A high pressure hydraulic system comprising: a hydraulic chamber containing pressurized fluid, a wall which encloses at least one part of the hydraulic chamber and has an integral diaphragm, a piezoelectric sensor isolated from the pressurized fluid contained in the hydraulic chamber by the diaphragm, and an elastic element arranged to apply an elastic force to the piezoelectric sensor, between the piezoelectric sensor and the diaphragm, so that a deformation of the diaphragm produced by a change in the pressure of the fluid contained in the hydraulic chamber causes a change in the elastic force that the elastic element applies to the piezoelectric sensor.

A pressure sensor die especially suitable for high-temperature, high-pressure operating environment and delivering accurate and reliable pressure measurement at low cost. A single crystalline silicon includes a cap, a substrate and a base connected together. A recess formed on the cap creates an upper sealed cavity with the substrate. A silicon oxide layer is formed between the substrate and the cap. A recess formed on the base creates a lower sealed cavity with the substrate. The upper sealed cavity and the lower sealed cavity overlap in their projections. The substrate includes at least two sets of piezoresistive sensing elements located within the overlapping projections, perpendicular to each other, and oriented in different crystallographic directions.

A micromechanical pressure sensor device is equipped with a sensor substrate including a front side and a rear side. The device includes a pressure sensor unit suspended in the sensor substrate, a first cavity above the pressure sensor unit, which is exposed toward the front side via one or multiple access openings, one or multiple stress relief trenches, which laterally enclose the pressure sensor unit and form a fluidic connection from the rear side to the first cavity, and a circuit substrate, on which the rear side of the sensor substrate is bonded. A second cavity, which is in fluidic connection with the stress relief trenches, is formed below the pressure sensor unit in the circuit substrate. At least one channel is provided in a periphery of the pressure sensor unit, which is in fluidic connection with the second cavity and is exposed to the outside.

A pressure sensor including: a cylindrical casing extending in an axial direction; a diaphragm joined to the distal end side of the casing, extending in a direction intersecting the axis of the casing and deforming in accordance with pressure received on the distal end side; and a sensor section disposed inside the casing and outputting an electric signal corresponding to the deformation of the diaphragm. The diaphragm is provided with a plate-shaped base part and three or more protruding parts protruding from the distal end side surface of the base part toward the distal end side and set apart from each other. The relationships 0.05H2.5T and 0.05(S2/S1)0.8 are satisfied, where T (thickness), H (length), S1 (area of base distal end surface) and S2 (total area of protruding distal end surfaces) are as defined herein.

A pressure sensor according to an aspect of the present invention comprises a plurality of piezoelectric elements that are sheet-like and laminated, wherein: the plurality of piezoelectric elements are divided into a plurality of element groups; and the plurality of element groups are connected in parallel and in each element group the piezoelectric elements are connected in series, or the plurality of element groups are connected in series and in each element group the piezoelectric elements are connected in parallel.

A method for manufacturing a micromechanical component having a disengaged pressure sensor device includes: configuring an electrically conductive sacrificial element in or on a first outer surface of a first substrate; applying a second substrate on or upon the outer surface of the first substrate over the sacrificial element; configuring a pressure sensor device by anodic etching of the second substrate; configuring in the second substrate at least one trench that extends to the sacrificial element; and at least partly removing the sacrificial element in order to disengage the pressure sensor device.

A multi-layer sealing film for high seal yield is provided. In some embodiments, a substrate comprises a vent opening extending through the substrate, from an upper side of the substrate to a lower side of the substrate. The upper side of the substrate has a first pressure, and the lower side of the substrate has a second pressure different than the first pressure. The multi-layer sealing film covers and seals the vent opening to prevent the first pressure from equalizing with the second pressure through the vent opening. Further, the multi-layer sealing film comprises a pair of metal layers and a barrier layer sandwiched between metal layers. Also provided is a microelectromechanical systems (MEMS) package comprising the multilayer sealing film, and a method for manufacturing the multi-layer sealing film.

The invention relates to a method for producing a sensor housing for a pressure sensor and to a sensor housing for a pressure sensor, to a pressure sensor having such a sensor housing, and to the use of an additive production device for producing such a sensor housing. A sensor body and/or at least one membrane stamp is applied to a provided metal plate by means of additive production. The additive production produces an integrally joined, in particular planar joint connection between the sensor body and/or the at least one membrane stamp, on the one side, and the metal plate, on the other side.

A method for manufacturing a micromechanical component having a disengaged pressure sensor device includes: configuring an electrically conductive sacrificial element in or on a first outer surface of a first substrate; applying a second substrate on or upon the outer surface of the first substrate over the sacrificial element; configuring a pressure sensor device by anodic etching of the second substrate; configuring in the second substrate at least one trench that extends to the sacrificial element; and at least partly removing the sacrificial element in order to disengage the pressure sensor device.

A pressure sensor including: a cylindrical casing extending in an axial direction; a diaphragm joined to the distal end side of the casing, extending in a direction intersecting the axis of the casing and deforming in accordance with pressure received on the distal end side; and a sensor section disposed inside the casing and outputting an electric signal corresponding to the deformation of the diaphragm. The diaphragm is provided with a plate-shaped base part and three or more protruding parts protruding from the distal end side surface of the base part toward the distal end side and set apart from each other. The relationships 0.05H2.5T and 0.05(S2/S1)0.8 are satisfied, where T (thickness), H (length), S1 (area of base distal end surface) and S2 (total area of protruding distal end surfaces) are as defined herein.