Targeted antimicrobials are described and related, compositions, methods and systems.

There are disclosed pressure-sensitive acoustic resonators and remote pressure sensing systems and methods. A pressure-sensitive acoustic resonator includes a conductor pattern formed on a planar surface of a dielectric substrate, the conductor pattern including an interdigital transducer (ICP), and a diaphragm, the diaphragm being a portion of a plate of single-crystal piezoelectric material, the diaphragm having a front surface exposed to an environment and a back surface facing, but not contacting, the ICP.

A multi-layer sealing film for high seal yield is provided. In some embodiments, a substrate comprises a vent opening extending through the substrate, from an upper side of the substrate to a lower side of the substrate. The upper side of the substrate has a first pressure, and the lower side of the substrate has a second pressure different than the first pressure. The multi-layer sealing film covers and seals the vent opening to prevent the first pressure from equalizing with the second pressure through the vent opening. Further, the multi-layer sealing film comprises a pair of metal layers and a barrier layer sandwiched between metal layers. Also provided is a microelectromechanical systems (MEMS) package comprising the multilayer sealing film, and a method for manufacturing the multi-layer sealing film.

An assembly includes a housing along a fluid line through which gas can flow with the housing having an annular shape, a housing groove extending circumferentially around a radial interior, and a sense hole adjacent the housing groove in a bottom side of the housing; and a piezometer ring disposed within the housing groove and coaxial with the housing. The piezometer ring includes a ring groove extending circumferentially around a radially outer side adjacent the housing and a plurality of ring holes extending radially through the piezometer ring with the plurality of ring holes including two bottom holes closest to the bottom side of the housing that are spaced farther apart from one another than from adjacent holes of the plurality of ring holes.

A MEMS device includes a backing wafer with a support portion and central back plate connected to the support portion with spring flexures, a diaphragm wafer with a support portions and a sensing portion connected to the support portion with spring flexures, a passivation layer on the diaphragm, and a topping wafer. The device allows for stress isolation of a diaphragm in a piezoresistive device without a large MEMS die.

Provided is a pressure sensing element including a first electrode, a pressure sensing unit on the first electrode, a second electrode disposed on the pressure sensing unit and having first and second points on a top surface thereof, a first elastic member on the second electrode, and a second elastic member on the first elastic electrode, wherein a thickness of the first elastic member decreases from the first point toward the second point, and a thickness of the second elastic member increases from the second point toward the first point.

A pressure sensor is provided, the sensor comprising an inlet for connecting to a body of gas; a diaphragm assembly comprising a first diaphragm and a second diaphragm, the first and second diaphragms defining a chamber therebetween, the chamber being connected to the inlet; a first transducer responsive to movement of the first diaphragm and operable to produce a first electrical signal in response to the same; and a second transducer responsive to movement of the second diaphragm and operable to produce a second electrical signal in response to the same; and an amplifier disposed in the chamber of the diaphragm assembly and connected to the first and second transducers to receive the first and second electrical signals therefrom. A movement sensor assembly for detecting movement of a person is also provided, the assembly comprising a flexible vessel containing a body of gas and a pressure sensor according to any preceding claim, the sensor being arranged to detect changes in the pressure of the gas within the flexible vessel.

A textile with an electrically conductive first side and an electrically conductive second side where the two sides are separated by an electrically insulating part of the textile and where the electrically conductivity is provided by a graphene coating on the respective sides and where a capacitance can be formed between the respective conductive sides.

A MEMS device includes a backing wafer with a support portion and central back plate connected to the support portion with spring flexures, a diaphragm wafer with a support portions and a sensing portion connected to the support portion with spring flexures, a passivation layer on the diaphragm, and a topping wafer. The device allows for stress isolation of a diaphragm in a piezoresistive device without a large MEMS die.

A pressure sensor that includes a piezoelectric film having a flat part and a curved part and having opposed first and second main surfaces, a first electrode on the first main surface of the piezoelectric film, and a second electrode on the second main surfaces of the piezoelectric film. When the flat part of the piezoelectric film receives a pressing operation a first output is generated, and when the curved part of the piezoelectric film receives a pressing operation a second output different from the first output is generated.