Patent classifications
G01L19/145
Low stress integrated device packages
An integrated device package is disclosed. The integrated device package can include a packaging structure defining a cavity. An integrated device die can be disposed at least partially within the cavity. A gel can be disposed within the cavity surrounding the integrated device. A portion of the gel can be disposed between a lower surface of the integrated device die and an upper surface of the packaging structure within the cavity.
SENSOR BODY CELL OF A PRESSURE SENSOR
A sensor body cell for use in a pressure sensor includes a metal housing and an insulating cell. The metal housing has a first cavity with a first conical inner surface. A portion of the first conical inner surface is concave. The insulating cell includes a first seal portion within the first cavity and forms a seal with the first conical inner surface.
Pressure measuring device for protection of pressure sensor from thermomechanical stress
A pressure measuring device comprises a carrier, a base which is connected to the carrier, and a pressure sensor which is mounted on the base, wherein a bottom base area of the pressure sensor is greater than a top base area of the base, the pressure sensor being protected against thermomechanical stresses by an end of the base, which is facing away from the pressure sensor, the end being adhesively bonded into a recess in the support by an adhesive bond.
Methods for fabricating an apparatus having a hermetic seal
Apparatus and Methods for fabricating apparatus having a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.
Pressure measurement cell
A pressure measurement cell is disclosed including a base body, substantially cylindrical at least in sections, a measuring membrane joined to the base body in a pressure-tight manner along a perimeter joint to form a measurement chamber between the base body and the measuring membrane, and a joining material that joins the perimeter joint between the base body and the measuring membrane. The base body and/or the measuring membrane have/has a stepped recess into which the joining material is at least partially disposed, the stepped recess structured to yield a minimum distance between the base body and the measuring membrane.
HYDRAULIC GAGE CONTROL CYLINDER ANTI-DEADHEAD DEVICE
A hydraulic gage system is provided that includes a cylinder structure that is configured to allow the movement of a piston structure. The cylinder structure includes a plurality of vent structures that allows for the releasing of hydraulic fluid. A cover is positioned on the cylinder structure so when the piston passes the vent structures it relieves pressure as well as diminishes the force of impact on the cover by the piston.
Pressure Sensor
A pressure sensor includes a sensor element, an inner frame configured to receive at least a portion of the sensor element, and a housing configured to receive the inner frame therein. The inner frame is formed of a metal material and includes a printed circuit board assembly to be electrically connected to the sensor element. The housing is formed of a resin material.
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
A semiconductor device includes: a primary molded body includes a semiconductor chip that has a detector for detecting a physical quantity, and a primary molded resin having a resin material; a housing component includes an insertion hole for inserting the primary molded body; and a secondary molded resin, which is made of a resin material, that integrally covers a region exposed from the insertion hole, the region being a part of a surface of the primary molded body, and a part of a region of a surface of the housing component including a region surrounding the insertion hole. A part of the primary molded body including the semiconductor chip is in the insertion hole.
Snubber For Pressure Sensor And Pressure Sensor Comprising The Same
A pressure sensor comprises a sensor housing, a diaphragm provided in the sensor housing, and a snubber insertable into the sensor housing. The sensor housing includes a coupler coupling with a pressure measurement target and a housing passage passing through the coupler and guiding a fluid that flows into the sensor housing from the pressure measurement target. The diaphragm is deformable by a pressure of the fluid that flows into the sensor housing from the pressure measurement target. The snubber is inserted into the sensor housing through the housing passage and fastens to the sensor housing in a state in which at least a portion of the sensor housing forming the housing passage is deformed. The snubber guides flow of the fluid and transmits the pressure of the fluid to the diaphragm.
BREATHABLE WATERPROOF SHEET
A breathable waterproof sheet, which interposes a support layer having a plurality of holes formed therein, thus preventing a waterproof air-permeable layer from colliding with a pressure sensor by a water pressure. The breathable waterproof sheet includes a waterproof air-permeable layer formed of a film having elasticity, an adhesive layer having one surface adhered to one surface of the waterproof air-permeable layer, and a support layer having a plurality of air-permeable holes formed therein and having one surface adhered to the other surface of the adhesive layer.