An integrated circuit (IC) device includes a pressure sensor die, a flexible gel covering a least a pressure-sensing region of the die, and a flexible diaphragm covering the gel. The IC device has encapsulant and a lid that define a cavity above the diaphragm. The lid has an aperture that enables proximate ambient air pressure outside the device to be sensed by the pressure-sensing region through the flexible diaphragm and the flexible gel. The diaphragm protects the gel material from potentially harmful ambient materials. The diaphragm may be a part of the lid.

A microfabricated pressure transducer is formed in a multilayer substrate by etching a plurality of shallow and deep wells into the layers, and then joining these wells with voids formed by anisotropic etching. The voids define a flexible membrane over the substrate which deforms when a force is applied.

A pressure sensor includes a substrate that has a diaphragm which bends and deforms by receiving pressure and a displacement regulating unit that regulates deformation of the diaphragm, in which the diaphragm and the displacement regulating unit are spaced away from each other in a first state where the diaphragm receives pressure within a measurable range, and the diaphragm and the displacement regulating unit come into contact with each other in a second state where the diaphragm receives pressure exceeding the measurable range.

A waterproof pressure sensor includes a pressure detection element, a cavity package configured to be provided with a recess in which the pressure detection element is mounted and an edge provided around the recess, a cover member attached to the edge of the cavity package and to be provided with a pressure introducing hole having a diameter smaller than a diameter of an opening of the recess in a plan view at a position overlapping the recess, and a gel agent configured to be provided in the recess, in which an exhaust portion is provided at the cover member at least on the recess side, the exhaust portion being capable of discharging air in the recess to the outside when the gel agent is injected from the pressure introducing hole into the recess, and the exhaust portion is filled with the gel agent.

A pressure sensor includes an SOI substrate which has a first silicon layer, a second silicon layer placed on one side of the first silicon layer, and a silicon oxide layer placed between the first and second silicon layers, and a concave section which opens to the surface on the first silicon layer side of the SOI substrate, wherein in a plan view of the SOI substrate, a portion overlapping the concave section of the SOI substrate becomes a diaphragm which is flexurally deformed by receiving a pressure, and the second silicon layer is exposed on the bottom surface of the concave section.

An electronic device includes a package including an opening, and a cavity communicating with the opening, a pressure sensor element disposed in the cavity, and a waterproof unit is disposed in the package so as to cover the opening, in which the waterproof unit includes a through hole that is a separate body from the package, blocks passing of liquid, and permits passing of gas from an outside of the package into an inside of the cavity.

The present disclosure provides a composite sensor and a manufacturing method thereof. The composite sensor includes: a first substrate and a second substrate configured to be laminated with the first substrate; a pressure sensor located on the first substrate and configured to sense a change in external pressure; and an acceleration sensor located on the second substrate and configured to sense a change in acceleration. A pressure film of the pressure sensor is configured to be spaced from the second substrate to form a pressure cavity, and a proof mass of the acceleration sensor is configured to be spaced from the first substrate to form a first anti-collision cavity. The present disclosure may reduce the chip area and reduce mutual interference.

A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.

[Object] Provided are a pressure detection unit and a pressure sensor using the same capable of performing a trimming operation using a simple structure during an assembly operation, and reducing a decrease in detection accuracy of a semiconductor type pressure detection device.

[Solving Means] A pressure detection unit includes a base formed in a lid shape and made of ceramic, a receiving member formed in a plate shape, a diaphragm interposed between the base and the receiving member, a semiconductor type pressure detection device installed on a side of a pressure receiving space formed between the base and the diaphragm in the base, and three terminal pins electrically connected to the semiconductor type pressure detection device, the terminal pins penetrating the base, wherein the three terminal pins include an earth terminal pin, a power input terminal pin, and a signal output terminal pin.

[Object] Provided are a pressure detection unit and a pressure sensor using the same capable of suppressing an increase in manufacturing man-hours due to use of an additional member, and ensuring insulation of a semiconductor type pressure detection device.

[Solving Means] A pressure detection unit includes a base formed in a lid shape and made of ceramic, a receiving member formed in a plate shape, a diaphragm interposed between the base and the receiving member, a semiconductor type pressure detection device installed on a side of a pressure receiving space formed between the base and the diaphragm in the base, and terminal pins electrically connected to the semiconductor type pressure detection device, the terminal pins penetrating the base, wherein a metal layer is provided in a region around the semiconductor type pressure detection device on a surface of the base on the side of the pressure receiving space.