Provided is a pressure detection device including a pressure detection unit configured to detect a pressure to be transmitted to a pressure sensor, and a flow channel unit on which the pressure detection unit is disposed. The pressure detection unit) includes a pressure sensor and a conductive protective film disposed in contact with the pressure sensor, the conductive protective film breaking contact between the pressure sensor and a fluid. The conductive protective film is formed of a conductive fluororesin material including a fluororesin material and a conductive material dispersed in the fluororesin material and is connected to a ground portion maintained at a ground potential.

A semiconductor sensor assembly for use in a corrosive environment comprises a processing device comprising at least one first bondpad of a material which may be corroded by a corrosive component in a corrosive environment; a sensor device comprising at least one second bondpad consisting of and/or being covered by a first corrosion resistant material; at least one bonding wire for making a signal connection between the at least one first bondpad of the processing device and the second bondpad of the sensor device. The processing device is partially overmoulded by a second corrosion resistant material, and is partially exposed to a cavity in the corrosion resistant material, with the sensor device being present in the cavity. A redistribution layer is provided to enable signal connection between the processing device and the sensor device is physically made in the cavity while the second corrosion resistant material covers the first bondpad.

A hermetic structure includes a hermetic body having a through-hole passing through a high pressure side and a low pressure side, the through-hole having a tapered portion whose diameter increases from the low pressure side toward the high pressure side, a conductor inserted through the through-hole, a protector component fit in the tapered portion, the protector component having a hole for inserting the conductor, and a glass member provided in the through-hole, on the low pressure side from the protector component, so as to seal the conductor.

In a microelectromechanical system (MEMS) pressure sensor, thin and fragile bond wires that are used in the prior art to connect a MEMS pressure sensing element to an application specific integrated circuit (ASIC) for the input and output signals between these two chips are replaced by stacking the ASIC on the MEMS pressure sensing element and connecting each other using conductive vias formed in the ASIC. Gel used to protect the bond wires, ASIC and MEMS pressure sensing element can be eliminated if bond wires are no longer used. Stacking the ASIC on the MEMS pressure sensing element and connecting them using conductive vias enables a reduction in the size and cost of a housing in which the devices are placed and protected.

A process fluid pressure measurement probe includes a pressure sensor formed of a single-crystal material and mounted to a first metallic process fluid barrier and disposed for direct contact with a process fluid. The pressure sensor has an electrical characteristic that varies with process fluid pressure. A feedthrough is formed of a single-crystal material and has a plurality of conductors extending from a first end to a second end. The feedthrough is mounted to a second metallic process fluid barrier and is spaced from, but electrically coupled to, the pressure sensor. The pressure sensor and the feedthrough are mounted such that the secondary metallic process fluid barrier is isolated from process fluid by the first metallic process fluid barrier.

The invention relates to a sensor device (10), in particular for use in a motor vehicle, comprising a housing (11) for receiving a sensor element (1), wherein the sensor element (1) has contact surfaces (21 to 23) that are electrically conductively connected with electrical plug connections (27) arranged in the housing (11), in the region of contacts (24 to 26), wherein the sensor element (1) is applied with force by a housing element (13), in particular formed as a housing cover, in the direction of the contacts (24 to 26) for the purposes of electrical contacting, and wherein a support in the form of a 3-point contact is formed between the sensor element (1) and the housing (11). According to the invention, the sensor element (1) has at least two measuring devices (5, 6), and the at least two measuring devices (5, 6) have three contact surfaces (21 to 23) that form the 3-point contact.

A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer.

An example system for non-invasive determination of target properties of a pressure vessel includes: a signal generator acoustically coupled to a fluid contained in the pressure vessel and disposed externally to the pressure vessel, the signal generator to emit acoustic signals into the fluid; a plurality of sensors acoustically coupled to the fluid and disposed externally to the pressure vessel to detect the acoustic signals; a control device interconnected with the signal generator and the plurality of sensors, the control device configured to: control the signal generator to emit acoustic signals into the pressure vessel; obtain sensor data from the plurality of sensors, the sensor data representing the acoustic signals as received by the plurality of sensors; compute, based on the detected signal data, the target properties of the pressure vessel; and output an indication of the target properties.

The invention relates to a device for measuring an operating variable, to be fitted onto a tyre, comprising: an electronic circuit distributed over a first face of an electronic board and comprising a sensor; a protective housing at least partially covering the electronic circuit; and at least one first antenna wire having one end galvanically connected to the electronic circuit and integrally extending so as to project laterally from the housing;

According to the invention, the housing comprises a lateral portion which projects substantially tangentially to a proximal end portion of the first wire in accordance with the generatrix of said first wire.

A vehicle guidance system, including: surface-mounted pressure sensors mounted on a vehicle; an air data estimation controller including: a preprocessor that sets initial values for angle of attack and sideslip angle, determines a converged value for the angle of attack using the initial values and values of one or more first sets of three sensors, each first set of sensors are located among three different planes that are parallel to the ground, and provides a converged sideslip angle value based on the converged value and values of one or more second sets of three sensors, each second set of sensors located among three different planes that are perpendicular to the ground; a processor that estimates air data based on the converged value for the angle of attack and the converged sideslip angle value; and processor that provides an output for adjusting orientation of a vehicle based on the air data.