A MEMS sensor including a housing defining an interior and an inlet in fluid communication with an environment for sensing, a sensing die coupled to the housing for generating a signal based on the environment, an encapsulant is applied to the sensing die to protect the sensing die without interfering with the operation of the sensing die, characterized in that the encapsulant is a composition of a non-crosslinked substance having an organic backbone, and a silica thickener.

The aim of the invention is to economically produce a pressure measuring sensor element, and relates, according to one aspect, to a method for producing a pressure sensor measuring element for a pressure sensor which comprises at least one membrane and a covering protecting the membrane, the pressure sensor element being produced in a layer-by-layer generative production method. This makes it possible to, for example, easily construct a combination sensor for detecting pressure and an additional parameter. It is also possible to structures for reinforcement or for influencing resonant frequency or for influencing heat conduction.

A sensor unit including a measuring cell with a section-wise heat-conducting surface, a housing in which the measuring cell for the most part is contained, and an access channel to the measuring cell. The sensor unit includes a cavity that is confined for the most part by an outer surface of the measuring cell and by a wall of the housing facing towards the surface of the measuring cell. The cavity is closed in itself.

A pressure difference sensor for providing a pressure measurement signal, comprising: a pressure difference measuring cell, which is suppliable with first and second pressures and which outputs the pressure measurement signal; first and second ceramic stiffening elements, each of which is joined with the pressure difference measuring cell and has a duct, via which the first, respectively the second, pressure is suppliable to the pressure difference measuring cell; a platform with first and second pressure input openings, each of which extends from a first surface to a second surface of the platform, wherein the pressure input openings are sealed on the first surface, each with its own isolating diaphragm, and first and second pressures tubes, which are arranged between the stiffening elements and the platform, and wherein each of the first pressure tube and the second pressure tube has at least one bend in a region between the platform and a first, respectively second, connecting area of the corresponding pressure tube.

A MEMS pressure sensor includes a first plate with a hole on a diaphragm bonded to the first plate around its rim with the diaphragm positioned over the hole. An isolation frame is bonded to the diaphragm and a second plate with a pillar is bonded to the isolation frame around its rim to form a cavity such that the end of the pillar in the cavity is proximate a surface of the diaphragm. The diaphragm and second plate form a capacitive sensor which changes output upon deflection of the diaphragm relative to the second plate.

A pressure sensor includes a connection portion provided with a screw portion configured to fix the pressure sensor to a combustion chamber of a vehicle engine; a hollow liquid-enclosing container fixed to one end of the connection portion; a pressure transmission fluid enclosed inside the liquid-enclosing container; a diaphragm fixed to one end of the liquid-enclosing container and elastically deformed when receiving pressure to transmit the pressure to the pressure transmission fluid; a pressure detection element fixed to the other end of the liquid-enclosing container and detecting the pressure transmitted to the pressure transmission fluid and converts the detected pressure into an electric signal; and a heat-dissipating rod provided inside the liquid-enclosing container. The connection portion and the liquid-enclosing container, and the connection portion and the diaphragm are mechanically connected to each other by welding or the like.

Systems and methods are disclosed for packaging sensors for use in high temperature environments. In one example implementation, a sensor device includes a header; one or more feedthrough pins extending through the header; and a sensor chip disposed on a support portion of the header. The sensor chip includes one or more contact pads. The sensor device further includes one or more wire bonded interconnections in electrical communication with the respective one or more contact pads and the respective one or more feedthrough pins. The sensor device includes a first sealed enclosure formed by at least a portion of the header. The first sealed enclosure is configured for enclosing and protecting at last the one or more wire bonded interconnections and the one or more contact pads from an external environment.

A sensor device including: a sensor portion; a casing portion housing the sensor portion; an elastic portion that is provided in contact with the casing portion between the sensor portion and the casing portion and has a material having smaller elastic modulus than elastic modulus of the casing portion; and an adhesive that is provided between the sensor portion and the casing portion is provided. The adhesive may have an interface between the elastic portion and the adhesive. The elastic portion may have the same material as the adhesive. The elastic portion may have smaller elastic modulus than the adhesive.

Systems and methods are disclosed for packaging sensors for use in high temperature environments. In one example implementation, a sensor device includes a header; one or more feedthrough pins extending through the header; and a sensor chip disposed on a support portion of the header. The sensor chip includes one or more contact pads. The sensor device further includes one or more wire bonded interconnections in electrical communication with the respective one or more contact pads and the respective one or more feedthrough pins. The sensor device includes a first sealed enclosure formed by at least a portion of the header. The first sealed enclosure is configured for enclosing and protecting at last the one or more wire bonded interconnections and the one or more contact pads from an external environment.

A distortion resistance film, etc., which includes Cr, Al, and N and in which film separation can be prevented. A distortion resistance film including an alloy material including Cr, Al, N, and Si.