The disclosure provides a method of forming an erasable optical coupler in a photonic device comprising a conventional optical waveguide formed in a crystalline wafer. The method comprises selectively implanting ions in a localized region of the wafer material adjacent to the conventional waveguide of the photonic device, to cause modification of the crystal lattice structure of, and a change in refractive index in, the ion implanted region of the wafer material to thereby form an ion implanted waveguide optically coupled to the adjacent conventional waveguide to couple light out therefrom, or in thereto. The crystalline wafer material and ion implanted waveguide are such that the crystal lattice structure or composition can be modified to adjust or remove the optical coupling with the conventional waveguide by further modification of the refractive index in the ion implanted region.

A mode control system and method for controlling an output mode of a broadband radiation source including a photonic crystal fiber (PCF). The mode control system includes at least one detection unit configured to measure one or more parameters of radiation emitted from the broadband radiation source to generate measurement data, and a processing unit configured to evaluate mode purity of the radiation emitted from the broadband radiation source, from the measurement data. Based on the evaluation, the mode control system is configured to generate a control signal for optimization of one or more pump coupling conditions of the broadband radiation source. The one or more pump coupling conditions relate to the coupling of a pump laser beam with respect to a fiber core of the photonic crystal fiber.

A method of optical device metrology is provided. The method includes providing a first type of light into a first optical device during a first time period; measuring a quantity of the first type of light transmitted from a first location on the top surface or the bottom surface during the first time period; coating at least a portion of an edge of the one or more edges with a first coating of optically absorbent material during a second time period that occurs after the first time period; providing the first type of light into the first optical device during a third time period that occurs after the second time period; and measuring a quantity of the first type of light transmitted from the first location on the top surface or the bottom surface during the third time period.

System and methods for optical power distribution to a large numbers of sample wells within an integrated device that can analyze single molecules and perform nucleic acid sequencing are described. The integrated device may include a grating coupler configured to receive an optical beam from an optical source and optical splitters configured to divide optical power of the grating coupler to waveguides of the integrated device positioned to couple with the sample wells. Outputs of the grating coupler may vary in one or more dimensions to account for an optical intensity profile of the optical source.

At various positions in an eye motion box (EMB) an output image from an optical device can be captured and analyzed for detection and evaluation of image propagation via the optical device. Optical testing along a specific axis can evaluate optical engine transfer function uniformity across facet's active area, detect the existence and degree of “smearing” of a projected image from an optical device, and detect the existence and degree of a “white stripes” (WS) phenomenon related to scattering and diffraction in the wedge-to-LOE interface. A variety of metrics can be derived for quality control and feedback into the production system, and for disposition of the optical devices.

The present invention relates to a method and an apparatus for measuring the temperature of optical fibers during fusion splicing or thermal processing, said method comprising: a) measuring, using an interferometric method, a change in an optical path length in an optical fiber due to temperature dependent properties of the optical fiber during fusion splicing or thermal processing; and b) determining the temperature of the optical fiber based on the measured changes in the optical path length.

A structure and method for the wafer level testing of interposer-based photonic integrated circuits is described that includes the formation of an upturned mirror structure and the method of utilizing the interposer-based mirror structure for electrical and optical testing of optoelectrical circuits that include emitting components such as lasers, detecting components such as photodetectors, and both emitting and detecting components. Electrical activation of the optoelectrical emitting or sending devices and the subsequent detection and measurement of the optical signals in detecting or receiving devices provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.

A mode control system and method for controlling an output mode of a broadband radiation source including a photonic crystal fiber (PCF). The mode control system includes at least one detection unit configured to measure one or more parameters of radiation emitted from the broadband radiation source to generate measurement data, and a processing unit configured to evaluate mode purity of the radiation emitted from the broadband radiation source, from the measurement data. Based on the evaluation, the mode control system is configured to generate a control signal for optimization of one or more pump coupling conditions of the broadband radiation source. The one or more pump coupling conditions relate to the coupling of a pump laser beam with respect to a fiber core of the photonic crystal fiber.

A wavelength checker includes an optical converter composed of a conversion material that converts infrared light into visible light. The optical converter is disposed, on an output side (side from which light is output to an external space) of a plurality of first output waveguides of an optical waveguide chip, to receive emitted light that is guided through the first output waveguides and reflected on and emitted from the light emitting-side end surface. The light emitting-side end surface is a reflection surface that is inclined to face a main substrate.

An on-wafer testing mechanism includes multiple waveguides and test structures disposed on a wafer. Light sources are coupled to the wafer and provide beams of light to the structures disposed on the wafer by propagating the light through the wafer. In response to receiving at least a portion of a beam of light, a test structure is configured to guide the light to an exit location on the test structure. As light exits a test structure, a conoscope determines the diffraction efficiency of the test structure based on a measurement taken of the light exiting the test structure.