A pressure sensor includes a lidless structure defining an internal chamber for a sealed environment and presenting an aperture; a chip including a membrane deformable on the basis of external pressure, the chip being mounted outside the lidless structure in correspondence to the aperture so that the membrane closes the sealed environment; and a circuitry configured to provide a pressure measurement information based on the deformation of the membrane.

A sensor assembly includes: a sensor module including a cylindrical portion into which a measurement target fluid is introduced and a diaphragm including a first surface in contact with the measurement target fluid and a second surface provided with a detector; a joint provided with a pressure introduction port for introducing the measurement target fluid to the sensor module; a cylindrical base member surrounding the sensor module; an electronic circuit attached to the base member to receive a detection signal outputted by the detector; and a temperature sensor electrically connected with the electronic circuit. The temperature sensor includes a temperature detector for detecting temperature, and a lead wire electrically connecting the temperature detector and the electronic circuit. The base member is provided with a receiver for receiving the temperature detector and the lead wire.

In a pressure sensor, an electric field acting on one end surface of a sensor chip (16) is blocked by a shielding member (17), and an electric field acting on another end surface of the sensor chip (16) is removed through one end portion of a chip mounting member (18), a group of input and output terminals (40ai), and a bonding wire (Wi).

A pressure sensor has a stem in which a pressure introduction hole into which a pressure medium is introduced and a diaphragm deformable according to the pressure of the pressure medium are formed, and a strain detecting element which is arranged on the diaphragm via an insulating film and being configured to output a detection signal according to the deformation of the diaphragm. The strain detecting element is configured to have a portion made of polysilicon. A low doping layer having a higher electrical resistivity than polysilicon and a higher crystallinity than the insulating film is arranged between the insulating film and the strain detecting element.

A pressure sensor comprises a body including a cavity for receiving a liquid, and a planar mounting surface extending in an axial direction of the body. A diaphragm is attached to the body for transmitting an external medium pressure to the liquid in the cavity. A pressure detection chip is mounted on the mounting surface of the body for detecting a pressure of the liquid within the cavity, and a circuit board is mounted on the mounting surface of the body and is electrically connected to the pressure detection chip.

An electronics package includes a platform and a board mounted to the platform, the board having electronics mounted thereon. A feedthrough pin passes through and is hermetically sealed to a feedthrough body and is wire bonded to the board. A cover is bonded to and surrounds the exterior surface of the feedthrough body to produce a hermetically sealed chamber that houses the platform and the board.

A device for detecting a pressure of a fluid medium is described. The device includes at least one housing having at least two pressure feeds; at least one sensor module, the sensor module being accommodated in the housing, the sensor module including at least one support element, the support element including at least one substrate and at least one molding compound, the support element further including at least one passage opening, the passage opening entirely penetrating the support element; at least one pressure sensor element for detecting the pressure, the pressure sensor element including at least one diaphragm, the pressure sensor element covering the passage opening; at least one control and evaluation unit, the control and evaluation unit being at least partially enclosed by the molding compound. A method for manufacturing the device is also described.

A noise resistance of a pressure sensor is improved while avoiding a hetero metal bonding. A pressure detection device includes a metal case having the diaphragm which is deformed due to a pressure received from a pressure medium, a sensor element which detects a pressure by detecting the deformation of the diaphragm, a lead frame which is electrically connected to the sensor element, and a connection member which holds the lead frame. A first surface of the lead frame, that is, the surface on a side near the metal case in the parallel plate region, and a second surface of the metal case, that is, the upper surface of the base member interpose at least one of the resin of the connection member being an insulator and the insulating adhesive and are disposed to face each other with a predetermined gap therebetween.

A pressure measurement device (1) comprising a housing (20) extending around an electronic card (30) provided with a pressure sensor (40); the housing (20) co-operating with a first face (31) of the electronic card (30) to define a first sealed volume (3); the housing (20) also co-operating with a second face (32) of the electronic card (30) that is opposite from the first face (31) to define a second sealed volume (4); the housing (20) including at least one first channel (24) putting the medium (5) outside the housing (20) into fluid flow communication with the first sealed volume (3); the electronic card (30) including at least one second channel (33) putting the first volume (3) into fluid flow communication with the second volume (4); and the connection between the housing (20) and the electronic card (30) being arranged to allow relative movement between the housing (20) and the electronic card.

A pressure sensor for measuring a pressure of a fluid, the pressure sensor including: a sensor element for measuring the pressure of the fluid; a control and/or evaluation circuit for controlling and/or evaluating a measuring signal of the sensor element; a circuit carrier, the control and/or evaluation circuit being disposed on the circuit carrier; a carrier element, the circuit carrier being fastened on the carrier element; and a housing element, the carrier element together with the circuit carrier being fastened in the housing element in a form-locking and/or force-locking manner, wherein the carrier element is configured in one piece from an electrically non-conducting material.