensor has an electrical characteristic that varies with process fluid pressure. A feedthrough is formed of a single-crystal material and has a plurality of conductors extending from a first end to a second end. The feedthrough is mounted to a second metallic process fluid barrier and is spaced from, but electrically coupled to, the pressure sensor. The pressure sensor and the feedthrough are mounted such that the secondary metallic process fluid barrier is isolated from process fluid by the first metallic process fluid barrier.

A pressure-sensor device (1) has: —a component sensitive to pressure, comprising a sensor body (5), with an elastically deformable membrane part (5a), and at least one detection element (6) for detecting a deformation of the membrane (5a); —a structure (2, 3) for housing or supporting the pressure-sensitive component, having at least one passageway (15) for a fluid the pressure of which is to be detected, the housing or supporting structure (2, 3) comprising a supporting body (2) with respect to which the sensor body (5) is positioned in such a way that its membrane part (5a) is exposed to the fluid coming out of the passageway (15), the supporting body (2) having a hydraulic-connection portion (2a) and a duct (14) that extends from the hydraulic-connection portion (2a); —at least one elastically deformable body (16), formed with one or more elastically deformable or compressible materials, comprising at least one from among: —a compressible compensation element (20, 21), configured for compensating any possible variations in volume of the fluid; —a sealing element (13, 17); configured for providing a seal with respect to at least one of the housing or supporting structure (2, 3), and the sensor body (5); and—a supporting element (23), configured for supporting or positioning the sensor body (5) with respect to the housing or supporting structure (2, 3). At least one from among the compressible compensation element (16), the sealing element (13, 17) and the supporting element (23) is overmoulded on at least one of the housing or sup porting structure (2, 3) and the sensor body (5).

A pressure sensor includes a housing with a cavity. The cavity includes a fill fluid and a compensation material. The fill fluid conveys a pressure from a process fluid through a diaphragm to a sensor. The compensation material reduces a difference of thermal expansions between the cavity and the fill fluid.

A pressure sensor includes a housing with a cavity. The cavity includes a fill fluid and a compensation material. The fill fluid conveys a pressure from a process fluid through a diaphragm to a sensor. The compensation material reduces a difference of thermal expansions between the cavity and the fill fluid.

A system for controlling the position of a diaphragm in a diaphragm-containing pressure pod, is provided. The system can include a peristaltic pump, a pressure pod having a flow-through fluid side and a gas side that are separated by a diaphragm, and a pressure sensor operatively connected to the gas side. The pressure sensor is configured to sense pulses of pressure resulting from movement of the diaphragm and caused by the action of the peristaltic pump. A gas source and a valve can be in fluid communication with the gas side of the pressure pod and can be configured to provide gas to, or vent gas from, the gas side. A controller receives pressure signals from the pressure sensor and controls the valve in response, and in so doing, controls the position of the diaphragm. Methods for positioning the diaphragm are also included.

A pressure sensor includes a tubular housing; a diaphragm which is joined to one end portion of the housing through a fusion zone; and a sensor element which is disposed in the housing and to which pressure received by the diaphragm is transmitted. As viewed in a section which contains the center axis of the housing, a pair of the fusion zones exist, and each of the fusion zones is formed in such an inclined manner that its distance from the center axis increases as it extends from the outer surface of the diaphragm toward the other-end-portion side of the housing.

An improved structure of pressure gauge includes a bottom case, a pressure measurement assembly, a rotating assembly, a fulcrum piece, a coil spring, a scale meter, and an outer case. The pressure measurement assembly is installed above the bottom case and the surface thereof is shaped with concentric circular waves. The rotating assembly includes a sleeve body and a central rod. A fulcrum piece is installed across between the sleeve body and the central rod. A plurality of through holes and a coil retaining base are provided on the fulcrum piece. One end of the coil spring is screwed onto the coil slot and the other end thereof is installed on the coil retaining base. The outer case is located in the outer area of the bottom case and the fulcrum piece. A transparent cover body is installed on top of the outer case.

A microelectromechanical system (MEMS) device includes a first movable element and a second movable element, wherein the second movable element is connected with a movable membrane for sensing pressure to make the second movable element move with the movable membrane to sense the pressure variation of the external environment, and other portion of the substrate forming the movable membrane can form a cap to protect the first movable element for sensing other physical quantity.

Accordingly, the pressure sensor and the MEMS structure for sensing other physical quantity can be integrated in the foregoing MEMS device by a single process.