A product inspection system includes an image acquisition system having a camera generating an inspection image of a product arranged between a plurality of mirrors. The inspection image has a plurality of sub images of different sides of the product. The inspection system has a calibration member with a plurality of correction patterns on different sides; the camera receives light from the calibration member reflected by the mirrors to generate a calibration image of the calibration member. A computer of the product inspection system receives the inspection image and the calibration image and determines a relative mirror position relationship between the mirrors. The computer forms a single spliced image of the product.

A display inspection system for inspecting a light beam emitted from a panel with pixels positioned at several focal planes is provided. The display inspection system includes a focus tunable lens adjustable in a focal distance for focusing at the panel, a first sensing unit for receiving the light beam, a reduced aberration optical system arranged between the focus tunable lens and the first sensing unit for focusing at the first sensing unit, and one or more optical elements placed within a back focal length of the reduced aberration optical system. The reduced aberration optical system comprises a first serial cascade lens group of a first aplanatic lens and a first doublet lens for correcting an optical aberration. The first aplanatic lens and the first doublet lens are co-configured that the back focal length is extended in a manner that the light beam is incident to the first sensing unit.

A pattern inspection apparatus includes an illumination optical system to illuminate an inspection substrate on which a pattern is formed, an offset calculation circuit to calculate an offset amount which depends on an image accumulation time of each of a plurality of photo sensor elements arrayed two-dimensionally, a time delay integration (TDI) sensor to include the plurality of photo sensor elements, to acquire an image of the inspection substrate by receiving a transmitted light or a reflected light from the inspection substrate by the plurality of photo sensor elements, to correct, using the offset amount, a pixel value of optical image data of an acquired image, and to output the optical image data having been corrected, and a comparison circuit to compare an optical image formed by the optical image data output from the TDI sensor with a reference image.

Apparatuses systems and methods for gas emission rate detection sensitivity and probability of detection (PoD) based on emission rate. A measurement system may be characterized by its ability to detect gas plumes as a function of the emission rate of those plumes. The measurement system may be characterized based on a generalized PoD function which expresses PoD relative to emission rate as a function of gas concentration noise and gas flow speed. In an example application, the PoD may be used to estimate a cumulative distribution of gas plumes which were not detected based on a cumulative distribution of measured gas plumes. In another example application, the PoD may be used to refine an estimate for a measured emission rate.

The invention relates to a method for the manufacture of a prophylactic article, especially of a glove, from a (carboxylated) diene rubber, according to which a layer of a (carboxylated) diene latex is applied on a former and the (carboxylated) diene latex is cross-linked with a cross-linking agent, which is immobilized on inorganic and/or organic particles with formation of modified particles, and the modified particles are added to the (carboxylated) diene latex.

Multilayered product structures are formed on substrates by a combination of patterning steps, physical processing steps and chemical processing steps. An inspection apparatus illuminates a plurality of target structures and captures pupil images representing the angular distribution of radiation scattered by each target structure. The target structures have the same design but are formed at different locations on a substrate and/or on different substrates. Based on a comparison of the images the inspection apparatus infers the presence of process-induced stack variations between the different locations. In one application, the inspection apparatus separately measures overlay performance of the manufacturing process based on dark-field images, combined with previously determined calibration information. The calibration is adjusted for each target, depending on the stack variations inferred from the pupil images.

A system for improving drill bit performance, having processors and memory storing instructions to obtain a wear report for a drill bit, wherein the wear report includes wear characteristics of the drill bit and drill operating parameters under which the drill bit was used; compare the wear characteristics of the drill bit to a threshold for acceptable drill bit wear; and adjust drill operating parameters based on the wear characteristics of the drill bit. The instructions to obtain the wear report for the drill bit include instructions to analyze images of the drill bit to identify wear characteristics; identify wear patterns based on the wear characteristics of the drill bit; identify probable drilling conditions based on the wear patterns; and generate the wear report for the drill bit based on the images of the drill bit, the wear characteristics of the drill bit, and the probable drilling conditions.

Disclosed herein are systems and methods for synthesizing a diamond using a diamond synthesis machine. A processor receives a plurality of images of a diamond during synthesis within a diamond synthesis machine, each of the plurality of images captured within a time period. The processor executes a diamond state prediction machine learning model using the plurality of images to obtain a predicted data object, the predicted data object indicating a predicted state of the diamond within the diamond synthesis machine at a time subsequent to the time period. The processor detects a predicted defect, a number of defects, defect types, and/or sub-features of such defects and/or other characteristics (e.g., a predicted shape, size, and/or other properties of predicted contours for the diamond and/or pocket holder) of the predicted state of the diamond. The processor adjusts operation of the diamond synthesis machine.

An image acquisition method includes storing a coefficient of a relational expression between a parameter corresponding to a light quantity incident on an imaging sensor including a photo sensor element and an output value of the imaging sensor in the case of the light incident on the imaging sensor which employs a reference image accumulation time, inputting a desired image accumulation time, and calculating a parameter for obtaining a desired output value of the imaging sensor by using a corrected relational expression obtained by correcting using an output value of the imaging sensor employing the desired image accumulation time in the case of the incident light quantity being zero, adjusting the light quantity incident on the imaging sensor to be a calculated parameter, and acquiring a target image by the imaging sensor on which an adjusted light quantity is incident, and outputting data of the acquired image.

A continuous dust accumulation monitoring system, device and method monitors and measures dust accumulation via an enclosure and a machine vision subsystem which can include a digital camera. A dirty optics detection subsystem monitors optical clarity and can invoke a cleaning assembly to help maintain clarity of optics for monitoring and measuring dust accumulation.