Patent classifications
G01N3/54
TEST DEVICE AND METHOD FOR CONTROLLING LOW-TEMPERATURE ENVIRONMENT
The invention provides a test device and method for controlling a low-temperature environment. A double-layer stainless steel plate forms an interlayer cavity of a cooling box; four walls of the cooling box are provided with a heat insulation plate; a probe thermometer is disposed on a side wall of the cooling box; both the top of a press and the bottom of an indenter of a universal testing machine are provided with a fiberglass reinforced plastic pipe cover; the cooling box is disposed on the press; the indenter is disposed in the cooling box through a through hole; a cold bath device communicate with the cooling box; the cold bath device and the interlayer cavity are provided with a freezing liquid; a stress-strain data acquisition instrument is connected to a sample in the cooling box through a strain gage and a strain gage connection line.
Measurement apparatus, test method, and physical property evaluation program for indentation creep test, and recording medium recording physical property evaluation program
A measurement apparatus for carrying out an indentation creep test on a specimen, including a measurement control apparatus that includes a load measurement device, a constant-load compression device configured to compress a tip of a transparent indenter to a surface of the specimen, and an image capturing device configured to optically capture an image including a contact area portion which is a part of the specimen to which the load is applied by the constant-load compression device. The apparatus also includes an information processing apparatus that includes an image analysis unit configured to analyze a contact area, and a physical property value calculation unit. The physical property value calculation unit conducts linear regression with respect to a plot of a logarithmic value of the contact stress and a logarithmic value of the contact strain rate so as to determine a creep index n and creep constant k.
Measurement apparatus, test method, and physical property evaluation program for indentation creep test, and recording medium recording physical property evaluation program
A measurement apparatus for carrying out an indentation creep test on a specimen, including a measurement control apparatus that includes a load measurement device, a constant-load compression device configured to compress a tip of a transparent indenter to a surface of the specimen, and an image capturing device configured to optically capture an image including a contact area portion which is a part of the specimen to which the load is applied by the constant-load compression device. The apparatus also includes an information processing apparatus that includes an image analysis unit configured to analyze a contact area, and a physical property value calculation unit. The physical property value calculation unit conducts linear regression with respect to a plot of a logarithmic value of the contact stress and a logarithmic value of the contact strain rate so as to determine a creep index n and creep constant k.
TEST COUPON AND TEST METHOD
A test coupon (1) for an ISO-standard-conforming test method for testing a material hardness of gearwheels. The test coupon (1) is designed as a two-piece test coupon (1) including a casing body (2) and a test body (3). The test coupon (1) being tested by an ISO-standard-conforming test method for determining a material hardness of the gearwheels.
TEST COUPON AND TEST METHOD
A test coupon (1) for an ISO-standard-conforming test method for testing a material hardness of gearwheels. The test coupon (1) is designed as a two-piece test coupon (1) including a casing body (2) and a test body (3). The test coupon (1) being tested by an ISO-standard-conforming test method for determining a material hardness of the gearwheels.
Method for testing interfacial tribochemical reaction between abrasive and diamond wafer
A method for testing an interfacial tribochemical reaction between a diamond wafer and active metal abrasive or metal oxide abrasive is provided. A surface of a diamond indenter used in a nano scratch tester is coated with a layer of the active metal abrasive or the metal oxide abrasive with uniform and controllable thickness by magnetron sputtering, and an interface interaction between the layer of the active metal abrasive or the metal oxide abrasive and the diamond wafer is controlled by a scratch test of the diamond wafer. Chemical components of an interaction section on a surface of the diamond wafer are analyzed by the scanning probe micro Raman spectrometer.
Method for testing interfacial tribochemical reaction between abrasive and diamond wafer
A method for testing an interfacial tribochemical reaction between a diamond wafer and active metal abrasive or metal oxide abrasive is provided. A surface of a diamond indenter used in a nano scratch tester is coated with a layer of the active metal abrasive or the metal oxide abrasive with uniform and controllable thickness by magnetron sputtering, and an interface interaction between the layer of the active metal abrasive or the metal oxide abrasive and the diamond wafer is controlled by a scratch test of the diamond wafer. Chemical components of an interaction section on a surface of the diamond wafer are analyzed by the scanning probe micro Raman spectrometer.
High temperature heating system
A sample gripping and heating assembly includes an assembly housing and first and second heating grips coupled with the assembly housing. The first and second heating grips each include a gripping surface, and the gripping surfaces of the first and second heating grips are opposed to each other. Each of the first and second heating grips further includes a heating element adjacent to the gripping surface. Optionally, the sample gripping and heating assembly is included in a heating system including a probe heater having a probe heating element for heating of a probe. The heating system is included with a testing assembly having a stage coupled with the sample gripping and heating assembly, and a transducer assembly coupled with the probe heater.
High temperature heating system
A sample gripping and heating assembly includes an assembly housing and first and second heating grips coupled with the assembly housing. The first and second heating grips each include a gripping surface, and the gripping surfaces of the first and second heating grips are opposed to each other. Each of the first and second heating grips further includes a heating element adjacent to the gripping surface. Optionally, the sample gripping and heating assembly is included in a heating system including a probe heater having a probe heating element for heating of a probe. The heating system is included with a testing assembly having a stage coupled with the sample gripping and heating assembly, and a transducer assembly coupled with the probe heater.
Method and system for analysing a test piece
A method for acoustically measuring material properties of a test piece at high temperatures, includes the steps of: heating the test piece to within a testing temperature range; performing a background measurement within said testing temperature range by capturing a vibrational signal from the test piece within a calibration period, thereby obtaining a noise signal; performing an acoustic measurement on said test piece within said testing temperature range and within a testing period by: imparting a vibrational excitation onto the test piece; capturing a vibrational signal of the test piece within the testing period, thereby obtaining a vibrational response signal to said vibrational excitation, and obtaining the material properties of the test piece by analyzing the vibrational response signal, thereby taking into account the noise signal. A system is provided for acoustically measuring material properties of a test piece at high temperatures.