A sensing module including a circuit substrate, a sensing element, a packaging material and a blocking structure is provided. The sensing element, the packaging material and the blocking structure are disposed on the circuit substrate. The sensing element comprises a sensing portion. The outer side surface of the blocking structure is in direction contact with the packaging material to define a boundary of the packaging material. The sensing portion is disposed in a region encircled by the boundary of the packaging material, and the maximum thickness of the packaging material from a surface facing away from the circuit substrate to the circuit substrate is less than or equal to a distance from the second surface of the blocking structure to the circuit substrate.

Provided is a pressure sensor including: a housing portion including a housing part housing a pressure sensor module, a concave portion facing the housing part across an inner wall, and a through hole part formed in the inner wall; a filter covering the through hole part; and a cover mounted on the housing portion while covering the concave portion and including cutout parts. The concave portion includes a bottom surface that is one surface of the inner wall, and two side surfaces perpendicular to the bottom surface and opposed to each other. The cover is formed with a rectangular upper plate and two rectangular side plates continuous with edges of the upper plate in a vertical direction and opposed to each other. The upper plate is arranged to face the bottom surface. The two side plates are arranged between the two side surfaces opposed to each other.

Header construction and techniques are disclosed that utilize header layers that provide support for electrical interconnections. A sensor header assembly includes: an upper header layer having upper through holes arranged in a first configuration; a lower header layer having lower through holes arranged in a second configuration axially offset relative to the first configuration; depressions extending from the lower header layer top surface and partially through the lower header layer, each depression defining a footprint corresponding to the first configuration of the corresponding upper through holes of the upper header layer; upper header pins extending through the corresponding upper through holes and at least partially into the corresponding lower level depressions; and lower header pins extending through the corresponding lower through holes and in electrical communication with the corresponding upper header pins. The depressions form support surfaces for supporting at least the corresponding upper header pins during high-pressure operation.

A one or multi-die module comprises multiple dies. The module includes at least one die with a sensor having a sensing region, an encapsulation layer covering top sides of the multiple dies, and a redistribution layer covering bottom sides of the multiple dies except for the sensing region. In embodiments, a cap is formed over the sensing region, which has at least a portion that is spaced away from a bottom side of the module. Metal connectors, such as solder balls, are formed on the redistribution layer to provide connection points to the module. A height of the cap from the bottom side of the module should be less than a height of the metal connectors. This approach can be used to incorporate environmental sensor dies into multi-die modules. It utilizes RDL and openings in the RDL in order to provide robust packaging for the dies, while also allowing the sensor dies to be selectively exposed to the environment.

A semiconductor sensor assembly for use in a corrosive environment comprises a processing device comprising at least one first bondpad of a material which may be corroded by a corrosive component in a corrosive environment; a sensor device comprising at least one second bondpad consisting of and/or being covered by a first corrosion resistant material; at least one bonding wire for making a signal connection between the at least one first bondpad of the processing device and the second bondpad of the sensor device. The processing device is partially overmoulded by a second corrosion resistant material, and is partially exposed to a cavity in the corrosion resistant material, with the sensor device being present in the cavity. A redistribution layer is provided to enable signal connection between the processing device and the sensor device is physically made in the cavity while the second corrosion resistant material covers the first bondpad.

In a sensor module for measuring a pressure of a fluid, having at least one supporting element, at least one electronic circuit, particularly an integrated circuit, arranged on at least one circuit carrier, and with at least one pressure measuring chip that has at least one pressure measuring membrane, wherein at least sections of the circuit carrier are surrounded by a protective material to protect it from surrounding fluids, it is provided as essential to the invention that the pressure measuring chip and the circuit carrier are arranged vertically one underneath the other, and that the pressure measuring chip is at least partially mechanically decoupled from the supporting element.

A pressure sensor includes a base including an accommodation portion, a pressure sensor element disposed in the accommodation portion, and a lead portion electrically-connected to the pressure sensor element, including a terminal portion provided along a lower surface of the base, and being exposed to an outside of the base, where the terminal portion includes a recessed groove portion provided on a second surface which is an opposite surface of a first surface facing the body, and where the recessed groove portion divides at the second surface, a first region including a tip of the terminal portion and a second region next to the first region and away from the tip of the terminal portion.

A pressure sensor which detects a combustion pressure of an engine includes: a contact part which is in direct or indirect contact with a casing of the engine when the pressure sensor is attached to the engine; and a pressure detection unit which detects the combustion pressure and outputs a signal corresponding to the combustion pressure, wherein the pressure detection unit includes a pressure detection element which detects the combustion pressure and outputs a signal, and a circuit unit which converts the signal obtained from the pressure detection element into a signal corresponding to the combustion pressure, and the pressure detection unit is provided at a location positioned more inside the engine than the contact part when the pressure sensor is attached to the engine.

Each of a plurality of hydraulic pressure sensors includes a lower case and an upper case fixed above the lower case. A valve body includes an upper body including a hole portion arranged to house the hydraulic pressure sensors, and a lower body including an oil passage. A pressed portion is defined in the lower case. The pressed portion is arranged to project horizontally in the lower case so as to be opposed to the upper case. The pressed portion is arranged to be pressed downward by a pressing portion of the upper body. At least one of the upper body and the lower body includes a positioning portion arranged to horizontally position each of the hydraulic pressure sensors in the hole portion.

A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.