a pressure sensor 1 according to the first aspect of the invention includes: a substrate 50; and a functional element 40 which is laid on the substrate 50 and is composed of functional titanium oxide including crystal grains of at least one of -phase trititanium pentoxide (-Ti.sub.3O.sub.5) and -phase trititanium pentoxide (-Ti.sub.3O.sub.5) and having the property that at least a portion of crystal grains of at least one of -phase trititanium pentoxide (-Ti.sub.3O.sub.5) and -phase trititanium pentoxide (-Ti.sub.3O.sub.5) change into crystal grains of titanium dioxide (TiO.sub.2) when the functional titanium oxide is heated to 350 C. or higher. The substrate 50 includes a substrate thin-film section 51 having a thin film form in which the thickness in the stacking direction of the substrate 50 and the functional element 40 is smaller than that in the other directions.

Certain implementations of the disclosed technology may include systems, methods, and apparatus for a sealed transducer with an adjustment port. The sealed transducer may include one or more terminals. A first terminal may include electrical connections for connecting to an input voltage source, a ground, and for providing a transducer output signal. A second terminal, for example, may include an electrical port for connecting to an external and separately sealed adjustment network. In one example implementation, the adjustment network can include one or more components configured to couple with internal circuitry of the transducer to alter a response of the transducer.

A thermal conductivity gauge measures gas pressure within a chamber. A sensor wire and a resistor form a circuit coupled between a power input and ground, where the sensor wire extends into the chamber and connects to the resistor via a terminal. A controller adjusts the power input, as a function of a voltage at the terminal and a voltage at the power input, to bring the sensor wire to a target temperature. Based on the adjusted power input, the controller can determine a measure of the gas pressure within the chamber.

A pressure sensor device with good temperature characteristics. An auxiliary fluid introduction path is provided in a bottom wall portion of a first case to introduce a fluid to t he vicinity of a recessed portion of the bottom wall portion where an integrated circuit with a large change in temperature characteristics is mounted such that the temperature of the integrated circuit becomes the same as or close to the temperature of the fluid.

A semiconductor pressure sensor of the invention, includes: a base body (1) including: a lead frame (4) having a first surface and a second surface; and a support (5) that supports the lead frame (4) and is made of a resin; a pressure sensor chip (2) provided on the first surface of the lead frame (4); and a controller (3) that is provided on the second surface of the lead frame (4), is implanted in the support (5), is formed in the shape having a plurality of surfaces, includes a stress relief layer (32, 33, 34, 35, 36) that is formed on at least one of the plurality of surfaces and has a Young's modulus lower than that of the support (5), and receives a sensor signal output from the pressure sensor chip (2) aid thereby outputs a pressure detection, the pressure sensor chip (2) at least partially overlapping the controller (3) in plan view.

Aspects of the subject technology relate to electronic devices with pressure sensors. A pressure sensor in a portable electronic device may include an integrated heater or may be co-operated with an external heater for the pressure sensor. The heater may be operated to heat some or all of the pressure sensor for pressure sensor testing, calibration, or temperature-controlled pressure sensing operations.

The invention provides a pressure measurement device comprising a pressure sensor (3) comprising a printed circuit card (4) having a portion that is to be subjected to the pressure for measurement, the printed circuit card having strain detectors (10, 11) mounted on said portion to measure deformation of the printed circuit card under the influence of said pressure.

The invention also provides a measurement system including such a device.

A differential pressure measuring pickup comprises a measuring pickup body and a differential pressure sensor. The measuring pickup body has a process interfacing surface with a first pressure input opening and a second pressure input opening. The differential pressure sensor can be loaded with a first pressure through the first pressure input opening and with a second pressure through the second pressure input opening. The first pressure input opening is closed by way of a first separating diaphragm and the second pressure input opening is closed by way of a second separating diaphragm. The first separating diaphragm is sealed with respect to the surroundings by way of a first seal, and wherein the second separating diaphragm is sealed with respect to the surroundings by way of a second seal. The differential pressure measuring pickup is tensioned during measuring operation with the process interfacing surface thereof against a process interfacing flange, wherein at least one plate-shaped spacer element with plane-parallel surfaces is clamped in between the process interfacing flange and the process interfacing surface, which spacer element defines the spacing between the process interfacing surface and the process interfacing flange and limits clamping of the seals between the process interfacing surface and the process interfacing flange.

A sensor package includes a pressure sensor, a computation unit that performs specified computation in accordance with a result of detection performed by the pressure sensor, a lead frame through which a result of computation performed by the computation unit is output to an outside, a main housing that is formed of resin and that holds the lead frame, and a sensor housing that is formed of ceramic and that has an inner space in which the pressure sensor is disposed. The pressure sensor is disposed in the main housing using the sensor housing.

An impedance sensor and an electronic apparatus using the same are provided. The impedance sensor includes an impedance-bridge circuit, a compensation circuit, and a signal processing circuit. The impedance-bridge circuit has an input side and an output side, and configured to generate a first impedance variation in response to a physical pressure. The compensation circuit is coupled to the input side of the impedance-bridge circuit in parallel, and configured to generate a second impedance variation in response to an environment temperature. The signal processing circuit respectively detects the first and the second impedance variations, and accordingly generates a first sensing signal indicating the first impedance variation and a second sensing signal indicating the second impedance variation, so as to compensate a temperature shift part of the first sensing signal by the second sensing signal and accordingly generate a pressure detection signal.