G01L9/0002

Microelectromechanical scalable bulk-type piezoresistive force/pressure sensor

A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer is arranged between the front surface of the sensor die and the bottom surface of the cap die, patterned to define a groove traversing its entire thickness along the vertical direction; the piezoresistive elements are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied to the front surface of the cap die and/or bottom surface of the sensor die along the vertical direction into a planar stress distribution at the groove, acting in the horizontal plane.

Pressure sensor for a metal or plastics processing tool
10987843 · 2021-04-27 · ·

A space-saving pressure sensor for a metal or plastics processing tool is configured to perform date stamping during injection molding with the processing tool. The pressure sensor is configured to be inserted into a single drilled hole of the tool. A first cast-compatible mark and a second cast-compatible mark of the pressure sensor may be adjusted against one another in such a way that a variety of different date marks can be created, which may then be applied to different injection-molded products. The pressure sensor may be used within the framework of manufacturing an injection-molded product.

Multifunctional pressure, displacement and temperature gradient sensor

A multifunctional pressure, displacement, and temperature gradient sensor employs powders of one or more of carbon nanotubes (CNTs) or graphene. These powders are placed in a hollow body which has a fixed electrode on one end and moveable electrode on the other. The powders are compressible, and movements of the moveable electrode sliding within the sensor can be accurately detected. Thermocouples on each electrode permit measuring the gradient of temperature for the calibration of the multifunctional sensor and also for the measurement of resistance, thermoelectric voltage and thermoelectric current of the sensor.

Pressure-strain sensor including a graphene structure

Provided is a pressure-strain sensor including a graphene structure having a three-dimensional porous structure, planar sheets provided on a surface of the graphene structure, and a polymer layer configured to cover the graphene structure and the planar sheets, wherein each of the planar sheets contains a transition metal chalcogenide compound.

HIGH PRESSURE CAPSULE AND HEADER FOR PROCESS FLUID PRESSURE TRANSMITTER
20210089063 · 2021-03-25 ·

A pressure capsule/header assembly for a process fluid pressure transmitter is provided. An isolator plug has an isolation diaphragm at a first end thereof and a second end spaced from the first end. The isolator plug has a fill fluid passageway fluidically coupling the first end to the second end. A header has a first end configured to carry a pressure sensor and a second end spaced from the first end. The header has at least one electrical interconnect extending from the first end to the second end. A biaxial support ring is disposed about an outer surface of the header. The biaxial support ring and the header define a tapered interference interface therebetween. The header is welded to the isolator plug at a first weld and the biaxial support ring is welded to the isolator plug at a location that is spaced from the second end of the header.

Thermal Conductivity Gauge
20210208016 · 2021-07-08 ·

A thermal conductivity gauge measures gas pressure within a chamber. A sensor wire and a resistor form a circuit coupled between a power input and ground, where the sensor wire extends into the chamber and connects to the resistor via a terminal. A controller adjusts the power input, as a function of a voltage at the terminal and a voltage at the power input, to bring the sensor wire to a target temperature. Based on the adjusted power input, the controller can determine a measure of the gas pressure within the chamber.

METHODS AND SYSTEMS FOR DISTRIBUTED TEMPERATURE AND PRESSURE SENSING COMPRISING A POLYMER FIBER
20200386939 · 2020-12-10 ·

In one aspect, the disclosure relates to multi-material fibers capable of distributedly measuring temperature and pressure in which the methods comprise a thermal drawing step, and the methods of fabricating the disclosed fibers. The fibers can be utilized in methods of temperature and pressure mapping or sensing comprising electrical reflectometry for interrogation. Further disclosed are devices comprising a disclosed fiber with the multi-point detection capability with simple one-end connection. Also disclosed are articles, e.g., smart clothing, wound dressing, robotic skin and other industrial products, comprising a disclosed fiber or a fabric comprising a disclosed fiber. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.

Thermal conductivity gauge

A thermal conductivity gauge measures gas pressure within a chamber. A sensor wire and a resistor form a circuit coupled between a power input and ground, where the sensor wire extends into the chamber and connects to the resistor via a terminal. A controller adjusts the power input, as a function of a voltage at the terminal and a voltage at the power input, to bring the sensor wire to a target temperature. Based on the adjusted power input, the controller can determine a measure of the gas pressure within the chamber.

MICROELECTROMECHANICAL SCALABLE BULK-TYPE PIEZORESISTIVE FORCE/PRESSURE SENSOR

A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer is arranged between the front surface of the sensor die and the bottom surface of the cap die, patterned to define a groove traversing its entire thickness along the vertical direction; the piezoresistive elements are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied to the front surface of the cap die and/or bottom surface of the sensor die along the vertical direction into a planar stress distribution at the groove, acting in the horizontal plane.

Pressure sensor

Object: To provide a pressure sensor that can provide a reduced sensation of a foreign body and that has a good sensitivity to pressure from a low load region to a high load region. Resolution means: The pressure sensor includes a variable resistor and a plurality of electrodes. The variable resistor is made of an electrically conductive foam elastomer material. The electrically conductive foam elastomer material is a material imparted with electrical conductivity by dispersing electrically conductive fillers into an elastomer material and obtained by foaming the elastomer material. The plurality of electrodes are disposed at intervals from each other on one surface in contact with the variable resistor.