A method for manufacturing a pressure sensor includes: preparing a stem which has a cylindrical shape with a bottom as a diaphragm; mounting a sensor chip on the diaphragm; preparing a conductive member, in which an internal connection region is integrated with an external connection region electrically connected to an external circuit by an outer frame; forming a first resin mold to couple the internal connection region to the external connection region; separating the outer frame from the internal connection region and the external connection region; arranging the internal connection region in the stem; and electrically connecting the sensor chip and the internal connection region through the first connection member.

A pressure sensor includes an elongate body which deforms in response to an applied pressure having a cavity formed therein. An isolation diaphragm seals the cavity from a process fluid and is configured to deflect in response to applied process pressure from the process fluid. An isolation fill fluid in the cavity applies pressure to the elongate body in response to deflection of the isolation diaphragm thereby causing deflection of the elongate body. A deformation sensor is coupled to the elongate body and provides a sensor output in response to deformation of the elongate body which is indicative of the process pressure.

A pressure sensor has a circuit arrangement supported by a sensor body and includes: a first electrical-circuit pattern, having respective tracks made of electrically conductive material deposited on a first face of an electrically insulating material, a second electrical-circuit pattern having respective tracks made of electrically conductive material deposited on a region of the second face of the material, and connection means, which electrically connect the first electrical-circuit pattern to the second electrical-circuit pattern. Tracks of the second electrical-circuit pattern have at least one first track defining a plurality of first pads and one second track defining a plurality of second pads, for connection of a first terminal and of a second terminal of the second circuit component, respectively. The first and second track are prearranged so that the first terminal and the second terminal can be connected to any one of the first pads and the second pads.

A sensor for detecting pressure, filling level, density, temperature, mass and/or flow rate, wherein at least one central sensor component is coupled to a further component by nanowires and wherein the sensor component is stiffened, fixed and/or electrically contacted this way.

A measurement portion and an antenna are allowed to be provided in a filter device by simply mounting one member. An antenna unit that includes an antenna configured to communicate with an IC tag is provided in a vicinity of a first end face as one end of a case. A sensor is provided inside the case and a back side of the case with respect to the antenna unit.

A sensor device is described. The sensor device includes at least one substrate; an edge region that is disposed on the substrate and laterally delimits an inner region above the substrate; a diaphragm that is anchored on the edge structure and at least partly spans the inner region, the diaphragm encompassing in the inner region at least one region which is movable by way of a pressure and which encloses a cavity between the diaphragm and the substrate; and a first intermediate carrier that extends in the movable region below the diaphragm and is connected to the diaphragm, and in particular has at least one trench.

A pressure sensor assembly includes a pressure sensor, a pedestal and an electrically conductive header having a header cavity. The pressure sensor includes, an electrically conductive sensing layer having a sensor diaphragm, an electrically conductive backing layer having a bottom surface that is bonded to the sensing layer, an electrically insulative layer having a bottom surface that is bonded to a top surface of the backing layer, and a sensor element having an electrical parameter that changes based on a deflection of the sensor diaphragm in response to a pressure difference. The pedestal is bonded to the electrically insulative layer and attached to the header within the header cavity.

Disclosed is a pressure transducer including a body made of a material having a first coefficient of thermal expansion, a fluidic inlet and a fluidic cavity enclosed by the body in fluidic communication with the fluidic inlet. The pressure transducer further includes a strain gauge including a resistive element in operable contact with the body. At least a portion of the resistive element made of a material having a second coefficient of thermal expansion that is different from the first coefficient of thermal expansion of the body. Disclosed further is a pressure transducer including a filler body located in a fluidic cavity of the pressure transducer configured to reduce adiabatic thermal effects on a transducer body. Disclosed are systems and methods incorporating the pressure transducers described herein.

The disclosed invention provides a bridge voltage inversion circuit for vacuum gauge and a pressure gauge sensor that includes the bridge voltage inversion circuit. The bridge voltage inversion circuit for a pressure gauge includes a reference capacitance, a sensor capacitance, and a transformer including a primary winding and a secondary winding that outputs a bridge voltage. The reference capacitor is connected to a first side of the secondary winding of the transformer, and the sensor capacitor is connected to a second side of the secondary winding of the transformer. The sensor capacitor senses and responds to a pressure, and a capacitance of the sensor capacitor is at a minimum when the pressure is at vacuum. The capacitance of the sensor capacitor at vacuum is less than a capacitance of the reference capacitor.

A pressure gauge includes an introduction member, a connection member, a bourdon tube, a pointer, a dial plate, a detector, and an information communication unit. A battery installed in the information communication unit is disposed between a circuit board and a lid. The information communication unit is inserted in a through hole of the dial plate to be disposed astride between a front surface and a rear surface of the dial plate and the lid is disposed on a side of the information communication unit close to the front surface of the dial plate.