A maintenance method of a gas detecting device includes the following steps: providing the gas detecting device that includes a shell component, a sensing component, a dust blocking element, and a detecting area, the sensing component including a sensor, a reference light source, and a processor, and the dust blocking element including a cover; the reference light source generating a reference beam projecting toward the cover and the detecting area, and the reference beam generating a feedback beam projecting toward the cover and the sensor through being reflected by a part of the shell component positioned at the detecting area; the sensor receiving the feedback beam to generate a measured information; and the processor comparing the measured information to an initial information in the processor, so as to obtain a pollution degree information of the cover.

The invention refers to a computer-implemented method of analyzing security documents having visible information and at least one of infrared and ultraviolet detectable information, the method comprising the steps of: receiving visible-color data of a first set of pixels of a first region of the security document in a first image of the security document and feeding the visible-color data to a convolutional neural network, CNN; receiving infrared, IR, and/or ultraviolet, UV, data of a second and/or third set of pixels of a respective second and/or third region in a respective second and/or third image of the security document and feeding the IR and/or UV data to the CNN; analyzing the visible-color data of the first set of pixels using the CNN to extract characteristics of the security document from the visible information; and analyzing the IR and/or UV data of the second and/or third set of pixels using the CNN to extract characteristics of the security document from the IR and/or UV information. Further, a corresponding system is provided.

An optical measurement device and an optical measurement method are provided. The optical measurement device includes a test backplane, a light emitter, a center point detector and a movement device. The movement device is provided on the test backplane, and configured to carry a to-be-tested sample. The light emitter is configured to display a first center point on the to-be-tested sample, and the first center point corresponds to a center point of the test backplane. The center point detector is configured to detect a second center point and display the second center point on the to-be-tested sample, and the second center point is a center point of the to-be-tested sample. The movement device is further configured to move the to-be-tested sample, such that the first center point and the second center point coincide with each other.

A flipper apparatus according to an embodiment disclosed herein includes: a Y-axis flipper unit configured to hold an object in a Y-axis direction and rotate the object about a Y-axis; an X-axis flipper unit configured to hold the object in an X-axis direction and rotate the object about an X-axis; and a Z-axis elevation unit supporting the Y-axis flipper unit and the X-axis flipper unit and configured to move the Y-axis flipper unit and the X-axis flipper unit up and down in a Z-axis direction.

An object inspection apparatus according to an embodiment disclosed herein includes: a first flipper apparatus configured to rotate a first object; a second flipper apparatus configured to rotate a second object; and a single camera device configured to move from a position corresponding to one of the first flipper apparatus and the second flipper apparatus to a position corresponding to the other, the camera device being configured to inspect object surfaces of the first object and the second object. Each of the first flipper apparatus and the second flipper apparatus includes at least one flipper unit.

Systems, devices, and methods for combined wafer and photomask inspection are provided. In some embodiments, chucks are provided, the chucks comprising: a removable insert, wherein the removable insert is configured to support a wafer so that an examination surface of the wafer lies within a focal range when the chuck is in a first configuration, wherein the removable insert is inserted into the chuck in the first configuration; and a first structure forming a recess that has a depth sufficient to support a photomask so that an examination surface of the photomask lies within the focal range when the chuck is in a second configuration, wherein the removable insert is not inserted into the chuck in the second configuration.

In accordance with embodiments, there are provided devices, systems and methods for capturing images of one or more substances in a scene, such as toilets using an illumination module and an imaging module included in a housing wherein the housing is configured to be inserted to devices such as toilet cleaning devices and receive the one or more substances. The imaging module comprising one or more high quality imagers configured to capture one or more images or an image video of the substances and a processor for analyzing the captured images to identify the characteristic and/or type of the substances.

A system for inspecting a coating on a substrate, the system including a platform that receives a sample including the substrate having the coating, and a light source that directs a plurality of electromagnetic pulses towards a scanning location on the coating, wherein the light source is oriented to direct the plurality of electromagnetic pulses at an oblique angle relative to a surface of the coating. A light detector receives electromagnetic pulses reflected from the sample, wherein a first portion of each electromagnetic pulse is reflected from the surface of the coating, and a second portion of each electromagnetic pulse is reflected from a surface of the substrate. An actuator is coupled to the platform and/or the light source, wherein the actuator moves the platform and the light source relative to each other such that the plurality of electromagnetic pulses are directable towards the scanning location from different rotational positions.

A system for inspecting a coating on a substrate, the system including a platform that receives a sample including the substrate having the coating, and a light source that directs a plurality of electromagnetic pulses towards a scanning location on the coating, wherein the light source is oriented to direct the plurality of electromagnetic pulses at an oblique angle relative to a surface of the coating. A light detector receives electromagnetic pulses reflected from the sample, wherein a first portion of each electromagnetic pulse is reflected from the surface of the coating, and a second portion of each electromagnetic pulse is reflected from a surface of the substrate. An actuator is coupled to the platform and/or the light source, wherein the actuator moves the platform and the light source relative to each other such that the plurality of electromagnetic pulses are directable towards the scanning location from different rotational positions.

Full wafer in-situ metrology chambers and methods of use are described. The metrology chambers include a substrate support and a sensor bar that are rotatable relative to each other. The sensor bar includes a plurality of sensors at different radii from a central axis.