The invention relates to a sensor device (10), in particular for use in a motor vehicle, comprising a housing (11) for receiving a sensor element (1), wherein the sensor element (1) has contact surfaces (21 to 23) that are electrically conductively connected with electrical plug connections (27) arranged in the housing (11), in the region of contacts (24 to 26), wherein the sensor element (1) is applied with force by a housing element (13), in particular formed as a housing cover, in the direction of the contacts (24 to 26) for the purposes of electrical contacting, and wherein a support in the form of a 3-point contact is formed between the sensor element (1) and the housing (11). According to the invention, the sensor element (1) has at least two measuring devices (5, 6), and the at least two measuring devices (5, 6) have three contact surfaces (21 to 23) that form the 3-point contact.

A semiconductor pressure sensor device in which the shape or the structure of a connector portion can be easily changed and which has high waterproof performance. A terminal housing and a second case are engaged with each other via an engagement structure. The terminal housing and a first case are fitted with each other via a fitting structure. Thus, the first case and the second case are fixed to each other via the terminal housing. The first case is fitted in the second case. Then, the terminal housing is fitted with the first case, and the terminal housing is engaged with the second case substantially at the same time. Through such simple process, an opening portion of the first case is covered and a connector portion configured to enable external terminals to be connected to ends, located on one side, of a plurality of lead terminals is formed.

A pressure sensor for measuring a pressure of a fluid medium in a measuring chamber is provided. The pressure sensor includes a sensor housing, a first pressure-sensor module for measuring at least one first pressure of the medium in a first measuring chamber, and a second pressure-sensor module for measuring at least one second pressure of the medium in a second measuring chamber. The first pressure-sensor module and the second pressure-sensor module are situated inside the sensor housing. In addition, the pressure sensor has at least one first pressure connection, which is designed for the connection to the first measuring chamber. Moreover, the pressure sensor has at least one second pressure connection, which is developed for the connection to the second measuring chamber. The first pressure connection differs from the second pressure connection.

Each of a plurality of hydraulic pressure sensors includes a lower case and an upper case fixed above the lower case. A valve body includes an upper body including a hole portion arranged to house the hydraulic pressure sensors, and a lower body including an oil passage. A pressed portion is defined in the lower case. The pressed portion is arranged to project horizontally in the lower case so as to be opposed to the upper case. The pressed portion is arranged to be pressed downward by a pressing portion of the upper body. At least one of the upper body and the lower body includes a positioning portion arranged to horizontally position each of the hydraulic pressure sensors in the hole portion.

A temperature sensor integrated type semiconductor pressure sensor apparatus includes a temperature detection device, a lead wire covered with a lead wire protection material, and a terminal, which are integrated together by a thermoplastic resin. This can prevent the lead wire from being deformed in the assembly process, thereby simplifying the assembly process. Furthermore, the temperature detection device is exposed from the opening at the tip of the protrusion, which can secure enough temperature response. Furthermore, the temperature detection device, the lead wire and the lead wire protection material are covered with the thermoplastic resin, so they are protected from combustion gas component, oil contaminant and corrosion product included in intake air.

The present invention relates to a differential pressure sensor. The differential pressure sensor includes: a housing including a body and a cover, the housing having a first chamber and a second chamber defined in the housing and separated from each other; a first pressure channel communicating with the first chamber; a second pressure channel communicating with the second chamber; a substrate on which an electronic component is mounted and in which a terminal is formed, the substrate including a first surface facing the first chamber and a second surface extending parallel to the first surface and facing the second chamber, the substrate configured to cover the second chamber; a sensor element installed on the first surface of the substrate so as to generate an electric signal corresponding to a pressure difference between the first chamber and the second chamber; a lead frame installed in the housing with one end thereof extending into the first chamber, the lead frame configured to transmit the electric signal of the sensor element to an external device; a conductive wire configured to connect the terminal of the substrate and the lead frame so as to transmit the electric signal of the sensor element to the lead frame; a first sealing member disposed in a region where the body and the cover make contact with each other, the first sealing member configured to seal the first chamber with respect to the outside; and a second sealing member disposed in a region where the substrate and the body make contact with each other, the second sealing member configured to seal the second chamber with respect to the first chamber.

A modular sensor for a fluidic analysis or biological assay system, such as an analytical instrument system, and other systems involving fluid flow, includes a cap and base which include one or more sensors therein, which may be a flow sensor, a pressure sensor, a temperature sensor, a pH sensor, and so forth. The base of the modular sensor includes input and output ports for fluid passageways therethrough to provide a fluid pathway which is at least partially adjacent to or near the sensor. The modular sensor may also include an adapter having ports adapted to sealingly engage with fitting assemblies. The sensor may be partially or wholly encapsulated as part of the base of the modular sensor. The modular sensor's base and cap are adapted so that a first modular sensor can be disconnected and removed from a fluidic system and a second modular sensor can be added and connected to the system in place of the first modular sensor. The modular sensor is adapted to be interchangeable with one or more other modular sensors.

[Object] Provided are a pressure detection unit and a pressure sensor using the same capable of preventing a decrease in detection accuracy of a semiconductor type pressure detection device even when a high voltage is accidentally applied.

[Solving Means] A pressure detection unit includes a pressure receiving structure including a ring-shaped ring member, a receiving member facing the ring member, and a diaphragm interposed between the ring member and the receiving member, a base made of ceramic joined to the ring member to form a pressure receiving space between the base and the diaphragm, a semiconductor type pressure detection device installed on a side of the pressure receiving space of the base, and a terminal pin which is electrically connected to the semiconductor type pressure detection device and penetrates the base.

[Object] Provided are a pressure detection unit and a pressure sensor using the same capable of performing a trimming operation using a simple structure during an assembly operation, and reducing a decrease in detection accuracy of a semiconductor type pressure detection device.

[Solving Means] A pressure detection unit includes a base formed in a lid shape and made of ceramic, a receiving member formed in a plate shape, a diaphragm interposed between the base and the receiving member, a semiconductor type pressure detection device installed on a side of a pressure receiving space formed between the base and the diaphragm in the base, and three terminal pins electrically connected to the semiconductor type pressure detection device, the terminal pins penetrating the base, wherein the three terminal pins include an earth terminal pin, a power input terminal pin, and a signal output terminal pin.

When a main body of a sensor chip (1) is in a grounded state, a shield layer (71) constituting a shield electrode formed on a circuit layer (72) is grounded through a resistor (46).