A system and method for high-throughput testing and module integration of rotationally variant optical lens systems is provided. In some examples, the system may be a metrology system that includes a light source to generate optical illumination. The metrology system may also include a null element. The null element may generate, using the optical illumination from the light source, a prescribed wavefront corresponding to a unit under test (UUT). In addition, the metrology system may further include a null element fixture to position the null element with respect to the unit under test (UUT).

Provided is a test method performed using a lens which comes into contact with a human body during use, the test method including the steps of: providing a membrane member including a membrane swellable upon absorbing water and a supporting base having an annular shape to support an outer periphery of the membrane; allowing cells to adhere on the membrane of the membrane member; and bringing the membrane to which the cells are adhered into close contact with the surface of the lens, by immersing the membrane member and the lens into a liquid and deforming the membrane in a swollen state along the surface of the lens.

A structure for, and method of, forming a first optoelectronic circuitry that generates an optical signal, a second optoelectronic circuitry that receives an optical signal, and a loopback waveguide that connects the output from the first optoelectronic circuitry to the second optoelectronic circuitry on an interposer substrate are described. The connected circuits, together comprising a photonic integrated circuit, are electrically tested using electrical signals that are provided via probing contact pads on the PIC die. Electrical activation of the optoelectrical sending devices and the subsequent detection and measurement of the optical signals in the receiving devices, in embodiments, provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.

Provided are systems and methods for measurement of optical vignetting, which can include causing a selective emitter array to emit at least one beam of light through an off-optical axis field position of a lens assembly, receiving, at a photo sensor array, an off-axis spot based at least in part on the emitted at least one beam of light, determining a size of the off-axis spot, and determining an off-axis F-Number of the lens assembly associated with the off-optical axis field position based on comparing the determined size of the off-axis spot with a size of an on-axis spot. Systems and computer program products are also provided.

A method is provided for measuring optical characteristics of a glass sheet as the glass sheet is conveyed in a system for fabricating glass sheets including one or more processing stations and one or more conveyors for conveying the glass sheet during processing. The method comprises providing a background screen including contrasting elements arranged in a pre-defined pattern and a camera for acquiring an image of the background screen; acquiring data associated with a shape of a glass sheet travelling on a conveyor upstream from the background screen; removing the glass sheet from the conveyor; and positioning the glass sheet between the camera and the screen and thereafter acquiring an image of the background screen; re-positioning the glass sheet for continued movement of the glass sheet on the conveyor; and performing one or more processing operations using the acquired image data to analyze the optical characteristics of the glass sheet.

An optical probe receives an optical signal output from a test subject. The optical probe includes an optical waveguide composed of a core portion and a cladding portion disposed on an outer periphery of the core portion, wherein an incident surface of the optical waveguide, which receives the optical signal, is a convex spherical surface with a constant curvature radius.

A method for determining an index-of-refraction profile of an optical object, which has a cylindrical surface and a cylinder longitudinal axis, said method comprising the following method steps: (a) scanning the cylindrical surface of the object at a plurality of scanning locations by means of optical beams; (b) capturing, by means of an optical detector, a location-dependent intensity distribution of the optical beams deflected in the optical object; (c) determining the angles of deflection of the zero-order beams for each scanning location from the captured intensity distribution, comprising eliminating beam intensities, and (d) calculating the index-of-refraction profile of the object on the basis of the angle-of-deflection distribution, wherein method steps (a) and (b) are carried out with light beams having at least two different wavelengths.

Methods, apparatus, and systems for mitigating pinhole defects in optical devices such as electrochromic windows. One method mitigates a pinhole defect in an electrochromic device by identifying the site of the pinhole defect and obscuring the pinhole to make it less visually discernible. In some cases, the pinhole defect may be the result of mitigating a short-related defect

Disclosed is a spatial property measurement device or color implementation property of a holographic image. According to an aspect of the present embodiment, a spatial property measurement device or color implementation property of a holographic image reproduced by a holographic display device is provided.

A camera metrology apparatus including a base section, a drive section with independent drive axes, and an actuation platform having a camera mount, with a predetermined camera mount interface for a camera, and a camera stimulation source mount, with a predetermined stimulation source mount interface, and being coupled to one of the drive axes to generate relative motion between each interface effecting metrology measurement of the camera, wherein the actuation platform has a selectable configuration between different predetermined platform configurations, each with different predetermined mounting location characteristics changing a predetermined mounting location of the camera mount interface or stimulation source mount interface and effecting a different predetermined metrology measurement characteristic, and the camera mount and the camera stimulation source mount are arranged to define a repeatable relative position between the camera mount interface and stimulation source mount interface in each platform configuration and effect free selection between each platform configuration.