G01L19/142

PRESSURE DETECTION DEVICE AND METHOD OF MANUFACTURING PRESSURE DETECTION DEVICE
20220260445 · 2022-08-18 · ·

Provided is a pressure detection device including a pressure detection unit and a channel unit. The channel unit has a contact part arranged in contact with the pressure detection unit, the contact part has a protective film arranged in contact with a pressure detection surface and configured to block contact between the pressure detection surface and a liquid and a body forming an opening arranged at an end of the channel, the protective film and the body are formed of a thermoplastic fluorine resin, and the protective film is arranged so as to close the opening of the body and welded to the body in an annular region extending circumferentially about the axis.

PHYSICAL QUANTITY SENSOR DEVICE AND METHOD OF MANUFACTURING PHYSICAL QUANTITY SENSOR DEVICE
20220260444 · 2022-08-18 · ·

A sensor device for measuring a physical quantity. The sensor device includes a sensor element having a semiconductor chip, a first terminal electrically connected to the sensor element, and a housing portion having a terminal, which is a second terminal and is electrically connected to the first terminal. The second terminal has a through-hole formed therein, the through-hole having a first end and a second end opposite to each other, an inner surface of the through hole at the first end being an R-surface that is a curved surface with a radius R. The first terminal is housed in the housing portion, and has one end thereof inserted in the through-hole from the first end of the through-hole.

DIFFERENTIAL PRESSURE SENSOR
20220316973 · 2022-10-06 ·

A differential MEMS pressure sensor includes a topping wafer with a top side and a bottom side, a diaphragm wafer having a top side connected to the bottom side of the topping wafer and a bottom side, and a backing wafer having a top side connected to the bottom side of the diaphragm wafer and a bottom side. The topping wafer includes a first cavity formed in the bottom side of the topping wafer. The diaphragm wafer includes a diaphragm, a second cavity formed in the bottom side of the diaphragm wafer underneath the diaphragm, an outer portion surrounding the diaphragm, and a trench formed in the top side of the diaphragm wafer and positioned in the outer portion surrounding the diaphragm.

Laboratory test device for permeation grouting of impermeable material

The present disclosure discloses a laboratory test device for permeation grouting of impermeable material, which comprises a slurry storage device with a stirrer, a grouting pump, electromagnetic flow meters, pressure sensors, a pressure chamber, a slurry collection tank, a pH value meter, a conductivity meter, electronic scales, an image acquisition system and a computer system. The computer system automatically acquires related data to save the labor, and the data is recorded completely so as to facilitate tests and researches. Software installed in the computer system can automatically process the data and displays a permeability coefficient in real time so as to achieve quick determination and real-time display of the permeability coefficient and facilitate development of laboratory tests and researches. Three pressure sensors are arranged on an organic glass cylinder of the pressure chamber at the equal intervals.

Pressure sensor with improved sealing
11293825 · 2022-04-05 · ·

The present invention aims to provide a pressure sensor capable of improving waterproofness and airtightness by using a sealing adhesive without the use of an atmosphere-side O-ring or packing and improving workability by filling the sealing adhesive in one direction. In the pressure sensor, a protective cover is formed by any combination of a joint, a lower cover, a pressure detection unit, and a case portion. The protective cover includes a side wall forming an outer periphery and a bottom on the pressure chamber side of the side wall. An opening on a side of the protective cover opposite to the bottom is filled with the sealing adhesive to maintain waterproofness and airtightness of a signal transmission unit.

Pressure sensor having base member and housing being joined together and manufacturing method of the same

A metallic base member includes a holding section and a first flange. A sensor chip on which sensor element is arranged is provided on the holding section. An insulating adjusting member is provided on the holding section around the sensor chip and a circumference thereof is positioned between a circumference of the holding section and a circumference of the first flange. A metallic housing includes an opening section and a second flange, an inner surface of the opening section is brought into contact with the circumference of the adjusting member, and the second flange is joined to the first flange.

Sensor assembly and physical quantity measuring device

A sensor assembly includes: a sensor module including a cylindrical portion into which a measurement target fluid is introduced and a diaphragm including a first surface in contact with the measurement target fluid and a second surface provided with a detector; a joint provided with a pressure introduction port for introducing the measurement target fluid to the sensor module; a cylindrical base member surrounding the sensor module; an electronic circuit attached to the base member to receive a detection signal outputted by the detector; and a temperature sensor electrically connected with the electronic circuit. The temperature sensor includes a temperature detector for detecting temperature, and a lead wire electrically connecting the temperature detector and the electronic circuit. The base member is provided with a receiver for receiving the temperature detector and the lead wire.

WELDED DIFFERENTIAL PRESSURE TRANSDUCER ASSEMBLY
20220107213 · 2022-04-07 ·

A differential pressure transducer assembly having internal sub-components welded together to improve reliability and ease assembly. A method is provided that includes welding a front adapter to a frontside of a header and welding a back adapter to a backside of the header to create a first sub-assembly. The method includes welding the first sub-assembly to a front attachment port to create a second sub-assembly. The method further includes welding a cap to a backside of the back adapter.

FIELD DEVICE HOUSING ASSEMBLY

Embodiments of the present disclosure are directed to field device housing assemblies and field devices that include the housing assemblies. One embodiment of the field device housing assembly includes a main housing, a cover having a proximal end connected to the main housing, a transparent panel and a retainer ring. An interior wall of the cover includes a threaded section that is concentric to a central axis, and a flange extending radially inward from the interior wall toward the central axis. The transparent panel is received within a socket defined by the interior wall and the flange. The retainer ring is secured to the threaded section of the interior wall. The transparent panel is clamped between the retainer ring and the flange.

SENSING STRUCTURE FOR PULSE-WAVE VELOCITY MEASUREMENT

An interface pressure sensor includes a fluid pressure sensor disposed in a volume defined by a shear wall. The volume is enclosed, and the fluid pressure sensor is encapsulated by, an infill material. The infill material defines a sensing surface that, when pressed, can impart a force that is detectable by the fluid pressure sensor.