Pressure sensors having ring-tensioned membranes are disclosed. A tensioning ring is bonded to a membrane in a manner that results in the tensioning ring applying a tensile force to the membrane, flattening the membrane and reducing or eliminating defects that may have occurred during production. The membrane is bonded to the sensor housing at a point outside the tensioning ring, preventing the process of bonding the membrane to the housing from introducing defects into the tensioned portion of the membrane. A dielectric may be introduced into the gap between the membrane and the counter electrode in a capacitive pressure sensor, resulting in an improved dynamic range.

A micro pressure sensor includes a sense die mounted on a substrate, a ring structure encircling the sense die, and a silicone material is overmolded to an exterior of the ring structure to form a seal with the ring structure and fills an interior of the ring structure. The ring structure has one or more legs at bottom side, which are snap fitted to the substrate through mating holes such that the ring structure encircles the sense die; and a top surface of the silicone material receives the external pressure and transmits the external pressure to the sense surface of the sense die to generate an output signal on the sense die, wherein a processor converts the output signal into a pressure reading. The pressure-transmitting media transmits a received external pressure to the sense surface of the sense die to generate an output signal from the sense die, wherein a processor converts the output signal into a pressure reading.

Methods, systems, and apparatuses are provided for detecting and determining conditions of and conditions within a fluid conduit.

Header construction and techniques are disclosed that utilize header layers that provide support for electrical interconnections. A sensor header assembly includes: an upper header layer having upper through holes arranged in a first configuration; a lower header layer having lower through holes arranged in a second configuration axially offset relative to the first configuration; depressions extending from the lower header layer top surface and partially through the lower header layer, each depression defining a footprint corresponding to the first configuration of the corresponding upper through holes of the upper header layer; upper header pins extending through the corresponding upper through holes and at least partially into the corresponding lower level depressions; and lower header pins extending through the corresponding lower through holes and in electrical communication with the corresponding upper header pins. The depressions form support surfaces for supporting at least the corresponding upper header pins during high-pressure operation.

In a pressure sensor, a cap-shaped shielding member (17) to block an electric field undesirable for a signal processing electronic circuit unit of a sensor chip (16) is supported by an end surface of a disk conductive plate (19) between one end surface of the sensor chip (16) in a liquid sealing chamber (13) and a diaphragm (32). The conductive plate (19) is electrically connected via a group of input-output terminals (40ai) and bonding wires (Wi), for example, and the sensor chip (16) is supported by one end portion of a chip mounting member (18) which is electrically connected via the group of input and output terminals (40ai) and the bonding wires (Wi).

According to one embodiment, a pressure detection device includes a buffer layer formed of an elastic material and including a press surface including a biaxially curved surface and an installation surface including a uniaxially curved surface opposing the press surface with an interval therebetween, and a sheet-shape pressure sensor provided in tight contact with the installation surface and uniaxially curved along the installation surface.

A one or multi-die module comprises multiple dies. The module includes at least one die with a sensor having a sensing region, an encapsulation layer covering top sides of the multiple dies, and a redistribution layer covering bottom sides of the multiple dies except for the sensing region. In embodiments, a cap is formed over the sensing region, which has at least a portion that is spaced away from a bottom side of the module. Metal connectors, such as solder balls, are formed on the redistribution layer to provide connection points to the module. A height of the cap from the bottom side of the module should be less than a height of the metal connectors. This approach can be used to incorporate environmental sensor dies into multi-die modules. It utilizes RDL and openings in the RDL in order to provide robust packaging for the dies, while also allowing the sensor dies to be selectively exposed to the environment.

A pressure sensor can include a housing having a sense side cavity formed on a first side of the housing; a sense side diaphragm attached to the first side and over the sense side cavity, a sense die assembly placed in the cavity and attached to the housing; a reference side cavity formed in the housing, a reference side diaphragm attached to a second side of the housing and over the reference side cavity, and pin(s) electrically connected to the sense die assembly and extending outside the housing from the second side. The cavities are filled with oil. Manufacturing the pressure sensor can include mounting the sense die assembly onto the housing, attaching the sense side diaphragm to the first side of the housing, filling the cavities with oil, and attaching the reference side diaphragm on the second side of the housing and over the reference side cavity.

The disclosed technology is a pressure transducer with a bleed valve built into the body of the transducer for purging liquid systems. The transducer assembly includes a body, a bleed valve port defined in the body and configured to accept a bleed valve, an interface port attached to the body, an adapter attached to a portion of the interface port, a header attached to the adapter and the body, a pressure transducer mounted to the header, and an internal cavity in communication with the interface port, the pressure transducer, and the bleed valve port. The bleed valve port is configured to vent a gas from the internal cavity. A bleed valve disposed in the bleed valve port is configured to controllably vent a gas from the internal cavity.

A MEMS device, e.g., a flexible MEMS pressure sensor, is formed by disposing a sacrificial layer, such as photoresist, on a substrate. A first flexible support layer is disposed on the substrate, and a first conductive layer is disposed over a portion of the first support layer. A liquid or gel separator, e.g., silicone oil, is disposed on an internal region of the first conductive layer. A second flexible support layer encapsulates the first conductive layer and the separator. A second conductive layer disposed over the second support layer at least partially overlaps the first conductive layer and forms a parallel plate capacitor. A third flexible support layer encapsulates the second conductive layer and second support layer. Soaking the sensor in hot water releases the sensor from the sacrificial layer.