A sensor device includes an electrically conductive base substrate defining a first electrode kept at a reference potential, a membrane defining a second electrode that changes a position thereof in response to a change of surrounding pressure and faces the base substrate, a casing that is kept at the reference potential and is outside the membrane, a capacitance detection circuit to amplify a signal from the membrane and detect an electrostatic capacitance between electrodes at a predetermined sampling cycle, and a signal processing circuit to measure a difference ΔC of electrostatic capacitance values before and after a sampling, compare the difference AC with a predetermined threshold value Cta, and when ΔC≥Cta, determine that a foreign object is attached to the casing. Thus, the attachment of a foreign object can be reliably detected.

A door assembly includes a structural wrapper defining an insulating cavity. The structural wrapper defines a sensor port. A sensor assembly is coupled to an outer surface of the structural wrapper proximate to the sensor port. The sensor assembly includes a connector having a base coupled to a housing. The base is coupled to the structural wrapper. The connector defines an interior in fluid communication with the insulating cavity. A pressure sensor is disposed within the housing. The pressure sensor is configured to sense a pressure within the insulating cavity. At least one plate is disposed at an open end of the housing. The pressure sensor includes sensor pins that extend through the at least one plate.

In a sensor module for measuring a pressure of a fluid, having at least one supporting element, at least one electronic circuit, particularly an integrated circuit, arranged on at least one circuit carrier, and with at least one pressure measuring chip that has at least one pressure measuring membrane, wherein at least sections of the circuit carrier are surrounded by a protective material to protect it from surrounding fluids, it is provided as essential to the invention that the pressure measuring chip and the circuit carrier are arranged vertically one underneath the other, and that the pressure measuring chip is at least partially mechanically decoupled from the supporting element.

An electronic device includes a first molded product integrated with an electronic component, and a second molded product secondarily molded outside of the first molded product. The first molded product includes a thermosetting resin, and a first additive contained in the thermosetting resin, and the second molded product includes a thermoplastic resin, and a second additive contained in the thermoplastic resin and having a reactive group that chemically bonds with the first additive. At an interface between the first molded product and the second molded product, the first additive and the second additive are joined to each other by one or more joint actions selected from covalent bonding, ionic bonding, hydrogen bonding, intermolecular forces, dispersion force, and diffusion. As a result, the adhesion between both the molded products can be firmly secured through the molding technique such as the transfer molding method or the compression molding method.

In a flexible printed wiring board (1), a first electrical conduction pattern (4) prepared on the first surface (3a) on which a bare chip (2) is mounted is prepared only inside a mounting region (3c) of the bare chip. Preferably, the first electrical conduction patterns (4) are prepared so as to avoid positions opposite to test electrodes (2b) which the bare chip comprises. Thereby, in the flexible printed wiring board used for mounting the bare chip, occurrence of malfunction resulting from electrical connection with a part other than a bump of the bare chip can be certainly prevented, and reliability of various devices using the bare chip can be improved.

An electronic pressure sensor includes a housing having a distal end configured to be exposed to a flow of a fluid media, the distal end opposite a proximal end, wherein the proximal end is configured not to be exposed to the fluid media. A chamber and connected passageway are disposed within the housing. The passageway is connected at one end to the chamber and connected at another end to an opening disposed at the distal end of the housing. The opening is configured to be in fluidic communication with the fluid media. A pressure sensor is disposed within the chamber. A first temperature sensor is disposed within the chamber. A viscous gel is disposed within the chamber, the viscous gel separating on a first side both the pressure sensor and the first temperature sensor apart from the passageway on a second side of the viscous gel.

A pressure sensor has a housing, an air lead-in hole, a pressure lead-in hole, an inner cavity, a sensor chip, a lead frame and a cover plate. One end of the air lead-in hole is in communication with the inner cavity of the housing, and the other end of the air lead-in hole is in communication with the air; the pressure lead-in hole is perpendicularly disposed at the center of the upper surface of the housing, two steps are disposed on the upper surface of the inner cavity, and a horizontal surface-mounted device surface is disposed on each of the steps. The center of the sensor chip is aligned with the centers of the pressure lead-in hole, and the lower end of the pressure lead-in holes are in communication with the cavity of the sensor chip.

Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one sensor element; a framing element disposed around the at least one sensor element; at least one port defined by the framing element, the at least one port configured to expose at least a portion of the at least one sensor element to an ambient environment; and a thin layer disposed in the at least one port.

Provided is a differential pressure sensor capable of improving joining stability of a filter. The differential pressure sensor includes: a sensor module configured to detect a pressure difference between an atmospheric pressure and a pressure of a measured medium; a case body, which is configured to contain the sensor module, and in which an atmosphere introducing hole for introducing atmospheric air into the case body is formed; and a filter provided from inside the case body to cover the atmosphere introducing hole, the case body having a protrusion, which protrudes to an inside of the case body, the atmosphere introducing hole being formed in the protrusion, the filter being joined to the protrusion.

A semiconductor device includes a base substrate, a detection device provided on the base substrate and including a detector, a first connector electrically connecting the base substrate and the detection device, and a resin package provided on the base substrate and embedded with the detection device and the first connector. The resin package includes an exposure hole exposing the detector of the detection device to the outside, and a concave-convex portion.