A structure multi-dimensional loading test system considering real complex boundary conditions considering real complex boundary conditions comprises a main part of machine, a base part, a hydraulic power supply and a control system. The system can simulate the load borne by a structure in a real working environment better and more accurately, realize multi-dimensional loading of the structure with six degrees of freedom in space and provide more real and valuable experimental data for the research on damage of reinforced concrete materials, components and structures under the action of an earthquake, and the research results will help researchers further reveal the damage mechanism of reinforced concrete structures, put forward the corresponding damage criteria and develop the corresponding seismic design methods.

A structure multi-dimensional loading test system considering real complex boundary conditions considering real complex boundary conditions comprises a main part of machine, a base part, a hydraulic power supply and a control system. The system can simulate the load borne by a structure in a real working environment better and more accurately, realize multi-dimensional loading of the structure with six degrees of freedom in space and provide more real and valuable experimental data for the research on damage of reinforced concrete materials, components and structures under the action of an earthquake, and the research results will help researchers further reveal the damage mechanism of reinforced concrete structures, put forward the corresponding damage criteria and develop the corresponding seismic design methods.

A film structure puncture testing tool for testing the resistance to puncturing of a film structure for a product package and a method for analyzing film structures resistance to puncturing.

A film structure puncture testing tool for testing the resistance to puncturing of a film structure for a product package and a method for analyzing film structures resistance to puncturing.

An example hinged device flexible substrate testing system includes: a first plate comprising a first surface configured to hold stationary a first portion of a hinged device under test; a second plate comprising a second surface configured to hold a second portion of the hinged device under test, the second portion of the hinged device coupled to the first portion via a first hinge having a first folding radius; a third plate comprising a third surface configured to hold a third portion of the hinged device under test, the third portion of the hinged device coupled to the first portion via a second hinge having a second folding radius; a first cam follower coupled to the second plate; a first drive arm configured to move the first cam follower to cause the second plate to rotate about a first hinge pivot axis of the first hinge; a first actuator configured to rotate the first drive arm; a second cam follower coupled to the third plate; a second drive arm configured to move the second cam follower to cause the third plate to rotate about a second hinge pivot axis of the second hinge; a second actuator configured to rotate the second drive arm; and a load cell configured to measure first loads on the first plate while the first actuator moves the second plate and to measure second loads on the first plate while the second actuator moves the third plate.

An example hinged device flexible substrate testing system includes: a first plate comprising a first surface configured to hold stationary a first portion of a hinged device under test; a second plate comprising a second surface configured to hold a second portion of the hinged device under test, the second portion of the hinged device coupled to the first portion via a first hinge having a first folding radius; a third plate comprising a third surface configured to hold a third portion of the hinged device under test, the third portion of the hinged device coupled to the first portion via a second hinge having a second folding radius; a first cam follower coupled to the second plate; a first drive arm configured to move the first cam follower to cause the second plate to rotate about a first hinge pivot axis of the first hinge; a first actuator configured to rotate the first drive arm; a second cam follower coupled to the third plate; a second drive arm configured to move the second cam follower to cause the third plate to rotate about a second hinge pivot axis of the second hinge; a second actuator configured to rotate the second drive arm; and a load cell configured to measure first loads on the first plate while the first actuator moves the second plate and to measure second loads on the first plate while the second actuator moves the third plate.

An impact test fixture capable of applying preload on a composite laminate, which is composed of a base, a clamping mechanism and a loading mechanism, where the clamping mechanism is positioned on an upper surface of the base and fixedly connected to the base through a bolt, and the loading mechanism is installed at an end of the base. A composite laminate is placed in a rectangular groove of the base. A first wedge block and a second wedge block are positioned in a base sliding groove between a pressing block and a baffle plate, and inclined planes of the two wedge blocks are oppositely installed; the baffle plate is matched with the base through a first fixing bolt and a second fixing bolt, a loading bolt passes through a screw hole at a side end of the base and is matched with the first wedge block.

The present invention relates to a chip tray positioning device, which mainly comprises a frame body, a tray conveying module, a pulling module, a pushing module and a controller. The tray conveying module is disposed on the frame body, electrically connected to the controller and controlled to convey a chip tray from the start area to the end area. The pulling module and the pushing module are disposed on the frame body, electrically connected to the controller and controlled to cause the chip tray to be abutted against the end wall and the lateral wall of the frame body, thereby realizing the positioning of the chip tray and eliminating an error formed in the transfer process of the chip tray. In addition, the controller also controls the pushing module to knock the chip tray at a specific frequency so that the chip tray is vibrated.

The present invention relates to a jig for evaluating a buffer pad. The jig includes a first plate configured to be positioned on one surface of the buffer pad and configured to press the buffer pad; a second plate configured to be positioned on another surface of the buffer pad and configured to press the buffer pad from the other surface; and a magnet member configured to be positioned between the first plate and the second plate. A recessed portion, which is recessed to allow the magnet member to be disposed, is defined at an edge of at least one of the first plate and the second plate.

The present invention relates to a jig for evaluating a buffer pad. The jig includes a first plate configured to be positioned on one surface of the buffer pad and configured to press the buffer pad; a second plate configured to be positioned on another surface of the buffer pad and configured to press the buffer pad from the other surface; and a magnet member configured to be positioned between the first plate and the second plate. A recessed portion, which is recessed to allow the magnet member to be disposed, is defined at an edge of at least one of the first plate and the second plate.