A method for manufacturing a pressure-sensitive sensor includes providing an extruder that includes a cylindrical die, a mandrel arranged inside the die and having plural helical grooves on an outer circumferential surface, and an annular outlet sandwiched between the die and the mandrel, and by using the extruder, performing simultaneous extrusion-molding of an elastic insulating material and an elastic conductive material by supplying the elastic conductive material into not less than two of the grooves from the inside of the mandrel while extruding the elastic insulating material, so as to form a pressure-sensitive sensor. The sensor includes a tubular body including an elastic insulation and having a hollow portion along a longitudinal direction, and not less than two conductive ribs including an elastic conductor and helically provided along an inner circumferential surface of the hollow portion of the tubular body so as to protrude inward from the inner circumferential surface.

A semiconductor device includes a base substrate, a detection device provided on the base substrate and including a detector, a first connector electrically connecting the base substrate and the detection device, and a resin package provided on the base substrate and embedded with the detection device and the first connector. The resin package includes an exposure hole exposing the detector of the detection device to the outside, and a concave-convex portion.

A housing is disclosed. In an embodiment a housing includes a housing opening, a pressure-compensating element mounted on an inner side of the housing opening, a protective wall mounted on an outer side of the housing opening surrounding the housing opening and a bridge arranged over the outer side of the housing opening and protruding beyond the housing opening, wherein the bridge is shaped and arranged such that a projection of the bridge at least partially covers the housing opening.

A sensor is configured to attach to a main body and includes a sensor body, a transducer, a transmitter, and a power source. The sensor body is configured to provide a smooth transition with a surface of the main body. The transducer is positioned within the sensor body and is configured to provide a sensed output. The transmitter is positioned within the sensor body and is configured to transmit the sensed output. The power source is positioned within the sensor body and is configured to provide electrical power to the transducer and the transmitter.

A pressure sensor assembly includes a tube, wherein a membrane to which the pressure to be measured is applied is arranged in the cross-section of the tube, where the membrane has a high flexural rigidity in a central region and is mounted resiliently in the edge region in the tube via two limbs, and includes a device for detecting the axial displacement which is easily accessible from the outside on the outer side of the tube and is advantageously not in contact with the process medium, and where the pressure sensor assembly has a particularly simple structural configuration, and can be used advantageously in measurement transducers for process instrumentation.

A semiconductor sensor device includes a lead frame flag having a vent hole, an interposer mounted on the flag and having a vent hole in fluid communication with the vent hole of the flag, and a sensor die having an active region. The sensor die is mounted on and electrically connected to the interposer in a flip-chip manner such that the vent hole of the interposer is in fluid communication with the active region of the sensor die. Bond wires electrically connect the interposer to one or more other components of the device. A molding compound covers the sensor die, the interposer, and the bond wires. The sensor die may be a pressure-sensing (P-cell) die, and the device may also include a micro-controller unit (MCU) die and an acceleration-sensing (G-cell) die, for tire pressure monitoring applications.

Provided is a pressure sensor that uses a sensor chip as a pressure measurement element and can suppress condensation around the sensor chip of water vapor permeating a protective member from a gas to be measured. The pressure sensor includes a pressure measurement chamber into which a gas to be measured is introduced; a sensor chip that faces the pressure measurement chamber; a sensor support that has a support surface supporting the sensor chip; and a protective member that covers the sensor chip. The pressure sensor also includes a heat insulation chamber that faces a back surface opposite to the support surface of the sensor support; and a gas passage that communicates the heat insulation chamber and the pressure measurement chamber.

Example aspects of an outer housing for a pressure monitoring system and a pressure monitoring system for a wet barrel hydrant are disclosed. The outer housing for a pressure monitoring system can comprise a sidewall shell defining an axis extending centrally therethrough and comprising an annular inner sidewall projection extending from a top end thereof; and a cap mounted to the sidewall shell, the cap defining an annular cap recess, wherein the annular inner sidewall projection is configured to engage the annular cap recess.

Example aspects of a pressure monitoring system for a wet barrel hydrant, a pressure monitoring and leak detection system for a wet barrel hydrant, and a method for using a pressure monitoring and leak detection system are disclosed. The pressure monitoring system for a wet barrel hydrant can comprise a pressure sensor assembly comprising a pressure sensor and a connector, the pressure sensor configured to measure the pressure of a fluid received in the wet barrel hydrant, the connector configured to attach the pressure monitoring system to the wet barrel hydrant; a mounting flange coupled to the pressure sensor assembly; a main PCB configured to process pressure data measured by the pressure sensor; an antenna configured to send a signal representative of the pressure data; and a housing coupled to the mounting flange, the housing enclosing the processor and the antenna.

A water bag pressure detection device, a water bag inflow control device and a water bag type water purifier are provided. The water bag pressure detection device includes: a base seat defining an airtight cavity therein, and having an upper end provided with a mounting opening; a pressure sensor module having at least a lower portion disposed in the airtight cavity and connected with a circumferential edge of the mounting opening in a sealing manner, an inductive head of the pressure sensor module being configured to abut against a lower portion of the water bag; and a ventilation member defining a ventilation passage therein and disposed to the base seat, the ventilation passage being provided with a balancing seal member configured to move in the ventilation passage along with variations of pressure in the airtight cavity and outside pressure.