A stress luminescence measurement method according to one aspect includes the steps of: placing a stress luminescent material on a surface of a sample; irradiating the stress luminescent material with excitation light; acquiring a first captured image by imaging the stress luminescent material during irradiation of the excitation light; applying a load to the sample; acquiring a stress luminescence image by imaging stress luminescence of the stress luminescent material; irradiating the stress luminescent material after removal of the load with the excitation light; acquiring a second captured image during irradiation of the excitation light by imaging the stress luminescent material in a state in which the load has been removed; and storing the first captured image and the second captured image in a memory in association with the stress luminescent image.

A manual inspection workstation, including abase and a body pivotally connected to one another and moveable between an upright position and compacted stowed position. A hood is connected to the body opposite the base and at least partially houses a light source. The manual inspection workstation includes a surface coating with physical properties that meet and exceed various FDA and U.S. Pharmacopeia guidelines and requirements. The light source includes a plurality of lighting options including intensity, color output, hue, and saturation. The light source further includes a communications module that allows multiple light sources to be wired together In a sequence or ring. The communications module further includes wireless connectivity to a remote computing device. The light source may further include an internal microprocessor and memory for instituting certain preconfigured light profile protocols.

A terahertz scanner for detecting irregularities, such as chemical or structural variations, in a sample and methods of use thereof are described. The described terahertz scanner and algorithms allow for direct, high-sensitivity, high-throughput, and non-invasive detection of irregularities that range from chemical contaminant to material defects in a variety of substrates and settings.

The present invention discloses a quantitative evaluation method for sensitivity of welding transverse cold cracks in a typical joint of a jacket, including following steps: S1, performing macroscopic analysis, metallographic analysis, fracture analysis and hardness analysis on cracks of a failed component to obtain main causes of cold crack failure; and S2, designing and processing a dedicated sample, and performing rigid restraint crack tests on the dedicated sample at different preheating temperatures to obtain a cracking/non-cracking critical restraint stress σ1cr of the sample. According to the method, a rigid restraint crack test is applied to evaluation of sensitivity of welding transverse cracks, so that external restraint conditions borne by a welding joint can be accurately simulated, a stress state of the welding joint in an actual working condition can be truly reflected, the overall evaluation precision is greatly improved, and a foundation is laid for accurately evaluating sensitivity of welding cold cracks in a tube joint. Furthermore, a welding technology (base material, welding material, welding process and restraint level) is designed to restrain cold cracks from cracking, and the method has important theoretical significance and engineering value.

A detecting device for detecting liquid or colloid, comprising: a light emitting device, configured to emit first light, wherein a first angle between a first emitting direction of the first light and a surface when the detecting device is located on the surface, wherein the first angle is larger than 0° and smaller than 90°; an optical sensor, configured to detect first optical data generated based on the first light; and a processing circuit, configured to determine if the liquid or the colloid exists in a predetermined range of the detecting device based on the first optical data. An automatic cleaner applying the detecting device is also disclosed.

The disclosure provides a structure diagnosis system and a structure diagnosis method. The structure diagnosis system includes: a lidar scanner scanning a structure to generate a point cloud data; an input interface receiving the point cloud data; and a processor receiving the point cloud data and generating a point cloud data set. The processor executes a surface degradation and geometry abnormal coupling diagnosis module to: marking a first point cloud range of a surface degradation area according to color space value of the point cloud data set; marking a second point cloud range of a geometry abnormal area according to coordinate value of the point cloud data set; when an abnormal area includes the first point cloud range and the second point cloud range at least partially overlapping each other, determining surface degradation or geometry abnormal occurring at the abnormal area and mark the abnormal area with a predetermined mode.

Apparatuses and methods are described for detecting inclusions in glass. The apparatuses and methods employ a laser that is configured to project a laser sheet at a first angle from one side of a glass sheet, and a camera configured to capture images from a second angle from another side of the glass sheet. The glass sheet is moved thorough the laser sheet while the camera captures images. One or more processing devices execute image processing algorithms to identify areas of the glass sheet containing inclusions based on the captured images. In some examples, the identified areas of the glass sheet are revisited to confirm they contain inclusions.

A method for inspecting a transparent workpiece comprises: directing light from an illumination source onto a plurality of defects formed in the transparent workpiece, wherein the plurality of defects extends in a defect direction, wherein the transparent workpiece comprises a first surface and a second surface; detecting a scattering image signal from light scattered by the plurality of defects using an imaging system, wherein an imaging axis of the imaging system extends at a non-zero imaging angle relative to the defect direction, wherein entireties of at least a subset of the plurality of defects are within a depth of field of the imaging system; and generating a three-dimensional image of at least one of the plurality of defects based on the scattering signal.

A laser soldering system and a method for monitoring a laser soldering process by means of a monitoring device of the laser soldering system, wherein a solder ball is dispensed onto a solderable surface of a substrate by means of a solder ball feeding device of the laser soldering system, wherein the solder ball is at least partially melted by means of a laser device of the laser soldering system, wherein, during the laser soldering process, a light signal is formed which is detected by means of an optical detection unit of the monitoring device, wherein the light signal is dispersed into a spectrum of the light signal by means of a spectroscope device of the monitoring device, wherein the spectrum is analyzed by means of a processing device of the monitoring device, and it is identified on the basis of a composition of the spectrum whether or not a burning of the substrate has occurred during the laser soldering process.

A laser soldering system and a method for monitoring a laser soldering process by means of a monitoring device of the laser soldering system, wherein a solder ball is dispensed onto a solderable surface of a substrate by means of a solder ball feeding device of the laser soldering system, wherein the solder ball is at least partially melted by means of a laser device of the laser soldering system, wherein, during the laser soldering process, a light signal is formed which is detected by means of an optical detection unit of the monitoring device, wherein the light signal is dispersed into a spectrum of the light signal by means of a spectroscope device of the monitoring device, wherein the spectrum is analyzed by means of a processing device of the monitoring device, and it is identified on the basis of a composition of the spectrum whether or not a burning of the substrate has occurred during the laser soldering process.