A force-measuring device includes a first substrate, signal processing circuitry, a thin-film piezoelectric stack overlying the first substrate, and piezoelectric micromechanical force-measuring elements (PMFEs). The thin-film piezoelectric stack includes a piezoelectric layer. The PMFEs are located at respective lateral positions along the thin-film piezoelectric stack.

Each PMFE has: (1) a first electrode, (2) a second electrode, and (3) a respective portion of the thin-film piezoelectric stack. The first electrode and the second electrode are positioned on opposite sides of the piezoelectric layer to constitute a piezoelectric capacitor. Each of the PMFEs is configured to output voltage signals (PMFE voltage signals) between the respective first and second electrodes in accordance with a time-varying strain at the respective portion of the piezoelectric layer between the respective first and second electrodes resulting from a low-frequency mechanical deformation. The signal processing circuitry is configured to read at least some of the PMFE voltage signals.

A sensor package comprises a MEMS sensor chip, a cover arranged over a first main surface of the MEMS sensor chip, said cover being fabricated from a mold compound, and an electrical through contact extending through the cover and to electrically couple the sensor package to a circuit board arranged over the cover.

A pressure measuring device configured as a multi-function device operable as a differential pressure switch (DPS); a differential pressure transducer (DPT); a pressure switch (PS); a pressure transducer (PT) providing readings of high and low pressure zones; a data recording logger; and a backwashing controller. The pressure measuring device may use at least two piezoelectric sensors operable to measure pressure attributes. The associated electronic hardware, processing unit, cables and pressure tubing are retrofittable and packaged in a molded case, with no moving parts with the electronic hardware fully coated to make the device reliable and resistant to extreme environmental conditions. The device is configured for remote access, enabling remote device configuration, maintenance and servicing. The device is further operable to communicate with various external devices: a tablet, a smartphone and the like as a user interface and further provides wired interface with a programmable logic controller (PLC) via RS-485 interface.

A multi-layer sealing film for high seal yield is provided. In some embodiments, a substrate comprises a vent opening extending through the substrate, from an upper side of the substrate to a lower side of the substrate. The upper side of the substrate has a first pressure, and the lower side of the substrate has a second pressure different than the first pressure. The multi-layer sealing film covers and seals the vent opening to prevent the first pressure from equalizing with the second pressure through the vent opening. Further, the multi-layer sealing film comprises a pair of metal layers and a barrier layer sandwiched between metal layers. Also provided is a microelectromechanical systems (MEMS) package comprising the multilayer sealing film, and a method for manufacturing the multi-layer sealing film.

A pressure sensor includes: a housing having a tubular shape, and including a front end including an opening; a diaphragm that is disposed to close the opening, and is structured to deform depending on a pressure exerted on a front side of the diaphragm, and includes a hole extending rearwardly from a front end face of the diaphragm; a sensor element structured to output a signal varying depending on an amount of the deformation of the diaphragm; and a heat receiver including a first portion and a second portion. The first portion is disposed in the hole of the diaphragm, and is joined with an inner periphery of the diaphragm defining the hole. The second portion is formed integrally with the first portion, and is disposed adjacent to a front end of the first portion, and is structured to cover the front end face of the diaphragm.

The differential pressure gauge includes a base, a first part disposed on an upper surface of the base, a second part disposed on the first part, and a diaphragm layer disposed between the first part and the second part. A wall is formed in a second pressure chamber formed in the second part between a first region on a side including a pressure-receiving portion and a second region on a side including a first through-hole, with a gap defined with respect to inner walls of the second pressure chamber.

A pressure sensor includes: a housing having a tubular shape, and including a front end including an opening; a diaphragm that is disposed to close the opening, and is structured to deform depending on a pressure exerted on a front side of the diaphragm, and includes a hole extending rearwardly from a front end face of the diaphragm; a sensor element structured to output a signal varying depending on an amount of the deformation of the diaphragm; and a heat receiver including a first portion and a second portion. The first portion is disposed in the hole of the diaphragm, and is joined with an inner periphery of the diaphragm defining the hole. The second portion is formed integrally with the first portion, and is disposed adjacent to a front end of the first portion, and is structured to cover the front end face of the diaphragm.

A pressure sensor that includes a piezoelectric film having a flat part and a curved part and having opposed first and second main surfaces, a first electrode on the first main surface of the piezoelectric film, and a second electrode on the second main surfaces of the piezoelectric film. When the flat part of the piezoelectric film receives a pressing operation a first output is generated, and when the curved part of the piezoelectric film receives a pressing operation a second output different from the first output is generated.

In micromechanical pressure sensor device and a corresponding production method, the micromechanical pressure sensor device is provided with a first diaphragm; an adjacent first cavity; a first deformation detection device situated in and/or on the first diaphragm for detecting a deformation of the first diaphragm as a consequence of an applied external pressure change and as a consequence of an internal mechanical deformation of the pressure sensor device; a second diaphragm; an adjacent second cavity; and a second deformation detection device situated in and/or on the second diaphragm for detecting a deformation of the second diaphragm as a consequence of the internal mechanical deformation of the pressure sensor device, where the second diaphragm is developed in such a way that it is not deformable as a consequence of the external pressure change.

A pressure sensor including a housing extending along an axial line, a diaphragm fixed to a front-end side of the housing, a piezoelectric unit disposed in a hole in the housing and including a piezoelectric element, a transmission member that transmits deformation of the diaphragm to the piezoelectric unit, and a guide member having a through hole extending along the axial line and surrounding the piezoelectric unit in the through hole. (SL/AL)≤0.26 is satisfied in the cross section perpendicular to the axial line passing through the piezoelectric element, where SL is the maximum value of the distance in the radial direction between the center of the through hole and the center of the piezoelectric element and AL is the maximum value of the distance in the radial direction between the outside surface of the piezoelectric element and the center of the through hole.