In a pressure sensor, a cap-shaped shielding member (17) to block an electric field undesirable for a signal processing electronic circuit unit of a sensor chip (16) is supported by an end surface of a disk conductive plate (19) between one end surface of the sensor chip (16) in a liquid sealing chamber (13) and a diaphragm (32). The conductive plate (19) is electrically connected via a group of input-output terminals (40ai) and bonding wires (Wi), for example, and the sensor chip (16) is supported by one end portion of a chip mounting member (18) which is electrically connected via the group of input and output terminals (40ai) and the bonding wires (Wi).

The invention relates to a pressure sensor, forces after one to three directions, normal to the sensor plane and tangential to the sensor plane, as well as torques, the sensor being based on the variation of reactive or mixed impedances when applying normal forces or pressure and/or tangential forces or torques on the sensor structure. The sensor has a structure that includes a closed and watertight space, so that the behavior of the sensor is little or not affected by varying environmental conditions.

In a pressure sensor, an electric field acting on one end surface of a sensor chip (16) is blocked by a shielding member (17), and an electric field acting on another end surface of the sensor chip (16) is removed through one end portion of a chip mounting member (18), a group of input and output terminals (40ai), and a bonding wire (Wi).

A noise resistance of a pressure sensor is improved while avoiding a hetero metal bonding. A pressure detection device includes a metal case having the diaphragm which is deformed due to a pressure received from a pressure medium, a sensor element which detects a pressure by detecting the deformation of the diaphragm, a lead frame which is electrically connected to the sensor element, and a connection member which holds the lead frame. A first surface of the lead frame, that is, the surface on a side near the metal case in the parallel plate region, and a second surface of the metal case, that is, the upper surface of the base member interpose at least one of the resin of the connection member being an insulator and the insulating adhesive and are disposed to face each other with a predetermined gap therebetween.

A pressure sensor device includes a semiconductor die having a die surface that includes a pressure sensitive area; and a bond wire bonded to a first peripheral region of the die surface and extends over the die surface to a second peripheral region of the die surface, wherein the pressure sensitive area is interposed between the second peripheral region and the first peripheral region, wherein the bond wire comprises a crossing portion that overlaps an area of the die surface, and wherein the crossing portion extends over the pressure sensitive area that is interposed between the first and the second peripheral regions.

A device for suppressing stray radiation includes a Micro-ElectroMechanical System (MEMS) sensor module and a conductive cage structure. The conductive cage structure may enclose the MEMS sensor module in order to suppress penetration of stray electromagnetic radiation with a stray wavelength λ.sub.o into the conductive cage structure, and the conductive cage structure may be arranged to be thermally insulated from the MEMS sensor module. The device may also include a connecting line. The connecting line may be connected to the MEMS sensor module and fed through the conductive cage structure by a capacitive element.

A pressure sensor includes a diaphragm made of metal and configured to separate a pressure chamber from a liquid seal chamber, a housing made of metal and disposed around the liquid seal chamber, a pressure detection element disposed in the liquid seal chamber in a liquid . . . sealable manner to detect the pressure of the fluid, and a potential adjustment member disposed between the pressure detection element and each of the diaphragm and the housing and being conductive, the potential adjustment member being connected to a zero potential terminal of the pressure detection element, wherein a distance between the potential adjustment member and each of the diaphragm and the housing is larger than a predetermined insulating distance.

A pressure sensor device includes a semiconductor die of the pressure sensor device and a bond wire of the pressure sensor device. A maximal vertical distance between a part of the bond wire and the semiconductor die is larger than a minimal vertical distance between the semiconductor die and a surface of a gel covering the semiconductor die.

An electronics assembly which includes a grounding connection, having a housing, a connector, a portion of the connector formed around the housing, a recess portion integrally formed as part of the connector, a substrate located in proximity to the connector, and circuitry mounted to the substrate such that the circuitry is at least partially disposed in a cavity formed as part of the connector. A conductor is mounted to the connector such that the conductor is located in the recess, and the conductor is in contact with the housing and the substrate. A grounding connection is formed between the circuitry and the housing when the conductor is in contact with the housing and the substrate. The conductor may be made of an elastomeric material, and the conductor deforms when the substrate is placed in proximity to the connector.

A sensor apparatus having a crimped housing and a method of assembling a sensor apparatus having a crimped housing are disclosed. The sensor apparatus comprises a sensor port, a tubular thin-walled housing coupled to the sensor port and comprising a crimping portion, a base portion, and a step feature that is formed in the housing, the step feature partitioning the crimping portion from the base portion, sensor components disposed within the interior of the base portion of the housing, and an electrical connector coupled the housing and comprising leads electrically coupled to the sensor components and a connector flange, wherein a rim of the crimping portion of the housing is crimped onto the connector flange such that the electrical connector is retained in the housing. Dimples, created by protrusions on the crimp dye, on both housing rim and connector flange assure the housing rim hold the connector in rotation direction