Patent classifications
G01L19/148
PACKAGED PRESSURE SENSOR DEVICE AND CORRESPONDING METHOD FOR DETECTING THE PRESENCE OF FOREIGN MATERIAL
A pressure sensor device has: a pressure detection structure provided in a first die of semiconductor material; a package, configured to internally accommodate the pressure detection structure in an impermeable manner, the package having a base structure and a body structure, arranged on the base structure, with an access opening in contact with an external environment and internally defining a housing cavity, in which the first die is arranged covered with a coating material. A piezoelectric transduction structure, of a ultrasonic type, is accommodated in the housing cavity, in order to allow detection of foreign material above the coating material and within the package. In particular, the piezoelectric transduction structure is integrated in the first die, which comprises a first portion, wherein the pressure detection structure is integrated, and a second portion, separate and distinct from the first portion, wherein the piezoelectric transduction structure is integrated.
Measuring device with a sensor element and a measurement and operation circuit
The measuring device comprises a sensor element with an electrical transducer for providing a primary signal dependent on the measured variable and a sensor body with a flat surface portion. The measuring device also includes a measurement and operation circuit for driving the transducer and processing the primary signals. The measurement and operation circuit comprises at least one carrier, a plurality of circuit components including at least one integrated circuit, and passive components. The carrier comprises an electrically insulating carrier body and conductor paths which extend in the carrier body or on its surface. The integrated circuit and the passive component are arranged on the carrier body surface and contacted by the conductor paths. The carrier body is fixed to the surface portion, and the transducer is electrically connected to circuit components of the measurement and operation circuit via conductor paths, the components being encapsulated with a molding compound.
MEASURING DEVICE WITH A SENSOR ELEMENT AND A MEASUREMENT AND OPERATION CIRCUIT
The measuring device comprises a sensor element with an electrical transducer for providing a primary signal dependent on the measured variable and a sensor body with a flat surface portion. The measuring device also includes a measurement and operation circuit for driving the transducer and processing the primary signals. The measurement and operation circuit comprises at least one carrier, a plurality of circuit components including at least one integrated circuit, and passive components. The carrier comprises an electrically insulating carrier body and conductor paths which extend in the carrier body or on its surface. The integrated circuit and the passive component are arranged on the carrier body surface and contacted by the conductor paths. The carrier body is fixed to the surface portion, and the transducer is electrically connected to circuit components of the measurement and operation circuit via conductor paths, the components being encapsulated with a molding compound.
Pressure sensor device including improved conductivity and protection
A pressure sensing device comprising a body assembly, a connector assembly, an electronic circuit, and a pressure sensor is provided. The pressure sensing device is a compact device allowing for improved assembly. Moreover, the pressure sensing device allows for a leakage test and an electronic circuit control test to be performed before the assembly of the device thereby improving reliability and precision.
Pressure sensor assembly for use in implantable medical device including a substrate having via that extends through substrate along via axis between first major surface and second major surface of substrate
Various embodiments of a pressure sensor assembly and an implantable medical device that includes such assembly are disclosed. The assembly includes a substrate having a via that extends through the substrate along a via axis between a first major surface and a second major surface of the substrate, a membrane disposed on the first major surface of the substrate and over the via, and a patterned metal layer disposed on a first major surface of the membrane, a portion of such layer including a first capacitor plate. The assembly further includes an integrated circuit disposed adjacent to the first major surface of the membrane and electrically connected to the metal layer. The integrated circuit includes a second capacitor plate disposed on or within a substrate of the integrated circuit. The first capacitor plate and the second capacitor plate form a variable capacitor disposed along the via axis.
PRESSURE SENSOR
A pressure sensor includes: a cylindrical case defining an inner space in communication with an outer space; a pressure detector provided in the inner space of the cylindrical case and configured to detect a gauge pressure of a target fluid; an atmospheric pressure detector configured to detect an atmospheric pressure; and an electronic component configured to calculate an absolute pressure of the target fluid on a basis of the gauge pressure of the target fluid detected by the pressure detector and the atmospheric pressure detected by the atmospheric pressure detector.
Differential pressure sensor device having channel in fluid communication with a vent hole
The present invention relates to a differential pressure sensor device, comprising a substrate, another layer formed on a main surface of the substrate and a first cavity and a second cavity separated from each other by a membrane. The first cavity is in fluid communication with a channel that is in fluid communication with a vent hole through which air can enter from an environment of the sensor device. The channel extends within the other layer or the substrate in a plane that is substantially parallel to the main surface.
PRESSURE SENSOR
In a pressure sensor including a substrate supported by input-output terminals, the substrate is provided with a circular hole located substantially at its central part, and an arc-shaped communication hole formed adjacent to three through-holes to which three of lead pins are inserted and fixed, respectively.
Encased pressure sensor for measuring pressure in an aircraft wheel
A pressure measurement device (1) comprising a housing (20) extending around an electronic card (30) provided with a pressure sensor (40); the housing (20) co-operating with a first face (31) of the electronic card (30) to define a first sealed volume (3); the housing (20) also co-operating with a second face (32) of the electronic card (30) that is opposite from the first face (31) to define a second sealed volume (4); the housing (20) including at least one first channel (24) putting the medium (5) outside the housing (20) into fluid flow communication with the first sealed volume (3); the electronic card (30) including at least one second channel (33) putting the first volume (3) into fluid flow communication with the second volume (4); and the connection between the housing (20) and the electronic card (30) being arranged to allow relative movement between the housing (20) and the electronic card.
Implantable oil-filled pressure sensor
An implantable pressure sensor is disclosed that has a small diameter and eliminates any dead zone in the flow of the pressure transmission medium, and is thus particularly adapted for implantation. In one embodiment the pressure sensor comprises a body including a cavity for receiving a liquid, and a planar mounting surface extending in an axial direction of the body. A diaphragm is attached to the pressure sensor body for transmitting an external medium pressure to the liquid in the cavity. A pressure detection chip is mounted on the mounting surface of the pressure sensor body for detecting a pressure of the liquid within the cavity, and a circuit hoard is mounted on the planar mounting surface of the body and is electrically connected to the pressure detection chip resulting in a device of smaller diameter particularly suited for implantation.