A pressure-sensor assembly (1) for detecting the pressure of a fluid comprises:—- a pressure- sensitive component (2), having a generally cup-shaped sensor body (5), which includes a bottom portion (5a) and a peripheral portion (5b) that define an axial cavity (C.sub.1, C.sub.2), the bottom portion (5a) including an elastically deformable membrane part, which closes the axial cavity (C.sub.1, C.sub.2) at one end of the sensor body (5), and the peripheral portion (5b) having a distal edge opposite to the bottom portion (5a), which delimits an inlet of the axial cavity (C.sub.1, C.sub.2), the bottom portion (5a) having associated thereto at least one element for detecting deformation of the membrane part; and - a compensation element (3), configured for compensating possible variations of volume of the fluid, comprising at least one compensation body (8), made of a first elastically deformable or compressible material, and a core (9) fixed on which is the at least one compensation body (8), the core (9) being made of a second material stiffer than the first material. The sensor body (5) and the compensation

Pressure sensors having ring-tensioned membranes are disclosed. A tensioning ring is bonded to a membrane in a manner that results in the tensioning ring applying a tensile force to the membrane, flattening the membrane and reducing or eliminating defects that may have occurred during production. The membrane is bonded to the sensor housing at a point outside the tensioning ring, preventing the process of bonding the membrane to the housing from introducing defects into the tensioned portion of the membrane. A dielectric may be introduced into the gap between the membrane and the counter electrode in a capacitive pressure sensor, resulting in an improved dynamic range.

A pressure sensor includes a housing, an isolator positioned at a first end of the housing, and a first cavity formed between the first end of the housing and the isolator. The pressure sensor further includes a second cavity formed in the housing and a channel with a first end fluidly connected to the first cavity and a second end fluidly coupled to the second cavity. A pressure sensor chip is positioned in the second cavity and includes a first diaphragm positioned at a top side of the pressure sensor chip laterally outwards from the second end of the channel to prevent a fluid from jetting onto the first diaphragm.

The disclosure provides for a method for setting an inflatable packer. The method includes positioning an inflatable packer within a borehole, and pumping fluid into an inflatable element of the inflatable packer using a pump that is driven by a motor. The method includes measuring pressure of the inflatable element, determining a derivative of the measured pressure with respect to time, and determining onset of restraining of the inflatable element has occurred. Upon or after determining the onset of restraining, the method includes turning off the motor or slowing down an rpm of the motor. The disclosure also provides for a system, including a computer readable medium with processor-executable instructions stored thereon that are configured to instruct a processor to execute a pressure control algorithm to control a speed of the motor in response to pressure measurement data from the pressure sensor.

A pressure sensor die assembly for a differential pressure sensor comprises a base substrate including a first overpressure stop structure on a first surface, and a diaphragm structure coupled to the first surface. The diaphragm structure comprises a first side with a cavity section that includes a first cavity and a second cavity surrounding the first cavity, and a second side opposite from the first side. A pressure sensing diaphragm portion is defined by the first cavity and is located over the first overpressure stop structure. An overpressure diaphragm portion is defined by the second cavity. A top cap coupled to the second side of the diaphragm structure includes a second overpressure stop structure. The overpressure stop structures are each sized to support substantially all of a strained area of the pressure sensing diaphragm portion at an increasing overpressure on the first or second sides of the diaphragm structure.

A method of manufacturing a differential pressure sensor is provided. The method includes providing a housing of a differential pressure sensor and a cover. The cover is mounted to the housing so as to form a pressure chamber. The differential pressure sensor is configured such that in operation, a pressure to be measured is transmitted into the pressure chamber. The method further includes heating a sleeve, placing the heated sleeve around the cover and the housing and allowing the sleeve to cool.

Pressure sensors having ring-tensioned membranes are disclosed. A tensioning ring is bonded to a membrane in a manner that results in the tensioning ring applying a tensile force to the membrane, flattening the membrane and reducing or eliminating defects that may have occurred during production. The membrane is bonded to the sensor housing at a point outside the tensioning ring, preventing the process of bonding the membrane to the housing from introducing defects into the tensioned portion of the membrane. A dielectric may be introduced into the gap between the membrane and the counter electrode in a capacitive pressure sensor, resulting in an improved dynamic range.

A pressure sensor includes a substrate that has a diaphragm which bends and deforms by receiving pressure and a displacement regulating unit that regulates deformation of the diaphragm, in which the diaphragm and the displacement regulating unit are spaced away from each other in a first state where the diaphragm receives pressure within a measurable range, and the diaphragm and the displacement regulating unit come into contact with each other in a second state where the diaphragm receives pressure exceeding the measurable range.

A pressure sensor comprising a housing, a diaphragm wafer, and an isolator configured to absorb lateral stress. The diaphragm wafer includes a fully exposed diaphragm, a fluid contact surface, a sensing element, and a support portion, where the support portion and the contact surface define a cavity. The isolator extends laterally from the support portion to the housing. The pressure sensor is easily drainable, eliminating the buildup of particulates, and the diaphragm can be directly wire-bonded to printed circuit boards, eliminating the need for extensive electrical feedthrough.

Pressure sensors having vertical diaphragms or membranes. A vertical diaphragm may be located in a first silicon wafer between a first and second cavity, where the first and second cavities are covered by a second silicon wafer. One or more active or passive devices or components may be located on a top of the vertical diaphragm.