A pressure sensor module detects a fluid pressure on the basis of a differential pressure between a reference pressure and the fluid pressure, and includes: a housing; a sensor element that can contact each of the reference pressure and the fluid pressure; a support member that supports the sensor element and is held in the housing; a first pressure passage that guides the fluid pressure to a first contact surface of the sensor element; and a second pressure passage that is sealed from the first pressure passage and guides the reference pressure to a second contact surface of the sensor element.

A pressure and temperature measuring device having a pressure-sensitive element, an electronic board, pins and a casing configured to connect to a tank or pipe. An elongated base configured to be arranged along a longitudinal axis in the casing, with a partition, a back, a platform and a plinth. The partition having an inner plane oriented towards the back and parallel to the longitudinal axis and an outer plane that forms an acute angle with the inner plane. The back, the platform and the inner plane of the partition defining a slot configured to receive the board. The outer plane defining an inclined support surface to serve as support together with the plinth to the pressure-sensitive element.

A pressure sensor system having at least one pressure sensor device. The pressure sensor device has a stack having a ceramic substrate, at least one signal processing element, and at least one sensor element. The pressure sensor device is placed in a sensor housing provided with a membrane, and a residual volume of the sensor housing provided with the membrane is filled with an incompressible fluid. A method for producing such a pressure sensor system, and to a measuring device, are also described.

A semiconductor package includes a flat plate-shaped terminal integrally formed with a housing portion for a semiconductor chip and a rod-shaped terminal pin that penetrates through a through-hole of the plate-shaped terminal. On a surface of the plate-shaped terminal, a resin guide portion for guiding the terminal pin to the through-hole of the plate-shaped terminal is provided. The resin guide portion is a portion of the housing portion and has a through-hole that is continuous with the through-hole of the plate-shaped terminal. During assembly of the semiconductor package, the terminal pin is inserted into the through-hole of the plate-shaped terminal, via the through-hole of the resin guide portion. A sidewall of the through-hole of the resin guide portion and a sidewall of the through-hole of the plate-shaped terminal have a same slope and form a single continuous surface; a border between the through-hole of the resin guide portion and the through-hole of the plate-shaped terminal is free of any step.

A gauge having a housing formed of a polymer material and one or more electrical feedthrough pins disposed in the housing. The electrical feedthrough pins can be oriented substantially perpendicular to each other and have complex shapes.

A pressure sensor for being mounted in a vehicle door includes a housing, a pressure transducer, an elastomeric connector, and electrical conductors for facilitating an electrical connection to the pressure sensor. The pressure transducer is mounted in the housing adjacent the elastomeric connector. The housing is configured to exert a force that presses the pressure transducer against the elastomeric connector. The elastomeric connector comprises electrically conductive regions configured to be pressed against electrical contacts of the pressure transducer and the electrical conductors to establish and maintain an electrical connection between the pressure transducer and the electrical conductors.

A pressure sensor is proposed. The pressure sensor has a main body housing (10) and a cover housing (30). The main body housing (10) has an inner space (16) and a substrate (28) having a sensing element (29). The cover housing (30) has a seal (41) integrally formed therein so as to encompass part of the sensing element (29) so that the sensing element communicates with a communicating passage (33) but does not communicate with the inner space (16). A discharge path (36) is formed on the communicating passage (33) so as to allow the inside of a tube communicating with the communicating passage (33) to be maintained at atmospheric pressure normally. An inflow orifice (34) is in the downstream side of the communicating passage (33) and a discharge orifice (37) is in the downstream side of the discharge path (36) so that the flow of the fluid is rapid.

A pressure measuring device is disclosed that includes a housing, a pressure measuring cell, evaluation electronics for processing measurement signals generated by the pressure measuring cell, a plug connection formed at the housing for transmitting the processed measurement signals to an external receiving unit, and an air passage which enables pressure compensation between the interior of the housing and the exterior of the housing. The plug connection includes a cylindrical sleeve and an insert part disposed therein, wherein the air passage is formed as a two-part barrier having a first liquid barrier formed as a duct system from the interior of the housing via the plug connection and a second liquid barrier having a liquid-repellent diaphragm and disposed in an area within the duct system, and wherein the insert part has a first recess into which the diaphragm is inserted. The insert part has a second recess, which is arranged at a distance from the first recess and in which a light-emitting diode signalling a status of the measuring device is inserted, wherein the cylindrical sleeve also has a recess at the side opposite the light-emitting diode, which recess on the one hand, acting as a part of the duct system or air passage, allows pressure compensation and, on the other hand, allows the light-emitting diode to be visible.

A metal member with insulating film includes a metal member, an insulating film, and a reinforcement portion. The metal member includes a film formation surface and a connection surface facing in a different direction from the film formation surface and connecting to the film formation surface. The insulating film covers at least a part of the film formation surface and the connection surface over a connection position between the film formation surface and the connection surface. The reinforcement portion is formed along a periphery of the insulating film at the connection position and covers at least a part of the periphery of the insulating film from an opposite side to the metal member.

A pressure sensing device comprising a body assembly, a connector assembly, an electronic circuit, and a pressure sensor is provided. The pressure sensing device is a compact device allowing for improved assembly. Moreover, the pressure sensing device allows for a leakage test and an electronic circuit control test to be performed before the assembly of the device thereby improving reliability and precision.