Methods, systems, and apparatuses are provided for detecting and determining conditions of and conditions within a fluid conduit.

Methods, systems, and apparatuses are provided for detecting and determining conditions of and conditions within a fluid conduit.

A first level package for a pressure sensor module includes a lead frame which contains a circuit and one or more passive devices. A ceramic substrate is attached to the lead frame via an adhesive bond. The substrate contains conductive traces printed on the substrate. Conductive bonds are used to connect the circuit, the substrate and the lead frame together. After bonding, the pressure sensor module is encapsulated by a thermoset epoxy resin overmold which is then sealed within a pressure sensor housing.

A pressure sensor including a crystal housing, a transducer crystal disposed in the housing in vacuum conditions, a driver in contact with the crystal transducer, and a deflectable member in contact with the driver on one surface and exposed to ambient pressure on the opposite surface thereof. A borehole system including a borehole in a subsurface formation, a string in the borehole, and a sensor connected to the string.

A differential pressure sensor for determining the differential pressure between two pressures includes a converter chamber including a differential pressure measuring cell, and a measuring unit including a main body and a coplanar double-membrane system with two double membranes, each including a separating membrane and an overload membrane with a pressure chamber between the separating membrane and the overload membrane and an additional pressure chamber between the overload membrane and the main body. Each pressure chamber and each additional pressure chamber is paired with at least one capillary connection such that in the event of an overpressure, the overpressure is hydraulically transmitted from the high-pressure side to the low-pressure side via a hydraulic fluid such that the overload membrane and the separating membrane are deflected, and the hydraulic fluid displaced from the high-pressure side to the additional pressure chamber on the low-pressure side before the overpressure reaches the pressure-sensitive element.

In a flexible printed wiring board (1), a first electrical conduction pattern (4) prepared on the first surface (3a) on which a bare chip (2) is mounted is prepared only inside a mounting region (3c) of the bare chip. Preferably, the first electrical conduction patterns (4) are prepared so as to avoid positions opposite to test electrodes (2b) which the bare chip comprises. Thereby, in the flexible printed wiring board used for mounting the bare chip, occurrence of malfunction resulting from electrical connection with a part other than a bump of the bare chip can be certainly prevented, and reliability of various devices using the bare chip can be improved.

A noise resistance of a pressure sensor is improved while avoiding a hetero metal bonding. A pressure detection device includes a metal case having the diaphragm which is deformed due to a pressure received from a pressure medium, a sensor element which detects a pressure by detecting the deformation of the diaphragm, a lead frame which is electrically connected to the sensor element, and a connection member which holds the lead frame. A first surface of the lead frame, that is, the surface on a side near the metal case in the parallel plate region, and a second surface of the metal case, that is, the upper surface of the base member interpose at least one of the resin of the connection member being an insulator and the insulating adhesive and are disposed to face each other with a predetermined gap therebetween.

A sensor package 1 includes a sensor carrier 2 with a sensor element 4, a pre-moulded tray part 10 with an exposed cavity 12, the sensor carrier 2 with the sensor element 4 being positioned in a recess 21 of the pre-moulded tray part 10 part to extend into the exposed cavity 12. A lead frame 6 is arranged to provide external connections of the sensor package 1, an over-moulding package part 8, arranged around the lead frame 6 and the pre-moulded tray part 10 and having an aperture 12a aligned with the exposed cavity 12.

The outer housing for a pressure monitoring system includes a sidewall shell comprising an annular inner sidewall projection extending from a top end thereof; a cap mounted to the sidewall shell, the cap defining an inner cap surface, an outer cap surface, a cap bottom end, and an annular cap recess extending into the cap bottom end between the outer cap surface and the inner cap surface, wherein the annular inner sidewall projection is configured to engage the annular cap recess; and an antenna assembly directly mounted to the inner cap surface, the antenna assembly comprising an antenna.

An electronic pressure sensor includes a housing having a distal end configured to be exposed to a flow of a fluid media, the distal end opposite a proximal end, wherein the proximal end is configured not to be exposed to the fluid media. A chamber and connected passageway are disposed within the housing. The passageway is connected at one end to the chamber and connected at another end to an opening disposed at the distal end of the housing. The opening is configured to be in fluidic communication with the fluid media. A pressure sensor is disposed within the chamber. A first temperature sensor is disposed within the chamber. A viscous gel is disposed within the chamber, the viscous gel separating on a first side both the pressure sensor and the first temperature sensor apart from the passageway on a second side of the viscous gel.