An environmental sensor. The environmental sensor includes: a MEMS element; an ASIC element electrically connected to the MEMS element by means of at least two bonding wires. T ASIC element includes an evaluation circuit designed to ascertain and evaluate a parasitic capacitance between the at least two bonding wires connected to pads of the MEMS element, in order to detect a material deposit on the environmental sensor.

In a sensor unit, a lower end surface of a terminal block (24) is attached to an upper end surface (12ES1) of a housing (12) by using a silicone-based adhesive in such a way as to cover an upper end surface (14ES1) of a hermetic glass (14). A covering layer (10A) made of a silicone-based adhesive is formed in a given thickness on the entire upper end surface (14ES1) of the hermetic glass (14), from which a group of input-output terminals (40ai) protrude.

A differential pressure sensor assembly includes a transducer having a first sensing surface and a second sensing surface. The second sensing surface is contained in a cavity. An Integrated Circuit (IC) is hermetically coupled to the transducer. The IC has a first aperture aligned to the cavity. A lead frame is coupled to the IC. The lead frame has a second aperture aligned to the first aperture of the IC. A package encapsulates the transducer, the IC and the lead frame. The package has a third aperture exposed to the first sensing surface. The package includes a molding compound providing a hermetic seal between the third aperture of the package and the first aperture of the IC. The molding compound is separated from the transducer by an encroachment distance.

A pressure sensing element includes a sensing sub-element disposed on a diaphragm, the element including a shield disposed over the sub-element and configured to substantially eliminate influence of external charge on the sub-element during operation. A method of fabrication and a pressure sensor making use of the pressure sensing element are disclosed.

A pressure sensor structure includes a sensor body including a diaphragm plate that functions as a sense electrode, a base electrode that faces the diaphragm plate, and a sidewall layer maintaining a gap between the diaphragm plate and the base electrode, and a conductive guard substrate to support the sensor body. The sidewall layer includes a guard electrode layer and upper and lower electrically insulating layers to electrically insulate the guard electrode layer. An electrically insulating layer is between the guard substrate and the sensor body to electrically insulate the guard substrate. The guard substrate is electrically connected to the guard electrode layer to function as a guard electrode together with the guard electrode layer.

A split-type piezoelectric sensor includes a first circuit board and a second circuit board. The first circuit board includes a sub-board, a piezoelectric film, and a first connector. The sub-board and the first circuit board are located on the same plane, and the sub-board is located in a hollow area of the first circuit board and connected to one end in the first circuit board. The piezoelectric film is attached to the sub-board and is electrically connected to the sub-board. The first connector and the piezoelectric film are provided on the same side, and the first connector is electrically connected to the first circuit board. The second circuit board includes a signal processing unit and a second connector electrically connected to the signal processing unit. The second connector is opposite to and detachably connected to the first connector, and the second connector supports the first circuit board.